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公开(公告)号：KR101325741B1
公开(公告)日：2013-11-08
申请号：KR1020070079238
申请日：2007-08-07
IPC: H04L1/00
CPC classification number: H04B3/36
Abstract: 본 발명의 네트워크 부호화 장치 및 방법은, 오류 정정 부호가 적용된 통신 환경에 있어서, 데이터 송신 용량을 증대시킬 수 있는 네트워크 부호화 장치 및 방법을 제공한다.
상술한 목적을 달성하기 위하여 본 발명의 네트워크 부호화 장치는, 적어도 두 개 이상의 수신 신호를 복호화하는 수신 신호 처리부; 및 상기 수신 신호 처리부로부터 적어도 두 개 이상의 복호화된 수신 신호를 입력받고, 상기 적어도 두 개 이상의 복호화된 수신 신호를 병합 처리하여 하나의 병합 송신 신호를 생성하는 송신 신호 처리부를 포함한다.
네트워크 부호화, 중계기, 터보 부호-
公开(公告)号：KR1020130085152A
公开(公告)日：2013-07-29
申请号：KR1020120006096
申请日：2012-01-19
Applicant: 한국과학기술원
Abstract: PURPOSE: An embedded toroidal coil, a manufacturing method thereof and a multilayer printed circuit board are provided to implement accurate measurement by forming a coil simultaneously with the forming of an existing metal wiring. CONSTITUTION: An interlayer insulating layer covers a lower coil layer and a metal wiring under test. An interlayer through-hole is formed at the interlayer insulating layer. Interlayer metal vias (230,232) are formed at the interlayer through-hole. An upper coil layer is connected to the contact pad of the lower coil layer. A test terminal (240) is electrically connected to the contact pad of the other side of the upper coil layer.
Abstract translation: 目的：提供嵌入式环形线圈及其制造方法和多层印刷电路板，以通过在形成现有的金属布线的同时形成线圈来实现精确的测量。 构成：层间绝缘层覆盖下线圈层和被测金属线。 在层间绝缘层形成层间通孔。 层间金属通孔（230,232）形成在层间通孔处。 上线圈层连接到下线圈层的接触焊盘。 测试端子（240）电连接到上线圈层的另一侧的接触焊盘。
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公开(公告)号：KR1020130085148A
公开(公告)日：2013-07-29
申请号：KR1020120006092
申请日：2012-01-19
Applicant: 한국과학기술원
IPC: H01L23/48
CPC classification number: H01L25/073 , H01L21/268 , H01L23/481 , H01L23/5329
Abstract: PURPOSE: A semiconductor chip, a third-dimensional laminated chip and a third-dimensional laminated chip package are provided to increase structural stability and electrical performance of coaxial through silicon via by forming a graphene film between a first via part and an insulation part and between an insulation part and a second via part. CONSTITUTION: An active layer (130) is formed in one side of a substrate (110). Multiple passive devices (140) are laminated on the other side of substrate. Multiple coaxial through silicone vias (120) are formed through the substrate. The multiple coaxial through silicone vias are electrically connected the passive device and the active layer. The coaxial through silicone via comprises a first via part (121), a second via part (122), and an insulation part (123).
