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公开(公告)号：US20190212658A1
公开(公告)日：2019-07-11
申请号：US16325471
申请日：2017-06-30
Applicant: ASML NETHERLANDS B.V.
Inventor： Simon Reinald HUISMAN , Simon Gijsbert Josephus MATHIJSSEN , Sebastianus Adrianus GOORDEN , Duygu AKBULUT , Alessandro POLO
Abstract: An alignment sensor for a lithographic apparatus has an optical system configured to deliver, collect and process radiation selectively in a first waveband (e.g. 500-900 nm) and/or in a second waveband (e.g. 1500-2500 nm). The radiation of the first and second wavebands share a common optical path in at least some portion of the optical system, while the radiation of the first waveband is processed by a first processing sub-system and the radiation of the second waveband is processed by a second processing sub-system. The processing subsystems in one example include self-referencing interferometers. The radiation of the second waveband allows marks to be measured through an opaque layer. Optical coatings and other components of each processing sub-system can be tailored to the respective waveband, without completely duplicating the optical system.
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公开(公告)号：US20250147429A1
公开(公告)日：2025-05-08
申请号：US18693337
申请日：2022-09-23
Applicant: ASML NETHERLANDS B.V.
Abstract: A method for determining a measurement setting for measuring a parameter of interest from a target structure on a substrate. The method includes: obtaining first position difference data describing a difference between a position of a first representative target structure position and a position of one or more first features relating to product structure; obtaining optical metrology data relating to optical measurements of the target structure and further relating to a plurality of different measurement settings; and determining the measurement setting from the first position difference data and the optical metrology data such that a measured feature position value obtained from an optical measurement of the target structure using the determined measurement setting is better correlated to a position of the one or more first features.
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公开(公告)号：US20220283428A1
公开(公告)日：2022-09-08
申请号：US17635907
申请日：2020-08-05
Applicant: ASML Netherlands B.V. , IMEC v.z.w.
Inventor： Luc Roger Simonne HASPESLAGH , Veronique ROCHUS , Guilherme BRONODANI TORRI , Nitesh PANDEY , Sebastianus Adrianus GOORDEN
Abstract: A micromirror array comprises a substrate, a plurality of minors for reflecting incident light and, for each mirror (20) of the plurality of minors, at least one piezoelectric actuator (21) for displacing the minor, wherein the at least one piezoelectric actuator is connected to the substrate. The micromirror array further comprises one or more pillars (24) connecting the minor to the at least one piezoelectric actuator. Also disclosed is a method of forming such a micromirror array. The micromirror array may be used in a programmable illuminator. The programmable illuminator may be used in a lithographic apparatus and/or in an inspection apparatus.
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公开(公告)号：US20210382403A1
公开(公告)日：2021-12-09
申请号：US17280711
申请日：2019-09-05
Applicant: ASML Netherlands B.V.
Inventor： Sebastianus Adrianus GOORDEN
IPC: G03F9/00
Abstract: An apparatus for measuring a position of a mark on a substrate, the apparatus comprising: an illumination system configured to condition at least one radiation beam to form a plurality of illumination spots spatially distributed in series such that during scanning of the substrate the plurality of illumination spots are incident on the mark sequentially, and a projection system configured to project radiation diffracted by the mark from the substrate, the diffracted radiation being produced by diffraction of the plurality of illumination spots by the mark; wherein the projection system is further configured to modulate the diffracted radiation and project the modulated radiation onto a detecting system configured to produce signals corresponding to each of the plurality of illumination spots, the signals being combined to determine the position of the mark.
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Patent Agency Ranking
公开(公告)号：US20210364936A1
公开(公告)日：2021-11-25
申请号：US16963273
申请日：2018-12-20
Applicant: ASML Netherlands B.V.
Inventor： Nitesh PANDEY , Duygu AKBULUT , Alessandro POLO , Sebastianus Adrianus GOORDEN
Abstract: A sensor is disclosed, wherein a transducer generates acoustic waves, which are received by a lens assembly. The lens assembly transmits and directs at least a part of the acoustic waves to a target. The lens assembly then receives at least a part of acoustic waves, after interaction with the target. The sensor further comprises an optical detector that comprises at least one optically reflective member located at a surface of the lens assembly, which surface is arranged opposite to a surface of the lens assembly which faces a focal plane of the lens assembly, wherein the at least one optically reflective member is mechanically displaced in response to the acoustic waves, which are received and transmitted by the lens assembly.
