公开(公告)号：JP2000311588A

公开(公告)日：2000-11-07

申请号：JP2000039648

申请日：2000-02-17

Applicant: CANON KK

Inventor： ARAI YOSHITAKA ,  SHIGEOKA KAZUYA ,  HASEGAWA MITSUTOSHI

IPC: H01J9/39 ,  B01J20/02 ,  H01J7/18 ,  H01J29/94 ,  H01J31/12

Abstract: PROBLEM TO BE SOLVED: To increase an adsorbing speed and to make it last for long, by forming a getter layer on a backing surface at least having either Zr or Ti. SOLUTION: It is preferable that a getter layer at least contains a non- evaporating getter material and the getter layer at least contains Ti. The getter layer is preferably formed by laminating evaporated materials. The getter layer may be formed on a backing surface containing the non-evaporating getter material. In this case, the backing surface preferably contains Zr or Ti, and the getter layer at least contains Ti. Generally, the backing surface is irregular, and preferably porous. In addition, the backing surface is irregular, and the layer thickness of the getter layer is preferably smaller than roughness of irregularity of the backing surface. The backing surface is preferably formed by thermally spraying composites of the backing surface.

公开(公告)号：JP2000251769A

公开(公告)日：2000-09-14

申请号：JP4919999

申请日：1999-02-25

Applicant: CANON KK

Inventor： HASEGAWA MITSUTOSHI ,  UEDA HIROHARU ,  SHIGEOKA KAZUYA ,  ARAI YOSHITAKA ,  KOYANAGI KAZUO

IPC: H01J29/86 ,  C09J201/00 ,  H01J31/12

Abstract: PROBLEM TO BE SOLVED: To provide an enclosure for an image display device less in brightness reduction or life shortening, and sufficient in getter effect, by realizing an adhesion process at a temperature about 400 deg.C or below required at the minimum for a frit adhesion (sealing) process. SOLUTION: A rear plate 2 and a face plate 4 are joined respectively at joining parts to an outer frame 3 through polymer thermoplastic adhesives 9, 14 containing a polyphenyl compound. As the adhesives, a polymer thermoplastic adhesive containing polyether, polysulfone or polyether ketone, of the like is named. Especially a polymer thermoplastic sheet-shaped adhesive mainly composed of polyether ketone is used and heated to 330 deg.C or higher, to soften and crimp the adhesive, and the adhesive is hardened and bonded in a temperature-lowering process. Polyether ketone is preferable compared with other adhesives, especially from the viewpoint of a small quantity of emission gas in a vacuum baking process.

公开(公告)号：JP2000251728A

公开(公告)日：2000-09-14

申请号：JP4920399

申请日：1999-02-25

Applicant: CANON KK

Inventor： GOFUKU IHACHIROU ,  HASEGAWA MITSUTOSHI ,  HAMAMOTO YASUHIRO ,  SHIGEOKA KAZUYA ,  ARAI YOSHITAKA

IPC: H01J9/39

Abstract: PROBLEM TO BE SOLVED: To reduce deterioration of brightness with the elapse of time by arranging a plurality of non-evaporation getters on at least one substrate of two facing substrates, activating the non-evaporation getters, heating an entire air- tight container, and selectively heating the non-evaporation getters. SOLUTION: An electron source substrate 1 is provided with a plurality of electron emitting elements and with wiring. A rear plate 2, a support frame 3, and a face plate 4 forms an envelope 5. Non-evaporation getter films 9 are arranged on almost the entire surface on the upper wiring for Doxm in an image display region. Continuing exhaust of the envelope 5, an image forming device and a vacuum container are entirely held for 10 hours, for example, at 300 deg.C by a heating device. Subsequently, the entire image forming device is heated, for example, to 200 deg.C, and simultaneously, for example, 0.46 A current is made to flow through the upper wiring, temperature of the wiring is set to be 400 deg.C for 10 minutes, and thereby, the non-evaporation getter films 9 on the wiring are activated.

公开(公告)号：JP2000251656A

公开(公告)日：2000-09-14

申请号：JP4647399

申请日：1999-02-24

Applicant: CANON KK

Inventor： SHIGEOKA KAZUYA ,  HASEGAWA MITSUTOSHI ,  ARAI YOSHITAKA ,  GOFUKU IHACHIROU

IPC: H01J29/94 ,  G09F9/30 ,  H01J7/18 ,  H01J31/12

Abstract: PROBLEM TO BE SOLVED: To reduce the undesirable influences by a getter by setting the electric resistance between a first point in an intake member and a second point separated from this point by a prescribed distance higher than the electrical resistance between points separated by a prescribed distance in a wiring. SOLUTION: In an electron source substrate 1, an upper wiring 102 and a lower wiring 103 are connected to an electron emission part 108 through element electrodes 105 and 106, respectively. Non-evaporating getters 109 and 110 are formed on the wirings of the electron source substrate 1. As the material of the non-evaporating getters 109 and 110, a metal such as Ti and an alloy thereof is used. The electrical resistance between two continued arbitrary points of the non-evaporating getters 109 and 110 is set higher than the electrical resistance between the same two points of the wirings located under them. According to this, the dispersion of voltage drop between the wiring part, having the non-evaporating getters 109 and 110 formed thereon and the wiring part free of them, is small and the dispersion of luminance can be made small.

