公开(公告)号：KR1020040047593A

公开(公告)日：2004-06-05

申请号：KR1020030080963

申请日：2003-11-17

Applicant: 인터내셔널 비지네스 머신즈 코포레이션

Inventor： 보즈소퍼렌스엠 ,  엠마필립지

IPC: H05K1/14

CPC classification number: G02B6/43 ,  G02B6/12004 ,  G02B6/124 ,  G02B6/3885 ,  G02B6/4246 ,  G02B6/4292 ,  H01L2224/16225 ,  H01L2224/73204 ,  H01L2924/15311 ,  H05K1/0274 ,  H05K1/14 ,  H05K2201/044

Abstract: PURPOSE: An optically connectable circuit board, an optical component, and an optical guide structure are provided to allow for channel losses and eliminate the necessity of accurate mechanical match. CONSTITUTION: An optically connectable circuit board comprises a printed circuit card having a plurality of component attachment positions; and a plurality of electronic components mounted on the component attachment positions, respectively. At least one of the electronic components includes a plurality of optical transmitters/receivers(405). One of at least one of the electronic components is an optical connector to the printed circuit card.

Abstract translation: 目的：提供可光学连接的电路板，光学部件和光导结构，以允许通道损失，并消除精确机械匹配的必要性。 构成：可光学连接的电路板包括具有多个部件附接位置的印刷电路卡; 以及分别安装在部件安装位置上的多个电子部件。 至少一个电子部件包括多个光发射器/接收器（405）。 至少一个电子部件中的一个是到印刷电路卡的光学连接器。

公开(公告)号：KR1020030056464A

公开(公告)日：2003-07-04

申请号：KR1020010086679

申请日：2001-12-28

Applicant: 에스케이하이닉스 주식회사

Inventor： 장지은 ,  이재진

IPC: G06F13/00

CPC classification number: H05K1/0246 ,  G11C7/10 ,  G11C11/4093 ,  H03K19/0175 ,  H05K1/0286 ,  H05K1/14 ,  H05K1/141 ,  H05K2201/044 ,  H05K2201/10022

Abstract: PURPOSE: A board using a universal interface is provided to use the interface universally by forming a module with a termination resistor, by selectively inserting it into a slot, and by selectively connecting to the termination resistor. CONSTITUTION: A bus(11) transfers data. A universal chipset(12) changes the setting of a memory driving mode according to a used logic by connecting to one end of the bus(11). A plurality of memory slots(13) accept a memory module(14) by connecting to another end of the bus(11). A plurality of termination slots(15) are connected to each end of the bus(11), accept the termination modules(16) applying a termination voltage. The termination modules(16) include the termination resistor and a circuit applying the terminal voltage.

Abstract translation: 目的：提供使用通用接口的电路板，通过形成具有终端电阻的模块，通过选择性地将其插入插槽，并通过选择性地连接到终端电阻器来普遍使用接口。 规定：总线（11）传输数据。 通用芯片组（12）通过连接到总线（11）的一端，根据使用的逻辑改变存储器驱动模式的设置。 多个存储器插槽（13）通过连接到总线（11）的另一端来接纳存储器模块（14）。 多个终端插槽（15）连接到总线（11）的每一端，接受施加端接电压的端接模块（16）。 终端模块（16）包括终端电阻器和施加终端电压的电路。

公开(公告)号：KR1020030017241A

公开(公告)日：2003-03-03

申请号：KR1020010051449

申请日：2001-08-24

Applicant: 삼성전자주식회사

Inventor： 박면주 ,  소병세 ,  이상원 ,  이재준

IPC: G06F13/14

CPC classification number: H05K1/0248 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09254

