32.
    发明专利
    未知

    公开(公告)号:DE3779359D1

    公开(公告)日:1992-07-02

    申请号:DE3779359

    申请日:1987-05-15

    Applicant: BASF AG

    Abstract: Hardener compsn. (I) is claimed, for urea-formaldehyde glue resins (II) contg. up to 20 wt.% melamine and up to 5 wt.% phenol. In addn. to an ammonium salt of an inorganic or organic acid, (I) also contains an acid (III) which does not react with (I), together with urea and, opt., a metal salt, and has pH above 2 in aq. soln.; or (I) contains, in addn. to these components, a glycol or its functional deriv. (IV), and has pH below 2 in aq. soln.. Metal salt is an alkali(ne earth) metal salt, pref. chloride or sulphate of Li, Na, Ca, or Mg; ammonium salt is chloride, sulphate, phosphate, nitrate, bromide, or formate; corresp. to the above alternatives, (III) is an acid with pKa above 3 at 25 deg.C, esp. formic acid, or an inorganic or organic acid with pKa below 3 at 25 deg.C; (IV) is ethylene-, diethylene-, or tri- or tetra-meric oligoethylene-glycol, or their ethers or esters or their mixts..

    Amino plast adhesive with low initial adhesion - the bond being established by heat, suitable for wood working

    公开(公告)号:DE2401554A1

    公开(公告)日:1975-07-24

    申请号:DE2401554

    申请日:1974-01-14

    Applicant: BASF AG

    Abstract: The adhesive, which is used for cold prebonding wood, is given improved holding power by the addition to the adhesive of 0.05-10% a soln. of boric acid in a mono- or polyacidic amine (I). The soln. is obtd. by dissolving sufficient boric acid in the liquid amine to give >=1 equiv. amine per 3 mole H3BO3. (I) include (poly)acidic aliphatic amines, 1 degree, 2 degrees or 3 degrees amine (mixt.), with 1-20C, (pref. 1-10C). The agent is suitable for adhesives such as phenol or amino resins or their condensate mixts., and polymers or copolymers of vinyl acetate, vinyl propionate, vinyl chloride, their acrylic acid ester, vinyl ether, or styrols. It is suitable for most synthetic glues, and adhesives, and fillers. Prepressing times are shortened, and improved stability of the adhesively bonded chips is obtd.

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