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公开(公告)号：BRPI0618442A2
公开(公告)日：2011-08-30
申请号：BRPI0618442
申请日：2006-11-07
Applicant: RCD TECHNOLOGY INC
Inventor： GARBY SANDRA M , OBERLE ROBERT R
Abstract: A two resist layer process allows a seed layer to be used to electroplate a conductive layer of an element in a way that a portion of the seed layer can be removed.
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公开(公告)号：BRPI0614738A2
公开(公告)日：2011-04-12
申请号：BRPI0614738
申请日：2006-07-10
Applicant: RCD TECHNOLOGY INC
Inventor： OBERLE ROBERT R
IPC: H01Q1/38
Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.
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公开(公告)号：BRPI0619429A2
公开(公告)日：2011-10-04
申请号：BRPI0619429
申请日：2006-11-22
Applicant: RCD TECHNOLOGY INC
Inventor： OBERLE ROBERT R
IPC: G08B13/14
Abstract: A tamper evident RFID circuit uses a fold section that forms a capacitive element when folded together.
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公开(公告)号：BRPI0608463A2
公开(公告)日：2010-01-12
申请号：BRPI0608463
申请日：2006-03-01
Applicant: RCD TECHNOLOGY INC
Inventor： OBERLE ROBERT R
IPC: H01L23/495 , G08B13/14
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公开(公告)号：DE60130199D1
公开(公告)日：2007-10-11
申请号：DE60130199
申请日：2001-03-13
Applicant: RCD TECHNOLOGY INC
Inventor： OBERLE ROBERT R
Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.
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Patent Agency Ranking
公开(公告)号：AU2576802A
公开(公告)日：2002-06-11
申请号：AU2576802
申请日：2001-11-28
Applicant: RCD TECHNOLOGY INC
Inventor： OBERLE ROBERT R , WALKER CHRIS
IPC: G06F21/00 , G07C9/00 , G07F7/10 , H04L29/06 , H04Q5/22 , H04K1/00 , G06F11/30 , G06F15/173 , G06F15/16
Abstract: The present invention describes a system wherein an RF ID card uses a user interface, such as a keypad, to input a password. The password is encrypted and sent to an RF ID reader. Since the password is not permanently stored on the RF ID card, someone stealing the RF ID card cannot use the RF ID card to impersonate a user.
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公开(公告)号：AU4738401A
公开(公告)日：2001-09-24
申请号：AU4738401
申请日：2001-03-13
Applicant: RCD TECHNOLOGY INC
Inventor： OBERLE ROBERT R
Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.
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公开(公告)号：BRPI0618940A2
公开(公告)日：2011-09-13
申请号：BRPI0618940
申请日：2006-11-15
Applicant: RCD TECHNOLOGY INC
Inventor： OBERLE ROBERT R
IPC: B29C65/00
Abstract: A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set.
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公开(公告)号：DE60130199T2
公开(公告)日：2008-05-21
申请号：DE60130199
申请日：2001-03-13
Applicant: RCD TECHNOLOGY INC
Inventor： OBERLE ROBERT R
Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.
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公开(公告)号：AT371962T
公开(公告)日：2007-09-15
申请号：AT01920313
申请日：2001-03-13
Applicant: RCD TECHNOLOGY INC
Inventor： OBERLE ROBERT
Abstract: A metalized circuit suitable for application as a radio frequency antenna is produced by forming an antenna coil pattern on a flexible substrate. The antenna coil pattern is formed using a conductive ink which is patterned on the substrate. The conductive ink is cured and an electrical-short layer is formed across the coils of the conductive ink pattern. An insulating layer is formed over top of the electrical-short layer, a metal layer electroplated on top of the conductive layer, and then the electrical-short layer is removed. The use of the electrical-short layer during the electroplating allows for the voltage at the different points on the conductive ink layer to be relatively similar, so that a uniform electroplate layer is formed on top of the conductive ink layer. This results in a better quality radio frequency antenna at a reduced cost.
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