1.
    发明专利
    未知

    公开(公告)号:DE60226552D1

    公开(公告)日:2008-06-26

    申请号:DE60226552

    申请日:2002-08-28

    Applicant: CANON KK

    Abstract: A joining material like an In film having a low melting point forms a surface oxide film when melted. If the oxide film is thick, an uneven surface shape will remain as it is, and can cause vacuum leakage during vacuum sealing. This problem is solved, for example, by placing particles of a refractory material inside the low melting joining material. The particles of the refractory material serve as a holding member for the low melting material and break the oxide film during a joining operation to bring the seal bonding with the low melting material to perfection.

    ENCLOSURE AND IMAGE FORMING DEVICE COMPRISING THE SAME
    4.
    发明公开
    ENCLOSURE AND IMAGE FORMING DEVICE COMPRISING THE SAME 有权
    住房及摄像装置带有这种外壳

    公开(公告)号:EP1077464A4

    公开(公告)日:2005-05-25

    申请号:EP00905289

    申请日:2000-02-23

    Applicant: CANON KK

    CPC classification number: H01J29/86 H01J9/261 H01J31/123 H01J2209/264

    Abstract: An enclosure for image forming devices manufactured by a method including a bonding step at which the bonding is conducted at a temperature lower than 400 DEG C being the lowest temperature necessary at a frit-bonding step, having merits such that the luminescence hardly lowers, the life is long, the display quality is high, and the gettering effect is sufficient. The bonding part between a rear plate (2) and an outer frame (3) and between the face plate (4) and the outer frame (3) is bonded with an adhesive (9) and a sealant (14). The sealant is selected from among metals including In, Al, Cu, Au, Ag, Pt, Ti, and Ni, their alloys, and organic or inorganic adhesives containing a coated metal or alloy selected from the metals and their alloys. The adhesive (9) is selected from among organic adhesives including polyphenyl compounds, polybenzimidazole resins, and polyimide resins, and inorganic adhesives including aluminum, silica, zirconia, and carbon.

    ALIGNER AND ALIGNING METHOD
    5.
    发明专利

    公开(公告)号:JPH0766111A

    公开(公告)日:1995-03-10

    申请号:JP21608293

    申请日:1993-08-31

    Applicant: CANON KK

    Abstract: PURPOSE:To provide aligner and aligning method in which the magnification of projection lens can be adjusted by detecting the positional shift of a pattern directly while enhancing the correction accuracy. CONSTITUTION:A first controller 611 measures the relative position between a first substrate side mark formed on a transparent substrate 2 and a first holder side detection mark formed on a holder 13 for a substrate to be exposed based on an output signal from a first CCD camera 521. A second controller 612 measures the relative position between a second substrate side mark and a second holder side mark based on an output signal from a second CCD camera 522. Magnification of a projection lens 32 is calculated based on the relative positions measured by the fist and second controllers 611, 612 which then drive the leans-barrel for adjusting the magnification of the projection lens 32 depending on the calculated magnification of lens thus correcting the magnification of the projection lens 32.

    IMAGE DISPLAY DEVICE
    6.
    发明专利

    公开(公告)号:JP2000251769A

    公开(公告)日:2000-09-14

    申请号:JP4919999

    申请日:1999-02-25

    Applicant: CANON KK

    Abstract: PROBLEM TO BE SOLVED: To provide an enclosure for an image display device less in brightness reduction or life shortening, and sufficient in getter effect, by realizing an adhesion process at a temperature about 400 deg.C or below required at the minimum for a frit adhesion (sealing) process. SOLUTION: A rear plate 2 and a face plate 4 are joined respectively at joining parts to an outer frame 3 through polymer thermoplastic adhesives 9, 14 containing a polyphenyl compound. As the adhesives, a polymer thermoplastic adhesive containing polyether, polysulfone or polyether ketone, of the like is named. Especially a polymer thermoplastic sheet-shaped adhesive mainly composed of polyether ketone is used and heated to 330 deg.C or higher, to soften and crimp the adhesive, and the adhesive is hardened and bonded in a temperature-lowering process. Polyether ketone is preferable compared with other adhesives, especially from the viewpoint of a small quantity of emission gas in a vacuum baking process.

