公开(公告)号：EP2783433A1

公开(公告)日：2014-10-01

申请号：EP12818875.2

申请日：2012-11-22

Applicant: ERNI Production GmbH & Co. KG.

Inventor： LAPPÖHN, Jürgen

IPC: H01R13/6587 ,  H01R12/58 ,  H01R12/52 ,  H01R12/70 ,  H01R12/73 ,  H05K3/36

CPC classification number: H01R13/6581 ,  H01R12/52 ,  H01R12/585 ,  H01R12/7082 ,  H01R12/737 ,  H01R13/6587 ,  H05K3/366 ,  H05K2201/044 ,  H05K2201/10189

Abstract: The invention relates to a plug connector featuring shielding of the signal contacts that are arranged in a contact pattern of differential pairs and that form a contact group together with a shielding element surrounding same. The contact groups are arranged in rows and columns. Each shielding contact includes a shielding element and at least one shielding contact element. Each signal contact includes a blade element and a signal contact element. All shielding contact elements within a row are aligned in a straight line. Each of the signal contact elements of each differential pair are aligned in a straight line that forms a 45° angle with the straight line of the shielding contact elements within the row. An arrangement can comprise two such plug connectors and a circuit board, wherein the two plug connectors are rotated 90° relative to each other.

公开(公告)号：EP2068228A3

公开(公告)日：2014-05-14

申请号：EP08169771.6

申请日：2008-11-24

Applicant: Fujitsu Technology Solutions Intellectual Property GmbH

Inventor： Heinrichs, Hans-Jürgen ,  Sell, Melanie

IPC: G06F1/18 ,  H05K1/14

CPC classification number: G06F1/185 ,  H05K1/14 ,  H05K2201/044 ,  H05K2201/10189

Abstract: Die Erfindung betrifft ein Datenverarbeitungssystem (100), mit einer Hauptplatine (200), bei dem die Hauptplatine (200) zumindest eine erste Steckkontaktleiste (300) aufweist, in welcher eine erste RISER-Karte (330) aufgenommen ist und in die erste RISER-Karte (330) eine erste Tochterkarte (360) derart aufgenommen ist, dass die erste Tochterkarte (360) parallel zur Hauptplatine (200) angeordnet ist. Das Datenverarbeitungssystem weist weiter eine zweite Steckkontaktleiste (400) auf, wobei in der zweiten Steckkontaktleiste (400) eine zweite RISER-Karte (430) aufgenommen ist, und in der zweiten RISER-Karte (430) eine zweite Tochterkarte (460) derart aufgenommen ist, dass die zweite Tochterkarte (460) parallel zur Hauptplatine (200) angeordnet ist. Dabei sind die erste Steckkontaktleise und die zweite Steckkontaktleiste jeweils an zueinander gegenüber liegenden Außenseiten der Hauptplatine angeordnet. Jede Tochterkarte (360, 460) umfasst jeweils eine I/O-Schnittstelle (365, 465), welche jeweils mit einer gemeinsamen Rückseitenplatine (600) zusammenwirken und zur gemeinsamen Rückseitenplatine hin gerichtet sind. Die erste Tochterkarte (360) ist zu der zweiten Tochterkarte (460) um eine parallel zur Hauptplatine (200) verlaufenden Achse (500) um 180° gedreht angeordnet.

公开(公告)号：EP1831970A4

公开(公告)日：2013-04-24

申请号：EP05855654

申请日：2005-12-23

Applicant: AMPHENOL CORP

Inventor： COHEN THOMAS S ,  CARTIER JR MARC B ,  GAILUS MARK W

IPC: H01R13/648

CPC classification number: H05K7/1445 ,  H01R13/514 ,  H01R13/6587 ,  H01R13/6591 ,  H05K1/0231 ,  H05K1/0237 ,  H05K1/116 ,  H05K1/14 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09718 ,  H05K2201/10189 ,  H05K2203/1572

公开(公告)号：EP1427061A3

公开(公告)日：2009-07-15

申请号：EP04002034.9

申请日：1999-11-24

Applicant: Teradyne, Inc.

Inventor： Cohen, Thomas S. ,  Gailus, Mark W. ,  Stokoe, Philip T.

