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    Laminated nozzle with thick plate
    312.
    发明授权
    Laminated nozzle with thick plate 有权
    层压喷嘴厚板

    公开(公告)号：US09561654B2

    公开(公告)日：2017-02-07

    申请号：US14881369

    申请日：2015-10-13

    Applicant: Illinois Tool Works Inc.

    Inventor： Mel Steven Lessley ,  Edward W. Bolyard, Jr.

    IPC: B41J2/14 ,  B05B7/08 ,  B05C5/02 ,  B05C9/06 ,  B05C11/10 ,  B05B7/04 ,  B05B7/12

    CPC classification number: B41J2/1433 ,  B05B7/0408 ,  B05B7/08 ,  B05B7/0807 ,  B05B7/0876 ,  B05B7/0884 ,  B05B7/12 ,  B05C5/0254 ,  B05C5/027 ,  B05C9/06 ,  B05C11/1036

    Abstract: A laminated nozzle assembly is provided. The laminated nozzle includes a first end plate having a first fluid inlet and a second fluid inlet, a second end plate, a plurality of nozzle plates positioned and clamped between the first end plate and the second end plate, a first fluid conduit in fluid communication with the first fluid inlet formed in one or more of the nozzle plates, a second fluid conduit in fluid communication with the second fluid inlet formed in one or more of the nozzle plates, a first orifice in fluid communication with the first fluid conduit formed in one of the nozzle plates, and a second orifice in fluid communication with the second fluid conduit formed in the same nozzle plate as the first orifice. The laminated nozzle assembly minimizes the number of nozzle plates and includes no more than eight, and preferably no more than five nozzle plates.

    Abstract translation: 提供层压喷嘴组件。 层压喷嘴包括具有第一流体入口和第二流体入口的第一端板，第二端板，定位并夹紧在第一端板和第二端板之间的多个喷嘴板，流体连通的第一流体导管 其中第一流体入口形成在一个或多个喷嘴板中，与形成在一个或多个喷嘴板中的第二流体入口流体连通的第二流体导管，与形成在第一流体导管中的第一流体导管流体连通的第一孔口 一个喷嘴板，以及与形成在与第一孔口相同的喷嘴板中的第二流体管道流体连通的第二孔口。 层压喷嘴组件使喷嘴板的数量最小化，并且包括不超过八个，优选不超过五个喷嘴板。

    Digital Processing Equipment
    314.
    发明申请
    Digital Processing Equipment 有权
    数字处理设备

    公开(公告)号：US20160358830A1

    公开(公告)日：2016-12-08

    申请号：US14730404

    申请日：2015-06-04

    Applicant: LENOVO Enterprise Solutions (Singapore) PTE. LTD.

    Inventor： John Dangler ,  Brian L. Carlson ,  Roger Krabbenhoft ,  Kevin A. Splittstoesser ,  Jeffrey A. Taylor

    IPC: H01L21/66 ,  C23C26/00 ,  B05B13/02 ,  B05B12/12 ,  B05B15/04 ,  B05B12/04

    CPC classification number: B05B12/122 ,  B05B12/04 ,  B05B12/1409 ,  B05B13/0221 ,  B05B14/00 ,  B05C11/1036 ,  H01L21/6708 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/6776

    Abstract: An apparatus includes a spray module with at least one column of spray nozzles. Each spray nozzle is configured to deliver a processing substance on a semiconductor substrate during a process for semiconductor manufacturing as the semiconductor substrate moves past the spray module. The at least one column of spray nozzles is arranged with respect to a direction of travel of the semiconductor substrate so the semiconductor substrate passes the spray nozzles. A location module identifies a location of the semiconductor substrate with respect to the spray module. A spray pattern module determines a spray pattern of where a processing substance is to be delivered to the semiconductor substrate and a nozzle control module actuates each spray nozzle independently based on the spray pattern and a location of the semiconductor identified by the location module.

