公开(公告)号：EP3132281A1

公开(公告)日：2017-02-22

申请号：EP15724110.0

申请日：2015-04-17

Applicant: Butterfly Network Inc.

Inventor： ROTHBERG, Jonathan, M. ,  RALSTON, Tyler, S. ,  SANCHEZ, Nevada, J. ,  CASPER, Andrew, J.

IPC: G01S7/52 ,  G01S15/89 ,  G10K11/34 ,  B06B1/02

Abstract: To implement a single-chip ultrasonic imaging solution, on-chip signal processing may be employed in the receive signal path to reduce data bandwidth and an output data module may be used to move data for all received channels off-chip as a digital data stream. The digitization of received signals on-chip allows advanced digital signal processing to be performed on-chip, and thus permits the full integration of an entire ultrasonic imaging system on a single semiconductor substrate. The on-chip digitization of received signals also enables the on-chip integration of ultrasound processing and/or pre-processing to reduce the burden on off-chip computing. Data compression architectures are disclosed to facilitate the transfer of data off-chip as a digital data stream in accordance with the bandwidth requirements of standard commercially-available output interfaces.

Abstract translation: 为了实现单芯片超声成像解决方案，可以在接收信号路径中采用片上信号处理以减少数据带宽，并且可以使用输出数据模块来将所有接收到的信道的数据作为数字数据流移动 。 片上接收信号的数字化允许在芯片上执行高级数字信号处理，从而允许整个超声波成像系统完全集成在单个半导体衬底上。 接收信号的片上数字化还使得超声处理和/或预处理的片内集成能够减少片外计算的负担。 公开了数据压缩架构，以便根据标准商业可用的输出接口的带宽需求，促进作为数字数据流的片外数据传输。

公开(公告)号：EP2768396A2

公开(公告)日：2014-08-27

申请号：EP12781542.1

申请日：2012-10-17

Applicant: Butterfly Network Inc.

Inventor： ROTHBERG, Jonathan, M. ,  SANCHEZ, Nevada ,  CHARVAT, Gregory ,  RALSTON, Tyler

IPC: A61B8/08 ,  A61N7/00

CPC classification number: G01S7/52017 ,  A61B5/015 ,  A61B8/08 ,  A61B8/13 ,  A61B8/4209 ,  A61B8/4245 ,  A61B8/4254 ,  A61B8/4263 ,  A61B8/4477 ,  A61B8/4488 ,  A61B8/4494 ,  A61B8/483 ,  A61B8/5207 ,  A61B8/56 ,  A61B8/565 ,  A61B17/320068 ,  A61B2090/378 ,  A61B2562/164 ,  A61N7/00 ,  A61N7/02 ,  A61N2007/0078 ,  G01S7/52019 ,  G01S7/52023

Abstract: Apparatus and methods are described that include ultrasound imaging devices, which may operate in a transmissive ultrasound imaging modality, and which may be used to detect properties of interest of a subject such as index of refraction, density and/or speed of sound. Devices suitable for performing high intensity focused ultrasound (HIFU), as well as HIFU and ultrasound imaging, are also described.

公开(公告)号：EP3709894A1

公开(公告)日：2020-09-23

申请号：EP18879151.1

申请日：2018-11-15

Applicant: Butterfly Network, Inc.

Inventor： CHEN, Kailiang ,  SANCHEZ, Nevada, J. ,  ALIE, Susan, A. ,  RALSTON, Tyler, S. ,  ROTHBERG, Jonathan, M. ,  FIFE, Keith, G. ,  LUTSKY, Joseph

IPC: A61B8/14 ,  H01L23/535

公开(公告)号：EP3132470A1

公开(公告)日：2017-02-22

申请号：EP15721395.0

申请日：2015-04-17

Applicant: Butterfly Network Inc.

Inventor： ROTHBERG, Jonathan, M. ,  FIFE, Keith, G. ,  SANCHEZ, Nevada, J. ,  ALIE, Susan, A.

IPC: H01L27/06 ,  H01L21/768 ,  B81C1/00 ,  A61B8/00 ,  A61B5/02 ,  B06B1/02 ,  H01L27/092

CPC classification number: H01L27/0617 ,  A61B8/00 ,  A61B8/4494 ,  B06B1/02 ,  B06B1/0292 ,  B06B2201/51 ,  B81B3/0021 ,  B81B7/0006 ,  B81B2201/0271 ,  B81C1/00158 ,  B81C1/00246 ,  B81C2203/0735 ,  B81C2203/0771 ,  H01L21/32134 ,  H01L21/56 ,  H01L21/768 ,  H01L21/76838 ,  H01L21/823871 ,  H01L23/5226 ,  H01L23/528 ,  H01L27/0688 ,  H01L27/092 ,  H01L2224/16225

Abstract: Micromachined ultrasonic transducers formed in complementary metal oxide semiconductor (CMOS) wafers are described, as are methods of fabricating such devices. A metallization layer of a CMOS wafer may be removed by sacrificial release to create a cavity of an ultrasonic transducer. Remaining layers may form a membrane of the ultrasonic transducer.

Abstract translation: 还描述了形成在互补金属氧化物半导体（CMOS）晶片中的微加工超声换能器，以及制造这种器件的方法。 可以通过牺牲释放去除CMOS晶片的金属化层以产生超声换能器的空腔。 剩余的层可以形成超声换能器的膜。

公开(公告)号：EP3132441A1

公开(公告)日：2017-02-22

申请号：EP15722303.3

申请日：2015-04-17

Applicant: Butterfly Network Inc.

Inventor： ROTHBERG, Jonathan, M. ,  RALSTON, Tyler, S. ,  SANCHEZ, Nevada, J. ,  CASPER, Andrew, J.

IPC: G10K11/34 ,  B06B1/02 ,  G01S7/524

CPC classification number: G01S7/52019 ,  B06B1/0292 ,  B06B1/0607 ,  G01S7/52017 ,  G01S7/5202 ,  G10K11/346 ,  H03K5/13 ,  H03K2005/00019

Abstract: Aspects of the technology described herein relate to ultrasound device circuitry as may form part of a single substrate ultrasound device having integrated ultrasonic transmission units, a delay mesh circuitry integrated with the substrate, coupled to inputs of the plurality of ultrasound transmission units and configured to output to the plurality of ultrasound transmission units a plurality of time-delayed versions of a delay mesh circuitry input signal corresponding to a waveform generated by a waveform generator.

Abstract translation: 本文描述的技术的方面涉及超声装置电路，其可以形成具有集成的超声换能器的单个衬底超声装置的一部分。 超声波装置电路可以以功率和数据效率的方式促进产生超声波形。