公开(公告)号：DE2860778D1

公开(公告)日：1981-09-24

申请号：DE2860778

申请日：1978-09-04

Applicant: BASF AG

Inventor： GRASER MARTIN ,  HANN ERNST WILHELM ,  HENKEL HELMUT ,  MAYER JOHANN DR ,  SCHMIDT-HELLERAU CHRISTOF

IPC: B27N1/00 ,  C08L25/08 ,  C08L33/08 ,  C08L33/10 ,  C08L61/20 ,  C08L91/08 ,  C08L97/02 ,  B29J5/02

公开(公告)号：DE2246591A1

公开(公告)日：1974-04-11

申请号：DE2246591

申请日：1972-09-22

Applicant: BASF AG

Inventor： GRASER MARTIN

IPC: C09J161/20 ,  B29J5/00

公开(公告)号：CH624605A5

公开(公告)日：1981-08-14

申请号：CH1479276

申请日：1976-11-24

Applicant: BASF AG

Inventor： GRASER MARTIN

IPC: C08L1/02 ,  C08L61/20 ,  C08L97/02 ,  B29J5/00

公开(公告)号：DE2740207B1

公开(公告)日：1978-11-09

申请号：DE2740207

申请日：1977-09-07

Applicant: BASF AG

Inventor： GRASER MARTIN ,  HANN ERNST-WILHELM ,  HENKEL HELMUT ,  MAYER JOHANNES DR ,  SCHMIDT-HELLERAU CHRISTOF

IPC: B27N1/00 ,  C08L25/08 ,  C08L33/08 ,  C08L33/10 ,  C08L61/20 ,  C08L91/08 ,  C08L97/02 ,  B29J5/02

公开(公告)号：DE2401554A1

公开(公告)日：1975-07-24

申请号：DE2401554

申请日：1974-01-14

Applicant: BASF AG

Inventor： SIEGLER MANFRED ,  LEHNERT HEINZ ,  GRASER MARTIN ,  GOETTSCHE REIMER DR

IPC: C09J5/00 ,  C09J157/00 ,  C09J161/00 ,  C09J3/16 ,  C09J3/14

Abstract: The adhesive, which is used for cold prebonding wood, is given improved holding power by the addition to the adhesive of 0.05-10% a soln. of boric acid in a mono- or polyacidic amine (I). The soln. is obtd. by dissolving sufficient boric acid in the liquid amine to give >=1 equiv. amine per 3 mole H3BO3. (I) include (poly)acidic aliphatic amines, 1 degree, 2 degrees or 3 degrees amine (mixt.), with 1-20C, (pref. 1-10C). The agent is suitable for adhesives such as phenol or amino resins or their condensate mixts., and polymers or copolymers of vinyl acetate, vinyl propionate, vinyl chloride, their acrylic acid ester, vinyl ether, or styrols. It is suitable for most synthetic glues, and adhesives, and fillers. Prepressing times are shortened, and improved stability of the adhesively bonded chips is obtd.

公开(公告)号：DE2324046A1

公开(公告)日：1974-11-28

申请号：DE2324046

申请日：1973-05-12

Applicant: BASF AG

Inventor： GRASER MARTIN

IPC: C08L97/02 ,  B29J5/00

Abstract: A fire resistant chipboard which is also resistant to variations in temp. is prepd. by compacting wood chips bonded together in the presence of a fire resistant material using a conventional phenol formaldehyde wood glue prepd. in an alkaline medium. A >=4C alcohol which normally has a b.pt. >=100 degrees C is added to the glue or the wood chips, before or during the bonding stage.

公开(公告)号：CH638719A5

公开(公告)日：1983-10-14

申请号：CH1052278

申请日：1978-10-10

Applicant: BASF AG

Inventor： GRASER MARTIN ,  HANN ERNST WILHELM ,  HENKEL HELMUT ,  MAYER JOHANN DR ,  SCHMIDT-HELLERAU CHRISTOF

IPC: C08L97/02 ,  B29J5/02

公开(公告)号：DE3060239D1

公开(公告)日：1982-04-29

申请号：DE3060239

申请日：1980-03-07

Applicant: BASF AG

Inventor： GRASER MARTIN ,  MAYER JOHANN DR ,  EBERT JOACHIM ,  SCHATZ HERMANN ,  NIEBERLE JUERGEN

IPC: C09J5/00 ,  C09J161/00 ,  C09J3/16

公开(公告)号：DE2351981A1

公开(公告)日：1975-04-24

申请号：DE2351981

申请日：1973-10-17

Applicant: BASF AG

Inventor： SIEGLER MANFRED ,  LEHNERT HEINZ ,  GRASER MARTIN ,  GOETTSCHE REIMER DR

IPC: C09J157/00 ,  C09J161/00 ,  C09J3/16