IPC: H01R12/16

CPC classification number: H01R12/724 ,  H01R12/727 ,  H01R13/6471 ,  H01R13/6473 ,  H01R13/6587 ,  H01R24/44 ,  H05K1/0237 ,  H05K1/115 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09718 ,  H05K2201/10189

Abstract: An electrical connector for transferring a plurality of differential signals between electrical components (14, 16). The connector is made of modules (18) that have a plurality of pairs (104) of signal conductors (102) with a first signal path and a second signal path. Each signal path has a pair of contact sections (116) extending between the contact portions. For each pair of signal conductors, a first distance between the interim sections is less than a second distance between the pair of signal conductors and any other pair of signal conductors of the plurality. Embodiments are shown that increase routability.

公开(公告)号：EP1531653B1

公开(公告)日：2009-01-14

申请号：EP04028406.9

申请日：1999-11-24

Applicant: Amphenol Corporation

Inventor： Cohen, Thomas S. ,  Gailus, Mark W. ,  Stokoe, Philip T.

IPC: H05K1/02 ,  H05K1/11

CPC classification number: H01R12/727 ,  H01R13/6471 ,  H01R13/6474 ,  H01R13/6587 ,  H01R24/44 ,  H05K1/0237 ,  H05K1/115 ,  H05K1/116 ,  H05K3/429 ,  H05K2201/044 ,  H05K2201/09236 ,  H05K2201/09718 ,  H05K2201/10189

公开(公告)号：EP1863130A3

公开(公告)日：2008-04-02

申请号：EP07114627.8

申请日：1998-09-22

Applicant: Rambus, Inc.

Inventor： Perino, Donald V. ,  Garret, Billy Wayne, Jr. c/o Rambus Inc. - Texas office- ,  Liaw, Haw-Jyh c/o Rambus Inc. - Texas office - ,  Nguyen,David c/o Rambus Inc. - Texas office - ,  Nimmagadda, Srinivas c/o Rambus Inc. - Texas office - ,  Gasbarro, James A. ,  Dewitt Crisp, Richard c/o Rambus inc. - Texas office -

IPC: H01R12/04 ,  G11C5/00 ,  G11C5/06

CPC classification number: G11C5/063 ,  G06F13/1684 ,  G06F13/4086 ,  G06F13/409 ,  G06F13/4247 ,  G11C5/04 ,  G11C7/1048 ,  H05K1/023 ,  H05K1/0246 ,  H05K1/0248 ,  H05K1/14 ,  H05K7/1459 ,  H05K2201/044 ,  H05K2201/09263 ,  H05K2201/10022 ,  H05K2201/10159 ,  H05K2201/10689

Abstract: A high frequency bus system (450) which insures uniform arrival times of high fidelity signals to the devices (510), despite the use of the bus (450) on modules (420) and connectors. The high frequency bus system (450) includes a first bus segment having one or more devices (510) connected between a first and second end. The high frequency bus system (450) also includes a second bus segment which has no devices connected to it. The first end of the first segment and the second end of the second segment are coupled in series to form a chain of segments and when two signals are introduced to the first end of the second bus segment at substantially the same time, they arrive at each device (510) connected to the first bus segment at substantially the same time. Conversely when two signals originate at a device (510) substantially at the same time, they arrive at the first end of the second bus segment at substantially the same time. Uniform arrival times hold despite the use of connectors to couple the segments together, despite the segments being located on modules, without the need for stubs, despite the presence of routing turns in the segments and despite the type of information, such as address, data, or control, carried by the signals.

公开(公告)号：EP1662568A3

公开(公告)日：2008-01-23

申请号：EP05257205.4

申请日：2005-11-23

Applicant: GENERAL ELECTRIC COMPANY

Inventor： Stevanovic, Ljubisa Dragoljub ,  Delgado, Eladio Clemente ,  Schutten, Michael Joseph ,  Beaupre, Richard Alfred ,  De Rooij, Michael Andrew