公开(公告)号：JP2000243238A

公开(公告)日：2000-09-08

申请号：JP3994999

申请日：1999-02-18

Applicant: CANON KK

Inventor： ARAI YOSHITAKA ,  SHIGEOKA KAZUYA ,  HASEGAWA MITSUTOSHI ,  GOFUKU IHACHIROU

IPC: H01J29/04 ,  H01J1/316 ,  H01J7/18 ,  H01J29/94 ,  H01J31/12

Abstract: PROBLEM TO BE SOLVED: To realize a structure suitable for mounting a taking member in an airtight container by comprising an electron emission element and the wirings for electron emission in the airtight container, and mounting a taking member for taking the substances existing in the atmosphere of the airtight container on the wiring. SOLUTION: An electron source substrate (rear plate) 1 of an image forming device comprises an electron emission element 4 formed between the element electrodes 5, 6 on an insulating base such as glass and the like, and is provided with an X-direction wiring (lower wiring) 2 and a Y-direction wiring (upper wiring) 3. The non-evaporation type getters 7 as a taking member are mounted on the X-direction wiring (lower wiring) 2 and the Y-direction wiring (upper wiring) 3, and their cross section has the shape of an arch formed by rounding their edges. A Zr alloy can be adapted as the non-evaporation type getter 7, and it is manufactured so as to have the arch-shaped cross section in the manufacturing. By applying this structure, the elements can be separately selected and be independently driven by using a simple matrix wiring.

公开(公告)号：JPH1154038A

公开(公告)日：1999-02-26

申请号：JP21030697

申请日：1997-08-05

Applicant: CANON KK

Inventor： ARAI YOSHITAKA ,  YAMANOBE MASATO

IPC: H01J9/39 ,  H01J9/02 ,  H01J9/38 ,  H01J9/44 ,  H01J31/12

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method which is applicable to an electron source of a picture forming device to form an high grade picture and realizes uniform electron emitting characteristics for a long time. SOLUTION: In a manufacturing method of an electron emitting element which has a forming processing to form an electron emitting part 5 on conductive film 4 spanned between element electrodes 2, 3 on a base substance 1 and an activation process applying the voltage between the element electrodes 2, 3 under the atmosphere where an organic substance is present, a plasma cleaning process, which is carried out by applying a voltage between an electron emitting element and an anode electrode arranged in an airtight container to generate plasma, is carried out in either one or more of such periods as, before or after the forming process, or after an activating process.

公开(公告)号：JPH09330658A

公开(公告)日：1997-12-22

申请号：JP17076196

申请日：1996-06-11

Applicant: CANON KK

Inventor： ARAI YOSHITAKA

IPC: H01J9/02 ,  H01J1/30 ,  H01J31/12

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing an electron emitting element realizing a uniform electron emitting characteristic, an electron source and an image forming device using an electron emitting element manufactured by this method. SOLUTION: A first thin film A mainly composed of organic system compound is manufactured on a quartz substrate, a second thin film B containing an organic metal compound as a main component is manufactured on the thin film A on the quartz substrate. After the quartz substrate, manufacturing the thin films A, B, and a base unit formed with an element electrode are set up to be opposed, by irradiation of an ultraviolet ray from a reverse side of the quartz substrate, the thin film A is decomposed, the thin film B is transcribed on the base unit. By thermal decomposition of the thin film B transcribed on the base unit, a conductive thin film is obtained.

公开(公告)号：JPH09330657A

公开(公告)日：1997-12-22

申请号：JP17076096

申请日：1996-06-11

Applicant: CANON KK

Inventor： ARAI YOSHITAKA

IPC: H01J9/02 ,  H01J1/30 ,  H01J31/12

Abstract: PROBLEM TO BE SOLVED: To form an electron emitting element of uniform characteristic over a large area easily further with a cost reduced. SOLUTION: In the case of manufacturing a surface conduction type electron emitting element having a pair of element electrodes formed to be opposed on an insulation base unit and a conductive film having an electron emitting part formed between this element electrode, the conductive film is formed by thermal decomposition of an organic metal thin film, also this organic metal thin film 202 is formed by a Langmuir-Blodgett method previously on a separate base unit 201, to be transfer taken from this base unit onto the insulation main unit 1.