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公开(公告)号：CN101835866A
公开(公告)日：2010-09-15
申请号：CN200880113159.7
申请日：2008-11-28
Applicant: 日立化成工业株式会社
IPC: C09J201/00 , C09J11/04 , H01L21/60 , H05K1/14
CPC classification number: H01L21/6835 , C08K3/22 , C09J11/04 , H01L21/563 , H01L21/6836 , H01L23/295 , H01L24/11 , H01L24/27 , H01L24/29 , H01L24/81 , H01L24/83 , H01L24/94 , H01L2221/68318 , H01L2221/68327 , H01L2224/1134 , H01L2224/13099 , H01L2224/13144 , H01L2224/274 , H01L2224/29101 , H01L2224/2919 , H01L2224/293 , H01L2224/294 , H01L2224/81121 , H01L2224/81208 , H01L2224/81801 , H01L2224/83855 , H01L2224/83885 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01056 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/15788 , H05K3/305 , H01L2924/00 , H01L2924/3512
Abstract: 本发明提供一种用于连接相对向的电路基板的电路部件连接用粘接剂，所述电路部件连接用粘接剂包含：含有热塑性树脂、热固性树脂和固化剂的树脂组合物；以及分散于该组合物中的金属氢氧化物粒子。本发明的电路部件连接用粘接剂可实现半导体芯片与基板之间的优良的连接可靠性，同时可将用于对准半导体芯片和基板的位置的对准标记的识别性提高至充分实用水平。
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公开(公告)号：CN101578698A
公开(公告)日：2009-11-11
申请号：CN200880001881.1
申请日：2008-01-09
Applicant: 日立化成工业株式会社
Inventor： 永井朗
IPC: H01L21/60 , C09J9/02 , C09J11/04 , C09J201/00 , H01B5/16
CPC classification number: C09J11/04 , C08K3/08 , C08K3/22 , C08L2666/28 , C09J163/00 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/83 , H01L24/90 , H01L2224/05111 , H01L2224/05139 , H01L2224/05144 , H01L2224/05147 , H01L2224/05155 , H01L2224/05164 , H01L2224/0558 , H01L2224/05611 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/05664 , H01L2224/1134 , H01L2224/13144 , H01L2224/16238 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29369 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81903 , H01L2224/83101 , H01L2224/83191 , H01L2224/83851 , H01L2224/90 , H01L2224/9211 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01024 , H01L2924/01025 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/0104 , H01L2924/01041 , H01L2924/01042 , H01L2924/01044 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01051 , H01L2924/01056 , H01L2924/01057 , H01L2924/01058 , H01L2924/01059 , H01L2924/01063 , H01L2924/01066 , H01L2924/01068 , H01L2924/0107 , H01L2924/01072 , H01L2924/01073 , H01L2924/01074 , H01L2924/01076 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01084 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/09701 , H01L2924/15788 , H01L2924/00011 , H01L2224/16225 , H01L2924/00 , H01L2924/3512 , H01L2924/00014 , H01L2924/0665 , H01L2224/81 , H01L2224/83
Abstract: 本发明提供一种电路部件连接用粘接剂，其介于具有突出的连接端子的半导体芯片和形成有配线图案的基板之间，通过加压、加热，电连接相对的所述连接端子和所述配线图案的同时粘接所述半导体芯片和所述基板；所述电路部件连接用粘接剂包括：树脂组合物和分散在该树脂组合物中的复合氧化物粒子，所述树脂组合物含有热塑性树脂、交联性树脂和使该交联性树脂形成交联结构的固化剂。
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Patent Agency Ranking
公开(公告)号：CN101473425A
公开(公告)日：2009-07-01
申请号：CN200780023296.7
申请日：2007-06-20
Applicant: 日立化成工业株式会社
IPC: H01L21/60 , H01L21/301 , H01L21/683