Abstract: PURPOSE: A system board is provided to reduce length differences or load differences of signal lines from a control circuit to each slot so that it can enhance a signal transmission time and a signal transmission feature. CONSTITUTION: The device comprises slots(S1, S2, S3, S4). The length among the slots(S1, S2, S3, S4) is L. Main signal lines(SL) are installed below the slots(S1, S2, S3, S4), and sub signal lines(s15, s16, s17, s18) branches off from branch points(e, f) of the main signal lines(SL) and connects to the slots(S1, S2, S3, S4). The lengths of the sub signal lines(s15, s16) between the branch point(e) and the slots(S1, S2) are the same, and also those of the sub signal lines(s17, s18) between the branch point(f) and the slots(S3, S4) being the same. Though the lengths of the signal lines from the main signal lines(SL) to the branch point(e) are different from those of the signal lines from the main signal lines(SL) to the branch point(f), those length differences of the signal lines are largely reduced rather than a conventional system board so that the signal transmission speeds or characteristics of the slots(S1, S2, S3, S4) are similar and enhanced.

Abstract translation: 目的：提供系统板，以减少信号线从控制电路到每个时隙的长度差异或负载差异，从而可以增强信号传输时间和信号传输特性。 构成：设备包括插槽（S1，S2，S3，S4）。 插槽（S1，S2，S3，S4）之间的长度为L.主信号线（SL）安装在插槽下方（S1，S2，S3，S4）和子信号线（s15，s16，s17，s18 ）从主信号线（SL）的分支点（e，f）分支，并连接到时隙（S1，S2，S3，S4）。 分支点（e）和时隙（S1，S2）之间的子信号线（s15，s16）的长度相同，也分支点（f，s）之间的子信号线（s17，s18） ）和时隙（S3，S4）相同。 虽然从主信号线（SL）到分支点（e）的信号线的长度不同于从主信号线（SL）到分支点（f）的信号线的长度差， 信号线大大减小而不是传统的系统板，使得信号传输速度或时隙（S1，S2，S3，S4）的特性相似和增强。

公开(公告)号：EP3190665A1

公开(公告)日：2017-07-12

申请号：EP16186572.0

申请日：2012-10-26

Applicant: Huawei Technologies Co., Ltd.

Inventor： WANG, Baoqi ,  ZHANG, Guodong ,  LIU, Fangming

IPC: H01R12/00 ,  H04Q1/02 ,  H05K7/14

CPC classification number: H01R12/737 ,  H04Q1/15 ,  H05K1/14 ,  H05K3/366 ,  H05K5/0065 ,  H05K7/1445 ,  H05K2201/044 ,  H05K2201/10189

Abstract: The present invention is applicable to the field of communications technologies, and provides an orthogonal interconnection system and a communications device. The perpendicular and orthogonal interconnection system includes a first board group, a second board group orthogonal to the first board group, and a center backplane arranged between the first board group and the second board group, where the first board group includes a plurality of first boards parallel to each other, and the second board group includes a plurality of second boards parallel to each other; a plurality of right angle male connectors is arranged on each of the first boards, a plurality of right angle female connectors is arranged on each of the second boards, and the right angle male connectors and the right angle female connectors directly cooperate and are connected in one-to-one correspondence. In the present invention, the right angle male connectors and the right angle female connectors directly cooperate and are connected. When the perpendicular and orthogonal interconnection system is upgraded, only the board that permanently has the right angle male connectors and the right angle female connectors needs to be replaced, which is rather simple and shortens a signal link. Based on the foregoing advantages, the perpendicular and orthogonal interconnection system is applicable to various communications devices; therefore, its upgrade is convenient, signal quality is improved, heat dissipation is ideal, and material costs are saved.