    Abstract translation: 一种装置包括具有至少一列喷嘴的喷射模块。 每个喷嘴被配置为在半导体衬底移动经过喷射模块的半导体制造过程期间在半导体衬底上传送处理物质。 至少一列喷嘴相对于半导体衬底的行进方向布置，使得半导体衬底通过喷嘴。 位置模块识别半导体衬底相对于喷射模块的位置。 喷雾模式模块确定将处理物质输送到半导体衬底的喷射模式，并且喷嘴控制模块基于喷射模式和由位置模块识别的半导体的位置独立地致动每个喷嘴。

    RESIN DISTRIBUTOR, RESERVOIR BAG TO BE USED THEREWITH, VEHICLE PROVIDED WITH SUCH A SYSTEM, KIT FOR ASSEMBLING THE SAME, AND METHODS OF ASSEMBLING AND OF OPERATING ASSOCIATED THERETO
    317.
    发明申请
    RESIN DISTRIBUTOR, RESERVOIR BAG TO BE USED THEREWITH, VEHICLE PROVIDED WITH SUCH A SYSTEM, KIT FOR ASSEMBLING THE SAME, AND METHODS OF ASSEMBLING AND OF OPERATING ASSOCIATED THERETO 审中-公开
    树脂分配器，要使用的储存袋，具有这样一个系统的车辆，组装它的工具包，以及组装和操作相关的方法

    公开(公告)号：US20160067735A1

    公开(公告)日：2016-03-10

    申请号：US14923338

    申请日：2015-10-26

    Applicant: KIMCO PTE INC.

    Inventor： Philippe Bourbeau

    IPC: B05C11/10 ,  B05C5/02 ,  B05C5/00 ,  F16K15/00 ,  B67D7/00

    CPC classification number: B05C11/1036 ,  B05B7/0018 ,  B05B7/26 ,  B05C5/001 ,  B05C5/0225 ,  B29B7/7447 ,  B29B7/7457 ,  B29B7/801

    Abstract: A system (1) for distributing resin (3), the system (1) including at least one supply of resin (3a,3b), at least one conduit (5a,5b) operatively connectable to a corresponding supply of resin (3a,3b), and at least one pump (7a,7b) operatively connectable to each conduit (5a,5b) for pumping resin (3) from the corresponding supply of resin (3a,3b). The system (1) also includes a driving assembly (9) operatively connectable to each pump (7a,7b) for driving the same, the driving assembly (9) including a transmission assembly (11) being configured specifically depending on the nature of resin (3) to be pumped through each conduit (5a,5b). The system (1) also includes a discharging assembly (13) operatively connectable to each conduit (5a,5b) for discharging resin (3) out from the discharging assembly (13), the discharging assembly (13) being also operatively connectable to the driving assembly (9) for selectively and adjustably controlling operating parameters of each pump (7a,7b). Also described is a resin reservoir bag to be used for with the resin distributing system (1).

    Abstract translation: 一种用于分配树脂（3）的系统（1），所述系统（1）包括至少一个树脂（3a，3b），至少一个可操作地连接到相应的树脂供应源（3a，3b）的导管（5a，5b） 3b）和至少一个可操作地连接到每个导管（5a，5b）的泵（7a，7b），用于从相应的树脂供应源（3a，3b）泵送树脂（3）。 系统（1）还包括可操作地连接到每个泵（7a，7b）以用于驱动组件的驱动组件（9），所述驱动组件（9）包括根据树脂的性质特别地构造的变速器组件 （3）被泵送通过每个导管（5a，5b）。 系统（1）还包括可操作地连接到用于将树脂（3）从排出组件（13）排出的每个导管（5a，5b）的排放组件（13），排放组件（13）也可操作地连接到 驱动组件（9），用于选择性地和可调节地控制每个泵（7a，7b）的操作参数。 还描述了用于树脂分配系统（1）的树脂储存袋。

    SUBSTRATE PROCESSING APPARATUS
    318.
    发明申请
    SUBSTRATE PROCESSING APPARATUS 有权
    基板加工设备

    公开(公告)号：US20150059645A1

    公开(公告)日：2015-03-05

    申请号：US14535916

    申请日：2014-11-07

    Applicant: SCREEN Holdings Co., Ltd.

    Inventor： Masahiro MIYAGI ,  Koji HASHIMOTO ,  Toru ENDO

    IPC: B05C11/08 ,  B05C5/02 ,  B05C11/10

    CPC classification number: B05C11/08 ,  B05B1/00 ,  B05C5/0225 ,  B05C11/10 ,  B05C11/1036 ,  B05C11/1039 ,  B05C13/00 ,  B05D1/02 ,  H01L21/67051

    Abstract: A substrate processing apparatus comprising a substrate holding rotating mechanism, a process liquid supply mechanism having a nozzle for dispensing a process liquid toward a principal face of the substrate, a processing liquid reservoir for holding sufficient process liquid to form a liquid film covering the whole principal face of the substrate, a liquid film forming unit for forming the liquid film by supplying the process liquid onto the principal face of the substrate in a single burst, and a control unit for controlling the liquid film forming unit and the process liquid supply mechanism such that the process liquid is dispensed from the process liquid nozzle toward the principal face of the substrate after formation of the liquid film covering the whole area of the principal face of the substrate by the liquid film forming unit.

