公开(公告)号：US20070155051A1

公开(公告)日：2007-07-05

申请号：US11321134

申请日：2005-12-29

Applicant: Chun-Ming Wang ,  Jeffrey Lan ,  Teruo Sasagawa

Inventor： Chun-Ming Wang ,  Jeffrey Lan ,  Teruo Sasagawa

IPC: H01L21/00

CPC classification number: B81C1/00047 ,  B81B2201/047 ,  B81C2201/0108 ,  B81C2201/0111 ,  G02B26/001

Abstract: MEMS devices (such as interferometric modulators) may be fabricated using a sacrificial layer that contains a heat vaporizable polymer to form a gap between a moveable layer and a substrate. One embodiment provides a method of making a MEMS device that includes depositing a polymer layer over a substrate, forming an electrically conductive layer over the polymer layer, and vaporizing at least a portion of the polymer layer to form a cavity between the substrate and the electrically conductive layer. Another embodiment provides a method for making an interferometric modulator that includes providing a substrate, depositing a first electrically conductive material over at least a portion of the substrate, depositing a sacrificial material over at least a portion of the first electrically conductive material, depositing an insulator over the substrate and adjacent to the sacrificial material to form a support structure, and depositing a second electrically conductive material over at least a portion of the sacrificial material, the sacrificial material being removable by heat-vaporization to thereby form a cavity between the first electrically conductive layer and the second electrically conductive layer.

Abstract translation: 可以使用包含热可汽化聚合物以在可移动层和基底之间形成间隙的牺牲层来制造MEMS器件（例如干涉式调制器）。 一个实施例提供了一种制造MEMS器件的方法，该MEMS器件包括在衬底上沉积聚合物层，在聚合物层上形成导电层，并蒸发聚合物层的至少一部分以在衬底和电 导电层。 另一个实施例提供了制造干涉式调制器的方法，该方法包括提供衬底，在衬底的至少一部分上沉积第一导电材料，在第一导电材料的至少一部分上沉积牺牲材料，沉积绝缘体 在所述衬底上并且邻近所述牺牲材料以形成支撑结构，以及在所述牺牲材料的至少一部分上沉积第二导电材料，所述牺牲材料可通过热蒸发而被去除，从而在所述第一电 导电层和第二导电层。

公开(公告)号：US20070013266A1

公开(公告)日：2007-01-18

申请号：US11212611

申请日：2005-08-29

Applicant: Ming-Wei Chang ,  Da-Chen Pang ,  Chao-Sheng Tseng

Inventor： Ming-Wei Chang ,  Da-Chen Pang ,  Chao-Sheng Tseng

IPC: H01L41/00

CPC classification number: B81B7/0012 ,  B06B1/0292 ,  B81C2201/0108 ,  Y10T29/435 ,  Y10T29/49005 ,  Y10T29/4908 ,  Y10T29/49172 ,  Y10T29/49194

Abstract: A method of fabricating a polymer-based capacitive ultrasonic transducer, which comprises the steps of: (a) providing a substrate; (b) forming a first conductor on the substrate; (c) coating a sacrificial layer on the substrate while covering the first conductor by the same; (d) etching the sacrificial layer for forming an island while maintaining the island to contact with the first conductor; (e) coating a first polymer-based material on the substrate while covering the island by the same; (f) forming a second conductor on the first polymer-based material; (g) forming a via hole on the first polymer-based material while enabling the via hole to be channeled to the island; and (h) utilizing the via hole to etch and remove the island for forming a cavity.

Abstract translation: 一种制造基于聚合物的电容式超声换能器的方法，包括以下步骤：（a）提供基底; （b）在所述基板上形成第一导体; （c）在衬底上涂覆牺牲层，同时覆盖第一导体; （d）蚀刻用于形成岛的牺牲层，同时保持岛与第一导体接触; （e）在衬底上涂覆第一聚合物基材料同时覆盖该岛; （f）在第一聚合物基材料上形成第二导体; （g）在第一聚合物基材料上形成通孔，同时使通孔能够引导到岛上; 和（h）利用通孔蚀刻并去除用于形成空腔的岛。

公开(公告)号：US06994950B2

公开(公告)日：2006-02-07

申请号：US10391122

申请日：2003-03-18

Applicant: Yu-Chong Tai ,  Qing He

Inventor： Yu-Chong Tai ,  Qing He

IPC: G03F7/00

CPC classification number: B81C1/00333 ,  B01L3/502707 ,  B01L2200/0668 ,  B01L2200/12 ,  B01L2300/0896 ,  B81C1/00182 ,  B81C1/00476 ,  B81C2201/0108 ,  B82Y30/00 ,  G01N30/6095 ,  G01N2030/562 ,  G01N2030/6056