CPC classification number: H01L21/6835 , H01L21/67092 , H01L21/78 , H01L24/27 , H01L24/29 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/90 , H01L2221/6834 , H01L2223/54426 , H01L2223/54473 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/05624 , H01L2224/13144 , H01L2224/16225 , H01L2224/274 , H01L2224/2919 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/81121 , H01L2224/81191 , H01L2224/81193 , H01L2224/81205 , H01L2224/81801 , H01L2224/83191 , H01L2224/838 , H01L2224/83851 , H01L2224/83885 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01045 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01052 , H01L2924/01058 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/07811 , H01L2924/15788 , H01L2924/00 , H01L2924/3512 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: 本发明提供一种半导体装置的制造方法，该方法在高效地获得附有粘结剂的半导体芯片单片的同时，可以使半导体芯片与配线基板良好地连接。该制造方法，经过以半导体晶片(6)的电路面(6a)向着切割带(9)一侧的方式而将由切割带(9)、粘结剂层(3)以及半导体晶片(6)按照这一顺序叠层所得的层压体(60)的准备工序，从与所述半导体晶片(6)的反面(6b)识别所述电路面(6a)的电路图案(P)进而识别切割位置的工序，至少将所述半导体晶片(6)以及所述粘结剂层(3)在所述层压体(60)的厚度方向上切割的工序，得到连接于配线基板的半导体芯片单片，由此防止半导体芯片的污染，而且可以防止由飞散、流出引起的丢失。
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公开(公告)号：CN100379832C
公开(公告)日：2008-04-09
申请号：CN200410097888.1
申请日：1998-08-13
Applicant: 日立化成工业株式会社
CPC classification number: H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
Abstract: 本发明提供一种，把半导体芯片和基板粘结固定，同时，使两电极彼此产生电连接而采用的电路构件连接用的粘结剂，该粘结剂为含有粘结树脂组合物和无机填料，对粘结树脂组合物100份(重量)含无机填料10～200份(重量)的粘结层，和用该粘结剂把电路构件彼此加以连接的电路板，和该电路板的制造方法。
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公开(公告)号：CN1230483C
公开(公告)日：2005-12-07
申请号：CN98814271.6
申请日：1998-08-13
Applicant: 日立化成工业株式会社
CPC classification number: H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
Abstract: 本发明提供一种，把半导体芯片和基板粘结固定，同时，使两电极彼此产生电连接而采用的电路构件连接用的粘结剂，该粘结剂为含有粘结树脂组合物和无机填料，对粘结树脂组合物100份(重量)含无机填料10～200份(重量)的粘结层，和用该粘结剂把电路构件彼此加以连接的电路板，和该电路板的制造方法。
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公开(公告)号：CN1637105A
公开(公告)日：2005-07-13
申请号：CN200410097888.1
申请日：1998-08-13
Applicant: 日立化成工业株式会社
CPC classification number: H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
Abstract: 本发明提供一种，把半导体芯片和基板粘结固定，同时，使两电极彼此产生电连接而采用的电路构件连接用的粘结剂，该粘结剂为含有粘结树脂组合物和无机填料，对粘结树脂组合物100份(重量)含无机填料10～200份(重量)的粘结层，和用该粘结剂把电路构件彼此加以连接的电路板，和该电路板的制造方法。
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公开(公告)号：CN1322229A
公开(公告)日：2001-11-14
申请号：CN98814271.6
申请日：1998-08-13
Applicant: 日立化成工业株式会社
CPC classification number: H01L24/83 , C09J9/02 , H01L23/49883 , H01L24/29 , H01L24/90 , H01L2224/16225 , H01L2224/2919 , H01L2224/2929 , H01L2224/293 , H01L2224/32225 , H01L2224/45144 , H01L2224/73204 , H01L2224/83101 , H01L2224/8319 , H01L2224/838 , H01L2224/83851 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01015 , H01L2924/01019 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01045 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/09701 , H01L2924/12044 , H01L2924/14 , H01L2924/15788 , H01L2924/19041 , H01L2924/19043 , H05K1/0271 , H05K3/323 , H05K2201/0133 , H05K2201/0209 , H05K2201/0379 , H05K2203/1189 , Y10T29/49117 , Y10T156/10 , Y10T156/109 , Y10T428/24942 , Y10T428/24959 , Y10T428/2852 , Y10T428/31511 , Y10T428/31515 , Y10T428/31855 , H01L2924/00
Abstract: 本发明提供一种,把半导体芯片和基板粘结固定,同时,使两电极彼此产生电连接而采用的电路构件连接用的粘结剂,该粘结剂为含有粘结树脂组合物和无机填料,对粘结树脂组合物100份(重量)含无机填料10～200份(重量)的粘结层,和用该粘结剂把电路构件彼此加以连接的电路板,和该电路板的制造方法。
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