Abstract translation: 本发明适用于通信技术领域，提供了一种正交互联系统和通信设备。 垂直正交互连系统包括第一板组，与第一板组正交的第二板组以及设置在第一板组与第二板组之间的中心背板，其中第一板组包括多个第一板 彼此平行，并且第二板组包括彼此平行的多个第二板; 所述第一板上设置有多个直角凸连接器，所述第二板上设置有多个直角凹连接器，所述直角凸连接器与所述直角凹连接器直接配合连接 一对一的对应关系。 在本发明中，直角公连接器和直角母连接器直接配合连接。 当垂直和正交互连系统升级时，只需要更换永久具有直角公连接器和直角母连接器的电路板，这非常简单并且缩短了信号链路。 基于上述优点，垂直正交互联系统适用于各种通信设备; 因此其升级方便，信号质量得到改善，散热理想，节约材料成本。

公开(公告)号：EP2068228B1

公开(公告)日：2015-06-24

申请号：EP08169771.6

申请日：2008-11-24

Applicant: Fujitsu Technology Solutions Intellectual Property GmbH

Inventor： Heinrichs, Hans-Jürgen ,  Sell, Melanie

IPC: G06F1/18 ,  H05K1/14

CPC classification number: G06F1/185 ,  H05K1/14 ,  H05K2201/044 ,  H05K2201/10189

公开(公告)号：EP2804270A4

公开(公告)日：2015-03-18

申请号：EP13753081

申请日：2013-04-16

Applicant: HUAWEI TECH CO LTD

Inventor： XIAO CONGTU ,  ZHAO ZHINGANG

IPC: H01R13/66 ,  H01R12/72 ,  H05K1/14 ,  H05K3/36

CPC classification number: H05K1/14 ,  H01R12/724 ,  H01R13/6625 ,  H01R13/665 ,  H05K3/366 ,  H05K2201/044

Abstract: The present invention discloses a connector, including: a first interface, a second interface, and a signal boost circuit, where at least one of the first interface and the second interface includes a power supply contact head, and the power supply contact head is configured to power the signal boost circuit; and a casing, where the signal boost circuit is arranged inside the casing and concatenated between the first interface and the second interface, and the signal boost circuit performs signal amplification processing on a differential signal received by the first interface and outputs the signal over the second interface, and the first interface and the second interface are arranged on different surfaces outside the casing. Further, the present invention discloses an electronic device. As revealed in the content described above, the technical solutions disclosed in present invention can control signal attenuation under a high data transmission speed without increasing the size of the circuit board.

Abstract translation: 本发明公开了一种连接器，包括：第一接口，第二接口和信号升压电路，其中第一接口和第二接口中的至少一个包括电源接触头，并且电源接触头被配置 为信号升压电路供电; 以及壳体，其中所述信号升压电路布置在所述壳体内并且在所述第一接口和所述第二接口之间连接，并且所述信号升压电路对由所述第一接口接收的差分信号执行信号放大处理，并且在所述第二接口和所述第二接口之间输出所述信号 接口，第一接口和第二接口布置在外壳外部的不同表面上。 此外，本发明公开了一种电子设备。 如上述内容所揭示的，本发明公开的技术方案可以在高数据传输速度下控制信号衰减，而不增加电路板的尺寸。

公开(公告)号：EP2836058A1

公开(公告)日：2015-02-11

申请号：EP12876061.8

申请日：2012-10-26

Applicant: Huawei Technologies Co., Ltd

Inventor： WANG, Baoqi ,  ZHANG, Guodong ,  LIU, Fangming

IPC: H05K7/02 ,  H01R12/00

CPC classification number: H01R12/737 ,  H04Q1/15 ,  H05K1/14 ,  H05K3/366 ,  H05K5/0065 ,  H05K7/1445 ,  H05K2201/044 ,  H05K2201/10189

Abstract: The present invention is applicable to the field of communications technologies, and provides a perpendicular and orthogonal interconnection system and a communications device. The perpendicular and orthogonal interconnection system includes a first board group, a second board group orthogonal to the first board group, and a center backplane arranged between the first board group and the second board group, where the first board group includes a plurality of first boards parallel to each other, and the second board group includes a plurality of second boards parallel to each other; a plurality of curved male connectors is arranged on each of the first boards, a plurality of curved female connectors is arranged on each of the second boards, and the curved male connectors and the curved female connectors directly cooperate and are connected in one-to-one correspondence. In the present invention, the curved male connectors and the curved female connectors directly cooperate and are connected. When the perpendicular and orthogonal interconnection system is upgraded, only the board that permanently has the curved male connectors and the curved female connectors needs to be replaced, which is rather simple and shortens a signal link. Based on the foregoing advantages, the perpendicular and orthogonal interconnection system is applicable to various communications devices; therefore, its upgrade is convenient, signal quality is improved, heat dissipation is ideal, and material costs are saved.