Abstract: MEMs devices are integrally fabricated with included micro or nanoparticles by providing a mixture of a sacrificial material and a multiplicity of particles, disposing the mixture onto a substrate, fabricating a MEMs structure on the substrate including at least part of the mixture, so that at least some of the mixture is enclosed in the MEMs structure, removing the sacrificial material, and leaving at least some of the multiplicity of particles substantially free and enclosed in the MEMs structure. The step of fabricating a MEMs structure is quite general and is contemplated as including one or a multiplicity of additional steps for creating some type of structure in which the particles, which may be microbeads or nanobeads, are included. A wide variety of useful applications for MEMs integrated with micro or nanoparticles are available.

公开(公告)号：US20050170544A1

公开(公告)日：2005-08-04

申请号：US10769346

申请日：2004-01-30

Applicant: M.C. Chang ,  H.S. Wu ,  Tsang-Mu Lai

Inventor： M.C. Chang ,  H.S. Wu ,  Tsang-Mu Lai

IPC: B81B3/00 ,  H01L21/00

CPC classification number: B81C99/0085 ,  B81C2201/0108 ,  B81C2201/0133 ,  B81C2201/0152

Abstract: A method for forming a free standing micro-structural member including providing a substrate; blanket depositing a first sacrificial resist layer over the substrate; exposing and developing the first sacrificial resist layer to form a first resist portion; subjecting the first resist portion to at least a hard bake process to form the first resist portion having a predetermined first smaller volume compared to a desired final resist portion volume; blanket depositing at least a second sacrificial resist layer followed by exposure, development and the at least a hard bake process to form the final resist portion volume; and, depositing at least one structural material layer over the final resist portion.

Abstract translation: 一种形成独立式微结构构件的方法，包括提供基底; 在衬底上铺设第一牺牲抗蚀剂层; 曝光和显影第一牺牲抗蚀剂层以形成第一抗蚀剂部分; 使所述第一抗蚀剂部分至少进行硬烘烤处理，以形成具有预定的第一较小体积的第一抗蚀剂部分，与期望的最终抗蚀剂部分体积相比; 毯毯沉积至少第二牺牲抗蚀剂层，随后曝光，显影和至少硬烘烤工艺以形成最终的抗蚀剂部分体积; 并且在最终抗蚀剂部分上沉积至少一个结构材料层。

公开(公告)号：US06917086B2

公开(公告)日：2005-07-12

申请号：US10817270

申请日：2004-04-02

Applicant: Shawn Jay Cunningham ,  Svetlana Tatic-Lucic

Inventor： Shawn Jay Cunningham ,  Svetlana Tatic-Lucic

IPC: B81B3/00 ,  B81B7/00 ,  H01H1/04 ,  H01H1/50 ,  H01H59/00 ,  H01H61/04 ,  H01L21/302 ,  H01L23/373 ,  H01L23/522 ,  H01L27/12 ,  H01L29/86 ,  H02N1/00 ,  H02N10/00 ,  H01L29/82 ,  H01L21/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: Trilayered Beam MEMS Device and Related Methods. According to one embodiment, a method for fabricating a trilayered beam is provided. The method can include depositing a sacrificial layer on a substrate and depositing a first conductive layer on the sacrificial layer. The method can also include forming a first conductive microstructure by removing a portion of the first conductive layer. Furthermore, the method can include depositing a structural layer on the first conductive microstructure, the sacrificial layer, and the substrate and forming a via through the structural layer to the first conductive microstructure. Still furthermore, the method can include the following: depositing a second conductive layer on the structural layer and in the via; forming a second conductive microstructure by removing a portion of the second conductive layer, wherein the second conductive microstructure electrically communicates with the first conductive microstructure through the via; and removing a sufficient amount of the sacrificial layer so as to separate the first conductive microstructure from the substrate, wherein the structural layer is supported by the substrate at a first end and is freely suspended above the substrate at an opposing second end.