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公开(公告)号：US20210240091A1
公开(公告)日：2021-08-05
申请号：US17049597
申请日：2019-04-02
Applicant: ASML Netherlands B.V.
Inventor： Sebastianus Adrianus GOORDEN , Simon Reinald HUISMAN
IPC: G03F9/00
Abstract: A method of determining a position of a feature (for example an alignment mark) on an object (for example a silicon wafer) is disclosed. The method comprises determining an offset parameter, determining the second position; and determining a first position from the second position and the offset parameter, the position of the mark being the first position. The offset parameter is a measure of a difference in: a first position that is indicative of the position of the feature; and a second position that is indicative of the position of the feature. The offset parameter may be determined using a first measurement apparatus and the second position may be determined using a second, different measurement apparatus.
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公开(公告)号：US20210132509A1
公开(公告)日：2021-05-06
申请号：US17049707
申请日：2019-04-03
Applicant: ASML Netherlands B.V. , ASML Holding N.V.
Inventor： Simon Reinald HUISMAN , Tamer Mohamed Tawfik Ahmed Mohamed ELAZHARY , Yuxiang LIN , Vu Quang TRAN , Sebastianus Adrianus GOORDEN , Justin Lloyd KREUZER , Christopher John MASON , Igor Matheus Petronella AARTS , Krishanu SHOME , Irit TZEMAH
Abstract: An alignment sensor apparatus includes an illumination system, a first optical system, a second optical system, a detector system, and a processor. The illumination system is configured to transmit an illumination beam along an illumination path. The first optical system is configured to transmit the illumination beam toward a diffraction target on a substrate. The second optical system includes a first polarizing optic configured to separate and transmit an irradiance distribution. The detector system is configured to measure a center of gravity of the diffraction target based on the irradiance distribution outputted from a first polarization branch and a second polarization branch. The processor is configured to measure a shift in the center of gravity of the diffraction target caused by an asymmetry variation in the diffraction target and determine a sensor response function of the alignment sensor apparatus based on the center of gravity shift.
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公开(公告)号：US20190354026A1
公开(公告)日：2019-11-21
申请号：US16478068
申请日：2018-01-10
Applicant: ASML NETHERLANDS B.V.
Inventor： Stefan Michiel WITTE , Alessandro ANTONCECCHI , Stephen EDWARD , Hao ZHANG , Paulus Clemens Maria PLANKEN , Kjeld Sijbrand Eduard EIKEMA , Sebastianus Adrianus GOORDEN , Simon Reinald HUISMAN , Irwan Dani SETIJA
Abstract: As increasing numbers of layers, using increasing numbers of specific materials, are deposited on substrates, it becomes increasingly difficult to detect alignment marks accurately for, for example, applying a desired pattern onto a substrate using a lithographic apparatus, in part due to one or more of the materials used in one or more of the layers being wholly or partially opaque to the radiation used to detect alignment marks. In a first step, the substrate is illuminated with excitation radiation. In a second step, at least one effect associated with a reflected material effect scattered by a buried structure is measured. The effect may, for example, include a physical displacement of the surface of the substrate. In a third step, at least one characteristic of the structure based on the measured effect is derived.
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公开(公告)号：US20180031977A1
公开(公告)日：2018-02-01
申请号：US15660498
申请日：2017-07-26
Applicant: ASML Netherlands B.V.
Inventor： Sebastianus Adrianus GOORDEN , Nitesh PANDEY , Duygu AKBULUT , Teunis Willem TUKKER , Johannes Matheus Marie DE WIT
CPC classification number: G03F7/7015 , G01N21/8806 , G01N21/9501 , G01N2021/8822 , G01N2201/0631 , G02B6/262 , G02B6/4204 , G02B6/4296 , G03F7/70075 , G03F7/70583 , G03F7/70616 , G03F7/70625 , G03F7/70633
Abstract: Devices and methods for processing a radiation beam with coherence are disclosed. In one arrangement, an optical system receives a radiation beam with coherence. The radiation beam comprises components distributed over one or more radiation beam spatial modes. A waveguide supports a plurality of waveguide spatial modes. The optical system directs a plurality of the components of the radiation beam belonging to a common radiation beam spatial mode and having different frequencies onto the waveguide in such a way that each of the plurality of components couples to a different set of the waveguide spatial modes, each set comprising one or more of the waveguide spatial modes.
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