Abstract translation: 本发明可应用于通信技术领域，并且提供垂直和正交的互连系统和通信设备。 垂直和正交互连系统包括第一板组，与第一板组正交的第二板组，以及布置在第一板组和第二板组之间的中心背板，其中第一板组包括多个第一板 彼此平行，并且第二板组包括彼此平行的多个第二板; 在每个第一板上布置有多个弯曲的阳连接器，每个第二板上布置有多个弯曲的阴连接器，并且弯曲的阳连接器和弯曲的阴连接器直接配合并且一对一连接， 一个通信。 在本发明中，弯曲的阳连接器和弯曲阴连接器直接配合并连接。 当垂直和正交互连系统升级时，只需要更换具有弯曲阳连接器的板和弯曲的母连接器，这是相当简单和缩短信号链路的。 基于上述优点，垂直和正交互连系统适用于各种通信设备; 因此，其升级方便，信号质量提高，散热理想，节省材料成本。

公开(公告)号：EP2723027A3

公开(公告)日：2014-05-07

申请号：EP13181965.8

申请日：2013-08-28

Applicant: Huawei Technologies Co., Ltd.

Inventor： Chen, Songhai ,  Tang, Shiping

IPC: H04L12/931 ,  H04L12/933

CPC classification number: H05K3/366 ,  H04L49/40 ,  H05K2201/044

Abstract: An objective of the present invention is to provide a three-dimensional backplane to solve the problem that the number of layers of a printed circuit board for producing a backplane increases linearly along with the number of connectors. The three-dimensional backplane includes: a first group of connectors (S1-S6), a second group of connectors (L1-L8), a first group of printed circuit boards (VB1, VB2), and a second group of printed circuit boards (LB1, LB2). The first group of connectors (S1-S6) and the second group of connectors (L1-L8) are disposed on the first group of printed circuit boards (VB1, VB2) and the second group of printed circuit boards (LB1, LB2) respectively. Any printed circuit board in the first group of printed circuit boards (VB1, VB2) is connected to any printed circuit board in the second group of printed circuit boards (LB1, LB2). Any connector in the second group of connectors (L1-L8) is connected to any connector in the first group of connectors (S1-S6). With the foregoing solution, the number of wires on each printed circuit board is reduced, so that the number of layers of a printed circuit board for producing a backplane is reduced.

公开(公告)号：EP2355629B1

公开(公告)日：2014-01-01

申请号：EP11152531.7

申请日：2011-01-28

Applicant: AMPHENOL CORPORATION

Inventor： Kirk, Brian Peter

IPC: H05K1/02 ,  H05K7/14

CPC classification number: H05K1/0228 ,  H01R13/6469 ,  H01R13/6587 ,  H05K1/0245 ,  H05K2201/044 ,  H05K2201/09227 ,  H05K2201/09236 ,  H05K2201/09263 ,  H05K2201/10189 ,  Y10T29/49117

公开(公告)号：EP2140741B1

公开(公告)日：2013-02-27

申请号：EP07748420.2

申请日：2007-04-20

Applicant: Telefonaktiebolaget LM Ericsson (publ)

Inventor： ENGBLOM, Lars ,  JOHANSSON, Mats ,  SCOTT, Peter

IPC: H05K1/02 ,  H03K17/00

CPC classification number: H05K1/0218 ,  H05K1/0298 ,  H05K2201/044 ,  H05K2201/0723 ,  H05K2201/09327