Abstract translation: 目的：提供半导体芯片，第三维层压芯片和第三维层压芯片封装，以通过在第一通孔部分和绝缘部件之间形成石墨烯膜，以及介于 绝缘部分和第二通孔部分。 构成：在衬底（110）的一侧形成有源层（130）。 多个无源器件（140）层叠在衬底的另一侧。 通过硅基通孔形成多个同轴通孔（120）。 多个同轴通过硅氧烷通孔电连接无源器件和有源层。 同轴的硅胶通孔包括第一通孔部分（121），第二通孔部分（122）和绝缘部分（123）。
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34.发明公开수동 이퀄라이저를 구비하는 인터포저, 그 제조 방법, 인터포저를 포함하는 적층 칩 패키지, 및 그 제조 방법 有权具有被动均衡器的插销器，其制造方法，包括间隔器的堆叠芯片包装及其制造方法
公开(公告)号：KR1020130084835A
公开(公告)日：2013-07-26
申请号：KR1020120005722
申请日：2012-01-18
Applicant: 한국과학기술원
IPC: H01L23/48
CPC classification number: H01L2224/16145
Abstract: PURPOSE: An interposer with a passive equalizer, a manufacturing method thereof, a stacked chip package including the interposer, and a manufacturing method thereof are provided to improve signal transmission characteristics without increasing manufacturing costs and/or a size by increasing a resistance value and inductance and reducing capacitance. CONSTITUTION: An insulating layer (120) is formed on the upper surface of a semiconductor substrate. Multiple metal wires (150a-150f) are separately formed on a first area of the insulating layer and include a signal transmission line and multiple ground lines. A passive equalizer (170) includes a junction pattern extended in a first direction and multiple finger patterns (174,176,178) extended in a second direction perpendicular to the first direction from the junction pattern. A first finger pattern among the multiple finger patterns is electrically connected to the signal transmission line. Second finger patterns are electrically connected to the multiple ground lines, respectively. [Reference numerals] (AA) First direction; (BB) Second direction
Abstract translation: 目的：提供一种具有无源均衡器的内插器及其制造方法，包括内插器的堆叠式芯片封装及其制造方法，以提高信号传输特性，而不会通过增加电阻值和电感而增加制造成本和/或尺寸 并减小电容。 构成：在半导体衬底的上表面上形成绝缘层（120）。 多个金属线（150a-150f）分别形成在绝缘层的第一区域上，并且包括信号传输线和多条接地线。 无源均衡器（170）包括沿着第一方向延伸的接合图案和沿着与接合图案垂直于第一方向的第二方向延伸的多个指形图案（174,176,178）。 多个指形图案中的第一指形图案电连接到信号传输线。 第二手指图案分别电连接到多个接地线。 （附图标记）（AA）第一方向; （BB）第二方向
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35.发明授权관통 실리콘 비아를 이용한 수동 이퀄라이저를 구비하는 인터포저, 그 제조 방법, 인터포저를 포함하는 적층 칩 패키지, 및 그 제조 방법 有权具有通过硅的被动均衡器的插销器，其制造方法，包括插入器的堆叠芯片包装及其制造方法
公开(公告)号：KR101278442B1
公开(公告)日：2013-07-01
申请号：KR1020120006088
申请日：2012-01-19
Applicant: 한국과학기술원
CPC classification number: H01L2224/13025 , H01L2224/14181 , H01L2224/16225
Abstract: PURPOSE: An interposer including a passive equalizer using a through silicon via, a manufacturing method thereof, a stacked chip package including the same, and a method for manufacturing the stacked chip package are provided to improve signal transmission properties without increasing a size or manufacturing costs. CONSTITUTION: A first insulation layer (120) is formed on the front side of a semiconductor substrate (110). A second insulation layer (130) is formed on the rear side of the semiconductor substrate. A plurality of through silicon vias (144,146,148) pass through the semiconductor substrate, the first insulation layer, and the second insulation layer. A plurality of metal wires include a signal transmission line (150a) to transmit an electric signal and a plurality of ground lines (150b-150f) to transmit a ground voltage. A rear metal pattern (170) includes a junction pattern (172) and a plurality of finger patterns (174,176,178). [Reference numerals] (AA) Second direction; (BB) First direction
Abstract translation: 目的：提供一种包括使用硅通孔的无源均衡器，其制造方法，包括该无源均衡器的堆叠芯片封装的插入器和用于制造堆叠芯片封装的方法，以提高信号传输性能而不增加尺寸或制造成本 。 构成：在半导体衬底（110）的前侧形成第一绝缘层（120）。 第二绝缘层（130）形成在半导体衬底的后侧。 多个贯通硅通孔（144,146,148）穿过半导体衬底，第一绝缘层和第二绝缘层。 多个金属线包括用于发送电信号的信号传输线（150a）和用于发送接地电压的多个接地线（150b-150f）。 后金属图案（170）包括结图案（172）和多个指形图案（174,176,178）。 （附图标记）（AA）第二方向; （BB）第一方向
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Patent Agency Ranking