Abstract translation: 三层梁MEMS器件及相关方法。 根据一个实施例，提供一种制造三层梁的方法。 该方法可以包括在衬底上沉积牺牲层并在牺牲层上沉积第一导电层。 该方法还可以包括通过去除第一导电层的一部分来形成第一导电微结构。 此外，该方法可以包括在第一导电微结构，牺牲层和衬底上沉积结构层，并且通过结构层将通孔形成到第一导电微结构。 此外，该方法可以包括以下：在结构层和通孔中沉积第二导电层; 通过去除所述第二导电层的一部分来形成第二导电微结构，其中所述第二导电微结构通过所述通孔与所述第一导电微结构电连通; 以及去除足够量的牺牲层以便将第一导电微结构与衬底分开，其中结构层在第一端由衬底支撑并且在相对的第二端处自由地悬挂在衬底上方。

公开(公告)号：US06882264B2

公开(公告)日：2005-04-19

申请号：US10290807

申请日：2002-11-08

Applicant: Shawn Jay Cunningham

Inventor： Shawn Jay Cunningham

IPC: B81B3/00 ,  B81B7/00 ,  H01H1/04 ,  H01H1/50 ,  H01H59/00 ,  H01H61/04 ,  H01L21/302 ,  H01L23/373 ,  H01L23/522 ,  H01L27/12 ,  H01L29/86 ,  H02N1/00 ,  H02N10/00 ,  H01H37/52 ,  H02N2/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: Electrothermal Self-Latching MEMS Switch and Method. According to one embodiment, a microscale switch having a movable microcomponent is provided and includes a substrate having a stationary contact. The switch can also include a structural layer having a movable contact positioned for contacting the stationary contact when the structural layer moves toward the substrate. An electrothermal latch attached to the structural layer and having electrical communication with the movable contact to provide current flow between the electrothermal latch and the stationary contact when the movable contact contacts the stationary contact for maintaining the movable contact in contact with the stationary contact.

Abstract translation: 电热自锁式MEMS开关及方法。 根据一个实施例，提供具有可移动微组件的微型开关，并且包括具有固定触点的基板。 该开关还可以包括具有可移动触点的结构层，该结构层定位成当结构层向衬底移动时与固定触点接触。 一个电热锁定件，其连接到结构层并且当可动触点接触固定触点以便使可动触点与固定触点接触时，与可动触头电连通以提供电热闩和固定触点之间的电流。

公开(公告)号：US06780001B2

公开(公告)日：2004-08-24

申请号：US09795772

申请日：2001-02-27

Applicant: Benjamin N. Eldridge ,  Stuart W. Wenzel

Inventor： Benjamin N. Eldridge ,  Stuart W. Wenzel

IPC: B29C4302

CPC classification number: G01R3/00 ,  B33Y80/00 ,  B81B2203/0118 ,  B81C1/00611 ,  B81C2201/0108 ,  B81C2201/0125 ,  G01R1/0483 ,  G01R1/06711 ,  G01R1/06716 ,  G01R1/06727 ,  G01R1/06733 ,  G01R1/07342 ,  H01L23/4822 ,  H01L24/72 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01057 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3025 ,  H01R12/52 ,  H01R13/24 ,  H01R13/2407 ,  H05K3/4092 ,  H05K7/1069 ,  H01L2924/00

Abstract: A forming tool with one or more embossing tooth, and preferably, a plurality of such embossing teeth, arranged on a substantially planar substrate, is disclosed. Each embossing tooth is configured for forming a sacrificial layer to provide a contoured surface for forming a microelectronic spring structure. Each embossing tooth has a protruding area corresponding to a base of a microelectronic spring, and a sloped portion corresponding to a beam contour of a microelectronic spring. Numerous methods for making a forming tool are also disclosed. The methods include a material removal method, a molding method, a repetitive-stamping method, tang-bending methods, and segment-assembly methods.

Abstract translation: 公开了一种具有一个或多个压花齿的成形工具，优选地，布置在基本平坦的基底上的多个这样的压花齿。 每个压花齿构造成用于形成牺牲层以提供用于形成微电子弹簧结构的轮廓表面。 每个压花齿具有对应于微电子弹簧的基部的突出区域和对应于微电子弹簧的光束轮廓的倾斜部分。 还公开了用于制造成形工具的许多方法。 这些方法包括材料去除方法，成型方法，重复冲压方法，弯曲方法和段组装方法。

公开(公告)号：US20040012298A1

公开(公告)日：2004-01-22

申请号：US10291125

申请日：2002-11-08

Applicant: Coventor, Inc.