    ENCLOSURE AND IMAGE FORMING DEVICE BY USING IT

    公开(公告)号:JP2000251768A

    公开(公告)日:2000-09-14

    申请号:JP4919699

    申请日:1999-02-25

    Applicant: CANON KK

    Abstract: PROBLEM TO BE SOLVED: To provide an enclosure for an image display device less in brightness reduction or life shortening, high in display quality, and sufficient in getter effect, by realizing an adhesion process at a temperature about 400 deg.C or below required at the minimum for a frit adhesion (sealing) process. SOLUTION: A rear plate 2 and a face plate 4 are joined respectively at joining parts to an outer frame 3 by an adhesive 9 and sealing material 14. The sealing material is selected from metals or alloys, such as In, Al, Cu, Au, Ag, Pt, Ti, Ni or the like, or organic adhesives, inorganic adhesives or the like with surfaces coated with the metal or the alloy. The adhesive is selected from organic adhesives containing a polyphenyl compound, a polybenzimidazole resin, a polyimide resin or the like, inorganic adhesives containing alumina, silica, zirconia or carbon, or the like.

    METHOD FOR BONDING SILICON WAFER TO GLASS
    8.
    发明专利

    公开(公告)号:JP2003221284A

    公开(公告)日:2003-08-05

    申请号:JP2002023717

    申请日:2002-01-31

    Applicant: CANON KK

    Inventor: UEDA HIROHARU

    Abstract: PROBLEM TO BE SOLVED: To provide a method for bonding a silicon wafer to glass, where a device formed in the silicon wafer suffers no thermal damage on bonding a silicon wafer to a glass substrate so that flexibility in selecting glass materials can be increased. SOLUTION: In the method, one body to be bonded, which consists of silicon, is bonded to the other body to be bonded, which consists of glass having a coefficient of thermal expansion at least larger than that of silicon. The silicon and the glass have minute irregularities on their bonding surfaces and a layer of bonding metal, which consists of a metal material having a lower melting point, is held between a pair of the silicon and the glass body to be bonded. The pair of bodies to be bonded is heated in vacuum and the temperature for melting the bonding metal is held for a prescribed time, so that the bonding metal is penetrated into the irregularities provided on the bonding surface layers. COPYRIGHT: (C)2003,JPO

    IMAGE DISPLAY DEVICE AND ITS MANUFACTURING METHOD

    公开(公告)号:JP2003151476A

    公开(公告)日:2003-05-23

    申请号:JP2002252247

    申请日:2002-08-30

    Applicant: CANON KK

    Abstract: PROBLEM TO BE SOLVED: To provide an image display device with little vacuum leak, high reliability, and good display quality. SOLUTION: This image display device is provided with an envelope having a first substrate 21 and a second substrate 82 opposing arranged to the first substrate 21 at some interval, and an image display means arranged in the envelope. The first substrate 21 and the second substrate 82 are sealed with a low melting point metal bonding member 203 having a member 205 of high melting point material therein at a circumference part of the first substrate 21 or the second substrate 82.

    DISPLAY PANEL AND ITS SEALING METHOD AND IMAGE DISPLAY DEVICE HAVING THE SAME

    公开(公告)号:JP2003109521A

    公开(公告)日:2003-04-11

    申请号:JP2001301999

    申请日:2001-09-28

    Applicant: CANON KK

    Abstract: PROBLEM TO BE SOLVED: To enable to adopt different kinds of glass material that have a difference of the thermal expansion coefficient of more than 2×10 / deg.C in the rear plate and face plate. SOLUTION: This is a display panel in which an outer case 90 is formed of a rear plate 81 and a face plate which are arranged opposed to each other and a support frame 86 of which on one end the face plate 82 is jointed and on the other end the rear plate 81 is jointed. The face plate 82 and one end of the support frame 86 are jointed by a jointing member 206 that has a melting point at a prescribed temperature and also has elasticity.

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