IPC: H01L25/07

CPC classification number: H01L24/49 ,  H01L23/3735 ,  H01L24/45 ,  H01L24/48 ,  H01L25/071 ,  H01L25/072 ,  H01L2224/45014 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/48472 ,  H01L2224/49109 ,  H01L2224/49111 ,  H01L2224/49113 ,  H01L2224/49175 ,  H01L2224/73265 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01023 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01068 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12032 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13063 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/2076 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K1/147 ,  H05K3/0061 ,  H05K3/361 ,  H05K2201/044 ,  H05K2201/0715 ,  H05K2201/10189 ,  H05K2201/10287 ,  H01L2924/00014 ,  H01L2924/00

Abstract: A power module (10) includes a substrate (12) that includes an upper layer (16), an electrical insulator and a thermal coupling layer. The upper layer includes an electrically conductive pattern (17) and is configured for receiving power devices (14). The electrical insulator is disposed between the upper layer and the thermal coupling layer. The thermal coupling layer is configured for thermal coupling to a heat sink. The power module further includes at least one laminar interconnect (18) that includes first and second electrically conductive layers (20, 24) and an insulating layer (22) disposed between the first and second electrically conductive layers. The first electrically conductive layer of the laminar interconnect is electrically connected to the upper layer of the substrate. Electrical connections (42) connect a top side (19) of the power devices to the second electrically conductive layer of the laminar interconnect.

公开(公告)号：EP1422717B1

公开(公告)日：2007-07-25

申请号：EP02026015.4

申请日：2002-11-21

Applicant: Infineon Technologies AG

Inventor： Kuzmenka, Maksim

IPC: G11C5/00

CPC classification number: H05K1/147 ,  G11C5/00 ,  H05K1/148 ,  H05K3/222 ,  H05K2201/044

公开(公告)号：EP1795058A1

公开(公告)日：2007-06-13

申请号：EP05799822.1

申请日：2005-09-21

Applicant: INTEL CORPORATION

Inventor： MEIER, Pascal ,  DABRAL, Sanjay

IPC: H05K3/36 ,  H05K1/14

CPC classification number: G06F1/189 ,  G06F1/184 ,  G06F1/185 ,  G06F1/186 ,  H01R12/79 ,  H05K1/14 ,  H05K1/147 ,  H05K3/222 ,  H05K3/305 ,  H05K2201/044 ,  H05K2201/10356 ,  H05K2201/10492 ,  H05K2201/10704 ,  H05K2201/2027 ,  Y10T29/49117

Abstract: A system and method are disclosed in which flex cables are affixed to PCBs, for providing high-speed signaling paths between ICs disposed upon the PCBs. The flex cables are fixably attached to the PCBs so as to substantially mimic their structural orientation. Where the configuration includes more than one PCB, the flex cables include multiple portions which are temporarily separable from one another and from the die, using flex-to-flex and flex-to-package connectors, allowing field maintenance of the configuration. By routing the high-speed signals between ICs onto the flex cable, single-layer PCBs can be used for non-critical and power delivery signals, at substantial cost savings. By disposing the flex cables onto the PCB rather than allowing the cables to float freely, the configuration is thermally managed as if the signals were on the PCB and cable routing problems are avoided.

公开(公告)号：EP1619757A4

公开(公告)日：2006-07-26

申请号：EP04700110

申请日：2004-01-05

Applicant: HUAWEI TECH CO LTD

Inventor： LI ZHENYA ,  WEI KONGGANG ,  LI WENJIAN ,  WU GUZHENG ,  WANG CHENGLONG ,  YANG ZHIGUO ,  JIN JUNWEN

IPC: H01R9/28 ,  H01R31/06 ,  H05K1/18

CPC classification number: H01R12/52 ,  H01R31/06 ,  H05K1/18 ,  H05K2201/044 ,  H05K2201/097 ,  H05K2201/10189 ,  H05K2203/1572

Abstract: This invention discloses s a double sided insert board, on which one side is provided with at least one front board connectors according to the notch width, the other side is provided with at least one back board connectors according to the notch width. The front board connectors and the back board connectors are located at the same level on the double sided insert board as well as are staggerd about. The front board connectors and the back board connectors are the uniform board connectors of same standard and with same pins. The double sided insert board according to the invention satisfy the common usage of the front board and the back board. The invention also has no special demands to the design, production, and manufacture of the boards, which reduces the production cost and difficulties in project. As the same time, the front board and the back board are same, which reduces the cost for design.