公开(公告)号：KR100316712B1

公开(公告)日：2001-12-12

申请号：KR1019990023491

申请日：1999-06-22

Applicant: 삼성전자주식회사

Inventor： 양윤식 ,  김경대 ,  홍형식 ,  김민규

IPC: H01L21/68

CPC classification number: B24B37/345

Abstract: 화학기계적연마장치에웨이퍼를로딩/언로딩하기위한로드컵의페디스탈이개시된다. 개시된페디스탈은, 웨이퍼를지지하는페디스탈플레이트의상면에부착되어웨이퍼표면과접촉되는페디스탈필름을구비하며, 이페디스탈필름은웨이퍼표면과의접촉면적을감소시키기위하여페디스탈플레이트의상면에웨이퍼의진공흡착및 순수의분사를위해마련되는복수의유체포트주위를포함한제한된부위에만부착되는것을특징으로한다. 또한, 페디스탈플레이트는그 상면에잔류되는오염물질의양을최소화하기위하여유체포트가위치하지않은부위가제거된십자형상으로된 것을특징으로한다. 따라서, 페디스탈의상면에잔류되는오염물질이웨이퍼와의접촉에의해웨이퍼표면으로전이되는것을최소화할수 있다. 여기에서, 페디스탈필름은복수의유체포트각각의가장자리를따라고리형상으로부착될수 있으며, 또는페디스탈플레이트의상면에방사상으로부착될수 있다.

公开(公告)号：KR1020010003268A

公开(公告)日：2001-01-15

申请号：KR1019990023491

申请日：1999-06-22

Applicant: 삼성전자주식회사

Inventor： 양윤식 ,  김경대 ,  홍형식 ,  김민규

IPC: H01L21/68

CPC classification number: B24B37/345

Abstract: PURPOSE: A pedestal of a load-cup for loading/unloading a wafer into/from a chemical mechanical polishing apparatus is to minimize the transfer of a contaminant from on an upper face of the pedestal to a surface of the wafer, thereby reducing scratch on the surface of the wafer. CONSTITUTION: A pedestal(810) of a load-cup for loading/unloading a wafer into a chemical mechanical polishing apparatus comprises a pedestal plate(811) disposed in an inner portion of the load-cup to support the wafer; a pedestal supporting portion for supporting and lifting up/down the pedestal plate; a fluid port(814) provided at an upper face of the pedestal plate to vacuum-attach the wafer and spray pure wafer; a vertical fluid passage formed in an inner portion of the pedestal supporting portion; a lateral fluid passage formed in an inner portion of the pedestal plate to connect the fluid port and the vertical fluid passage; and a pedestal film(813) attached to an upper face of the pedestal plate to be contacted with the surface of the wafer, wherein the pedestal film is attached to only a limited portion including a peripheral portion of the fluid port.

Abstract translation: 目的：用于将晶片装入/卸载化学机械抛光装置的负载杯的底座是最小化污染物从基座上表面到晶片表面的转移，从而减少 晶片的表面。 构成：用于将晶片装载/卸载到化学机械抛光装置中的负载杯的基座（810）包括设置在负载杯的内部以支撑晶片的基座板（811） 用于支撑和提升基座板的基座支撑部分; 设置在所述基座板的上表面处以真空附着所述晶片并喷射纯晶片的流体端口（814） 形成在基座支撑部的内部的垂直流体通道; 横向流体通道，其形成在所述基座板的内部，以连接所述流体端口和所述垂直流体通道; 以及安装在基座板的上表面以与晶片的表面接触的基座膜（813），其中基座膜仅附接到包括流体端口的周边部分的限定部分。

公开(公告)号：KR1020010003267A

公开(公告)日：2001-01-15

申请号：KR1019990023490

申请日：1999-06-22

Applicant: 삼성전자주식회사

Inventor： 양윤식 ,  차훈 ,  김경대 ,  김민규

IPC: H01L21/304

CPC classification number: B24B37/32

Abstract: PURPOSE: A retainer ring of a polishing head and a chemical mechanical polishing device which is equipped with the retainer ring are provided to discharge efficiently the polluting matter such as slurry flowed into the inside of the polishing head, and clean the polluting matter with a cleaning device and the retainer ring of the chemical mechanical polishing device. CONSTITUTION: A retainer ring(612) of a polishing head(610) comprises; a ring body(6121); and numerous discharging holes(6123) for polluting matter passing through the space between the inside and the outside of the ring body to discharge the polluting matter flowed into a polishing head(610). Numerous screw holes are formed in the upside of the polishing head to install the polishing body to the polishing head. A chemical mechanical polishing device comprises; a retainer ring having the ring body and numerous discharging holes; a first nozzle installed in the inside of a load-cup spraying the pure water toward the upper surface of a pedestal having a wafer in the upside; a second nozzle spraying the pure water toward a membrane(611) installed in the bottom of the polishing head; and a third nozzle spraying the pure water toward the space(618) in the polishing head.

Abstract translation: 目的：提供装有保持环的抛光头和化学机械抛光装置的保持环，以有效地排出流入抛光头内部的浆料等污染物质，并清洗污染物质 装置和化学机械抛光装置的保持环。 构成：抛光头（610）的保持环（612）包括： 环体（6121）; 以及多个用于污染通过环体的内部和外部之间的空间的物质的排出孔（6123），以排出流入抛光头（610）的污染物质。 在抛光头的上侧形成有许多螺孔，将抛光体安装在抛光头上。 化学机械抛光装置包括： 具有环体和多个排出孔的保持环; 安装在负载杯内部的第一喷嘴将纯水喷射到具有在上侧的晶片的基座的上表面; 将第二喷嘴喷射到安装在抛光头底部的膜（611）上; 以及将第三喷嘴喷射到抛光头中的空间（618）。