中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

47 records (took 0.08 seconds)

    ELECTROLESS/ELECTROLYTIC SEED LAYER PROCESS
    33.
    发明申请
    ELECTROLESS/ELECTROLYTIC SEED LAYER PROCESS 审中-公开
    电解/电沉积层工艺

    公开(公告)号：WO2009064598A1

    公开(公告)日：2009-05-22

    申请号：PCT/US2008/081013

    申请日：2008-10-23

    Applicant: RCD TECHNOLOGY INC. ,  OBERLE, Robert, R.

    Inventor： OBERLE, Robert, R.

    IPC: C25D5/00

    CPC classification number: C25D5/022 ,  C23C18/1608 ,  C23C18/1653 ,  C23C18/30 ,  C25D7/00 ,  H01Q1/2208 ,  H01Q1/36 ,  H01Q1/38

    Abstract: An electroless metallization catalyst layer can be formed in a RFID antenna pattern. A first metallic layer can be deposited over top of the electroless metallization catalyst layer. An electrical short layer connecting regions of the metallic layer can be formed. A portion of electrical short layer can be covered with a non-conductive layer. The first metallic layer can be electroplated with a second metallic layer.

    Abstract translation: 无电金属化催化剂层可以以RFID天线图案形成。 可以在无电金属化催化剂层的顶部上沉积第一金属层。 可以形成连接金属层的区域的电短层。 电短层的一部分可以被非导电层覆盖。 第一金属层可以用第二金属层电镀。

    CONTAINER SECURITY SEAL WITH DESTRUCTIBLE RFID TAG
    34.
    发明申请
    CONTAINER SECURITY SEAL WITH DESTRUCTIBLE RFID TAG 审中-公开
    带有可破坏RFID标签的集装箱安全封条

    公开(公告)号：WO2008063786A9

    公开(公告)日：2008-10-23

    申请号：PCT/US2007081295

    申请日：2007-10-12

    Applicant: RCD TECHNOLOGY INC ,  OBERLE ROBERT R

    Inventor： OBERLE ROBERT R

    IPC: G08B13/14

    CPC classification number: G09F3/0376 ,  G06K19/07798

    Abstract: An RFID securitization piece can comprise a housing. An RFID tag in the housing can include an RFID chip and RFID antenna. The RFID securitization piece is attachable to an object such that when the RFID securitization piece is removed from the object the RFID tag is damaged. RFID interrogations will then indicate that the RFID securitization piece has been removed from the object.

    Abstract translation: RFID证券化件可以包括壳体。 外壳中的RFID标签可以包括RFID芯片和RFID天线。 RFID证券化件可附接到物体上，使得当从物体上移除RFID证券化件时，RFID标签被损坏。 RFID询问将表明RFID证券化件已经从物体上移除。

    METHOD FOR FORMING RADIO FREQUENCY ANTENNA USING CONDUCTIVE INKS
    40.
    发明申请
    METHOD FOR FORMING RADIO FREQUENCY ANTENNA USING CONDUCTIVE INKS 审中-公开
    使用导电墨水形成无线电频率天线的方法

    公开(公告)号：WO2001069717A1

    公开(公告)日：2001-09-20

    申请号：PCT/US2001/007897

    申请日：2001-03-13

    Applicant: RCD TECHNOLOGY, INC. ,  OBERLE, Robert, R.

    Inventor： OBERLE, Robert, R.

    IPC: H01Q1/36

    CPC classification number: H01Q1/2225 ,  G06K19/07749 ,  H01Q1/22 ,  H01Q1/36 ,  H01Q1/38 ,  H01Q9/27 ,  H05K1/095 ,  H05K1/165 ,  H05K3/242 ,  H05K3/246 ,  H05K2201/0347 ,  H05K2203/0191 ,  H05K2203/0769 ,  Y10T29/49016

    Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate (52). The antenna coil pattern is formed using a conductive ink (42) which is patterned on the substrate. The conductive ink is cured and an electrical-short layer (46) is formed across the coils of the conductive ink pattern. An insulating layer (56) is formed over top of the electrical-short layer, a metal layer (58) electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.

    Abstract translation: 适用于射频天线的金属化电路通过在柔性基板（52）上形成天线线圈图案来制造。 使用在基板上图案化的导电油墨（42）形成天线线圈图案。 导电油墨固化，并且在导电油墨图案的线圈之间形成电 - 短层（46）。 绝缘层（56）形成在电短层的顶部上，电镀在导电层顶部上的金属层（58），然后去除电短层。 在电镀期间使用电 - 短层允许导电油墨层上不同点处的电压相对相似，使得在导电油墨层的顶部上形成均匀的电镀层。 这导致了降低成本的更好质量的射频天线。

Patent Agency Ranking