公开(公告)号：KR1020130033235A
公开(公告)日：2013-04-03
申请号：KR1020110097195
申请日：2011-09-26
Applicant: 한국과학기술원
CPC classification number: Y02T10/7005
Abstract: PURPOSE: An electromagnetic field shielding device of an online electric vehicle system is provided to prevent the malfunction of an electric device. CONSTITUTION: A feeder(20) is laid under a road and is extended along a length direction of the road. A power collecting device(300) is installed at a lower unit of an electric vehicle and receives power from the feeder with a magnetic induction method. A first shielding member(40) shields an electric magnetic field exposed to both sides of the feeder when power is supplied to the power collecting device in the feeder. A second shielding member(50) is installed in a guide groove including a predetermined depth formed at both side units of an electric vehicle. The second shielding member shields the electric magnetic field exposed to a side space between the ground and the electric vehicle. A third shielding member(60) shields the electric magnetic field exposed to both sides of the electric vehicle when the power is supplied to the power collecting device.
Abstract translation: 目的：提供一种在线电动车辆系统的电磁场屏蔽装置，以防止电气设备的故障。 构成：将一个进料器（20）放置在道路下方并沿着道路的长度方向延伸。 集电装置（300）安装在电动车辆的下部，利用磁感应方式从馈线接收电力。 第一屏蔽部件（40）当供电给馈电装置中的集电装置时，屏蔽暴露于馈电线两侧的电磁场。 第二屏蔽构件（50）安装在包括在电动车辆的两侧单元形成的预定深度的引导槽中。 第二屏蔽构件屏蔽暴露于地面和电动车辆之间的侧面空间的电磁场。 当向电力收集装置供电时，第三遮蔽构件（60）屏蔽暴露于电动车辆两侧的电磁场。
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公开(公告)号：KR1020130024114A
公开(公告)日：2013-03-08
申请号：KR1020110087361
申请日：2011-08-30
Applicant: 한국과학기술원
Abstract: PURPOSE: An automatic power feeding module of a power supply device is provided to automatically control the capacity of a capacitor for maximizing the output power of a power collector. CONSTITUTION: An automatic power feeding module of a power supply device includes a switch control device and multiple switches. The switch control device converts received electricity into direct current through a rectifier. The switch control device has a circuit for controlling a switch connected to a capacitor within the power supply device. The multiple switches turns on or off by power supplied from the switch control device. Each of the multiple switches is serially connected to each capacitor. A regulator controls power to be provided to a battery or motor. [Reference numerals] (AA) Switch control signal; (BB) Switch control device; (CC) Output capacity information; (DD) Power collector; (EE) Power feeder
Abstract translation: 目的：提供电源装置的自动供电模块，以自动控制电容器的容量，以最大限度地提高集电器的输出功率。 构成：电源装置的自动馈电模块包括开关控制装置和多个开关。 开关控制装置通过整流器将接收的电力转换为直流电。 开关控制装置具有用于控制连接到电源装置内的电容器的开关的电路。 多个开关由开关控制装置提供的电源打开或关闭。 多个开关中的每一个串联连接到每个电容器。 调节器控制提供给电池或电动机的电力。 （标号）（AA）开关控制信号; （BB）开关控制装置; （CC）输出能力信息; （DD）集电器; （EE）电源馈线
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公开(公告)号：KR1020130014178A
公开(公告)日：2013-02-07
申请号：KR1020110076138
申请日：2011-07-29
Applicant: 한국과학기술원
IPC: G01D5/14
Abstract: PURPOSE: A device of a magnetic field mode for sensing the position of a moving body is provided to efficiently implement wireless power transmission to a vehicle or a moving body. CONSTITUTION: A device of a magnetic field mode for sensing the position of a moving body comprises a plurality of magnetic field sensors(111,112), A-D convertors(121,122), and a control unit(130). The magnetic field sensors are resonated by a wireless power transmission frequency. The A-D converters convert the voltage or current obtained by the resonance of the magnetic field sensors into a digital value. The control unit controls a display device displaying a position where the strongest magnetic field is formed by using a plurality of the digital values.