    Abstract translation: 一种基板处理装置，包括基板保持旋转机构，具有用于向基板的主面分配处理液的喷嘴的处理液供给机构，用于保持足够的处理液以形成覆盖整个主体的液膜的处理液储存器 基板的表面，用于通过将处理液体单次供给到基板的主面上来形成液膜的液膜形成单元，以及用于控制液膜形成单元和处理液供给机构的控制单元， 在通过液膜形成单元形成覆盖基板的主面的整个区域的液膜之后，处理液体从处理液喷嘴分配到基板的主面。

    Substrate processing apparatus and substrate processing method
    319.
    发明授权
    Substrate processing apparatus and substrate processing method 有权
    基板加工装置及基板处理方法

    公开(公告)号：US08883030B2

    公开(公告)日：2014-11-11

    申请号：US13596903

    申请日：2012-08-28

    Applicant: Masahiro Miyagi ,  Koji Hashimoto ,  Toru Endo

    Inventor： Masahiro Miyagi ,  Koji Hashimoto ,  Toru Endo

    IPC: B44C1/22 ,  B05B1/00 ,  B05D1/02 ,  H01L21/67 ,  B05C13/00 ,  B05C11/10

    CPC classification number: B05C11/08 ,  B05B1/00 ,  B05C5/0225 ,  B05C11/10 ,  B05C11/1036 ,  B05C11/1039 ,  B05C13/00 ,  B05D1/02 ,  H01L21/67051

    Abstract: A substrate processing apparatus comprising a substrate holding rotating mechanism, a process liquid supply mechanism having a nozzle for dispensing a process liquid toward a principal face of the substrate, a processing liquid reservoir for holding sufficient process liquid to form a liquid film covering the whole principal face of the substrate, a liquid film forming unit for forming the liquid film by supplying the process liquid onto the principal face of the substrate in a single burst, and a control unit for controlling the liquid film forming unit and the process liquid supply mechanism such that the process liquid is dispensed from the process liquid nozzle toward the principal face of the substrate after formation of the liquid film covering the whole area of the principal face of the substrate by the liquid film forming unit.

    Abstract translation: 一种基板处理装置，包括基板保持旋转机构，具有用于向基板的主面分配处理液的喷嘴的处理液供给机构，用于保持足够的处理液以形成覆盖整个主体的液膜的处理液储存器 基板的表面，用于通过将处理液体单次供给到基板的主面上来形成液膜的液膜形成单元，以及用于控制液膜形成单元和处理液供给机构的控制单元， 在通过液膜形成单元形成覆盖基板的主面的整个区域的液膜之后，处理液体从处理液喷嘴分配到基板的主面。

    Method for dispensing foam onto substrates of large width
    320.
    发明授权
    Method for dispensing foam onto substrates of large width 失效
    将泡沫分配到大宽度基材上的方法

    公开(公告)号：US08512805B2

    公开(公告)日：2013-08-20

    申请号：US13416449

    申请日：2012-03-09

    Applicant: Ronald Burger ,  Frank Jones ,  Dirk Pannhausen

    Inventor： Ronald Burger ,  Frank Jones ,  Dirk Pannhausen

    IPC: B05D5/00

    CPC classification number: B29C44/462 ,  B05C5/0254 ,  B05C5/027 ,  B05C11/1013 ,  B05C11/1036 ,  B29C44/348 ,  B29C44/468

    Abstract: A method for dispensing a foamed material onto a substrate surface, including: generating a relative movement between a substrate surface and a material dispensing apparatus exit opening, mixing at least two material components in a mixing device, generating a pressure differential between the mixing device and a dispensing region, conveying the dispensing material from the mixing device to the exit opening, and discharging the dispensing material from the exit opening onto the substrate surface.

    Abstract translation: 一种用于将泡沫材料分配到基材表面上的方法，包括：在基材表面和材料分配装置出口之间产生相对运动，在混合装置中混合至少两种材料组分，在混合装置和 分配区域，将分配材料从混合装置输送到出口，并且将分配材料从出口开口排出到基板表面上。

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