公开(公告)号：KR1019960002242B1

公开(公告)日：1996-02-13

申请号：KR1019890007138

申请日：1989-05-27

Applicant: 도쿄엘렉트론가부시키가이샤 ,  테루큐우슈우가부시끼가이샤

Inventor： 우시지마미츠루 ,  히라카와오사무 ,  아키모토마사미 ,  아나이노리유키 ,  아나이노리유키

IPC: G03F7/16

CPC classification number: G03F7/162 ,  B05B15/55 ,  B05C11/08

Abstract: Disclosed is a coating apparatus for applying a resist or developing solution to a semiconductor wafer. This coating apparatus comprises a plurality of nozzles supplied with various resist from a resist source and each adapted to drip the different solution onto the wafer, a vessel in which the nozzles is kept on stand-by, while maintaining the liquids in a predetermined state in the vicinity of discharge port portions of the nozzles, when the nozzles need not be operated, and a nozzle operating mechanism for selecting one of the nozzles kept on stand-by in the vessel, and transporting the selected nozzle to the location of the wafer, whereby the resist is applied to the wafer by means of only the nozzle transported by the nozzle operating mechanism.