Abstract translation: 目的：提供用于感测移动体的位置的磁场模式的装置，以有效地实现对车辆或移动体的无线电力传输。 构成：用于感测移动体的位置的磁场模式的装置包括多个磁场传感器（111,112），A-D转换器（121,122）和控制单元（130）。 磁场传感器由无线功率传输频率谐振。 A-D转换器将通过磁场传感器的谐振获得的电压或电流转换为数字值。 控制单元通过使用多个数字值来控制显示形成最强磁场的位置的显示装置。
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39.发明授权
公开(公告)号：KR101198928B1
公开(公告)日：2012-11-07
申请号：KR1020100132982
申请日：2010-12-23
Applicant: 한국과학기술원
IPC: H01L21/768
Abstract: 전자기 밴드갭 구조물은 반도체 기판, MOS 커패시터, 제1 전력 전달 층 및 제2 전력 전달 층을 포함한다. MOS 커패시터는 반도체 기판의 표면에 형성된다. 제1 전력 전달 층은 반도체 기판의 MOS 커패시터가 형성되는 영역의 상부에 배치되며, 교번적으로 배열되는 복수의 제1 접지 라인들 및 복수의 제1 전원 라인들을 구비한다. 제2 전력 전달 층은 제1 전력 전달 층의 상부에 배치되며, 교번적으로 배열되는 복수의 제2 접지 라인들 및 복수의 제2 전원 라인들을 구비한다. 복수의 제1 접지 라인들과 복수의 제2 접지 라인들은 전기적으로 연결되며, 복수의 제1 전원 라인들과 복수의 제2 전원 라인들은 전기적으로 연결된다.
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公开(公告)号：KR1020120082769A
公开(公告)日：2012-07-24
申请号：KR1020110004259
申请日：2011-01-14
Applicant: 한국과학기술원
Abstract: PURPOSE: An apparatus for shielding electromagnetic waves using a reverse current is provided to shield the electromagnetic waves by applying the reverse current around a wire. CONSTITUTION: A shielding coil(313) for a power supply device(310) is arranged on a shielding position in order to shield a magnetic field due to a current flowing in a power supply coil(312) of the power supply device. The shielding coil for the power supply device removes a magnetic field by compulsively applying the current in a reverse direction of the current in the power supply coil. The shielding coil for the power supply device is arranged in the shielding position in order to shield the magnetic field due to the current flowing in a current collecting coil of the current collector. The shielding coil for the current collector removes the magnetic field by compulsively applying the current in the reverse direction of the current in the power supply coil.
Abstract translation: 目的：提供一种使用反向电流屏蔽电磁波的装置，通过在电线周围施加反向电流来屏蔽电磁波。 构成：用于供电装置（310）的屏蔽线圈（313）布置在屏蔽位置上，以便屏蔽由于在电源装置的电源线圈（312）中流动的电流引起的磁场。 用于电源装置的屏蔽线圈通过在电源线圈中的电流的相反方向上强制施加电流来去除磁场。 用于电源装置的屏蔽线圈被布置在屏蔽位置，以便屏蔽由于集流器的集流线圈中流过的电流引起的磁场。 用于集电器的屏蔽线圈通过在电源线圈中的电流的相反方向上强制施加电流来除去磁场。
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