Inventor： Shawn Jay Cunningham ,  Dana Richard DeReus ,  Subham Sett ,  John Richard Gilbert

IPC: H02N010/00

CPC classification number: B81B3/0024 ,  B81B3/0051 ,  B81B2201/014 ,  B81B2201/018 ,  B81B2203/0118 ,  B81B2203/04 ,  B81B2207/07 ,  B81C1/0015 ,  B81C2201/0107 ,  B81C2201/0108 ,  B81C2201/0109 ,  H01H1/04 ,  H01H1/504 ,  H01H59/0009 ,  H01H61/04 ,  H01H2001/0042 ,  H01H2001/0063 ,  H01H2001/0089 ,  H01H2059/0072 ,  H01H2061/006 ,  H01L23/3735 ,  H01L23/522 ,  H01L27/1203 ,  H01L2924/0002 ,  H01L2924/09701 ,  H02N1/006 ,  H02N10/00 ,  Y10T29/49222 ,  H01L2924/00

Abstract: MEMS Device having Electrothermal Actuation and Release and Method for Fabricating. According to one embodiment, a microscale switch is provided and can include a substrate and a stationary electrode and stationary contact formed on the substrate. The switch can further include a movable microcomponent suspended above the substrate. The microcomponent can include a structural layer including at least one end fixed with respect to the substrate. The microcomponent can further include a movable electrode spaced from the stationary electrode and a movable contact spaced from the stationary electrode. The microcomponent can include an electrothermal component attached to the structural layer and operable to produce heating for generating force for moving the structural layer.

Abstract translation: 具有电热驱动和释放的MEMS器件和制造方法。 根据一个实施例，提供微型开关，并且可以包括形成在基板上的基板和固定电极和固定触点。 开关还可以包括悬浮在基板上方的可移动的微型部件。 微组件可以包括包括相对于基底固定的至少一个端部的结构层。 微型部件还可以包括与固定电极间隔开的可动电极和与固定电极间隔开的可动触头。 微组件可以包括附接到结构层的电热组件，并且可操作以产生用于产生用于移动结构层的力的加热。

公开(公告)号：US20030228411A1

公开(公告)日：2003-12-11

申请号：US10391122

申请日：2003-03-18

Inventor： Yu-Chong Tai ,  Qing He

IPC: B05D005/12 ,  H01L021/00

CPC classification number: B81C1/00333 ,  B01L3/502707 ,  B01L2200/0668 ,  B01L2200/12 ,  B01L2300/0896 ,  B81C1/00182 ,  B81C1/00476 ,  B81C2201/0108 ,  B82Y30/00 ,  G01N30/6095 ,  G01N2030/562 ,  G01N2030/6056

Abstract: MEMs devices are integrally fabricated with included micro or nanoparticles by providing a mixture of a sacrificial material and a multiplicity of particles, disposing the mixture onto a substrate, fabricating a MEMs structure on the substrate including at least part of the mixture, so that at least some of the mixture is enclosed in the MEMs structure, removing the sacrificial material, and leaving at least some of the multiplicity of particles substantially free and enclosed in the MEMs structure. The step of fabricating a MEMs structure is quite general and is contemplated as including one or a multiplicity of additional steps for creating some type of structure in which the particles, which may be microbeads or nanobeads, are included. A wide variety of useful applications for MEMs integrated with micro or nanoparticles are available.

Abstract translation: 通过提供牺牲材料和多个颗粒的混合物将MEM装置与包含的微型或纳米颗粒整体制造，将混合物设置在衬底上，在包括至少部分混合物的衬底上制造MEM结构，使得至少 一些混合物被包封在MEMs结构中，去除牺牲材料，并且使至少一些多个颗粒基本上自由并且封闭在MEM结构中。 制造MEMs结构的步骤是相当普遍的，并且被设想为包括用于产生某些类型的结构的一个或多个附加步骤，其中可以包括可以是微珠或纳米珠的颗粒。 可以使用与微型或纳米颗粒集成的MEM的各种有用的应用。

公开(公告)号：US06583920B2

公开(公告)日：2003-06-24

申请号：US09995956

申请日：2001-11-29

Applicant: Yong-seop Yoon ,  Hyung Choi

Inventor： Yong-seop Yoon ,  Hyung Choi

IPC: G02B2600

CPC classification number: B81C1/00142 ,  B81B2201/042 ,  B81C2201/0108

Abstract: A method of manufacturing a micromirror actuator includes forming a trench on a substrate by etching, laminating a film-type organic layer on the substrate to cover but not fill the trench so that the trench is maintained hollow, and depositing and patterning a metal layer on the film-type organic layer and removing the film-type organic layer. According to the method of manufacturing a micromirror actuator, a micromirror can be easily planarized by laminating the film-type organic layer on the substrate including the trench, which reduces the cost of manufacturing the micromirror actuator and increases a reflectivity of the micromirror actuator by increasing the flatness level of the micromirror so as to enhance an optical transmission efficiency.