Abstract:
A method for producing radiofrequency communication devices with or without an operation switch and devices obtained. The invention relates to a method for producing a radiofrequency communication device comprising an electronic component, an antennae circuit associated with the electronic component and a switch on the circuit capable of switching off the antennae circuit; the method being differentiated in that comprises the following steps: - the antennae (22) is made with a portion in the form of a closed circuit (15, 17) in a reception zone of the switch, - an interrupting zone (I) of the antennae circuit is created on the said portion at least by removing matter from the antenna. The invention also relates to the resulting devices.
Abstract:
The invention relates to a method for manufacturing a device (1) with a secure integrated-circuit chip, said device having an insulating substrate (14, 24, 24R), electrically conductive surfaces (23, 33, 43, 53, 63) on the substrate, which surfaces are connected or coupled to said electronic chip (30), said electrically conductive surfaces being produced by a step of depositing or transferring conductive material; the method is characterised in that said step of depositing or transferring conductive material is carried out by a technique of directly depositing metal microparticles, which are free of polymer or solvent, onto the substrate, said deposit being obtained by coalescence of the microparticles forming at least one or more uniform cohesive layers that rest directly in contact with the substrate. The invention also relates to the device obtained.
Abstract:
L'invention concerne un procédé de fabrication d'un objet portable (8) à puce électronique comprenant un corps (1) et une batterie du type métal-air intégrée dans le corps, ladite batterie comprenant une couche d'électrolyte (2e) et une membrane de protection (3m) poreuse à l'air recouvrant l'électrolyte. Le procédé est caractérisé en ce qu'il une étape de formation d'au moins un conduit d'alimentation en air s'étendant de la membrane de protection (3m) jusqu'à une source d'air, une matière (3a, 3c, 3f) poreuse à l'air étant contenue dans ledit conduit et obturant complétement ledit conduit sur son parcours au moins par endroit de son parcours. L'invention concerne également l'objet correspondant au procédé
Abstract:
L'invention concerne un procédé de réalisation d'un dispositif multi-composant comprenant les étapes suivantes, - réalisation d'un module (1) à structure multi couches comportant des composants électriques / électroniques (C10, C20) disposés sur au moins un substrat en couches superposées, les composants présentant chacun une face principale (F1, F2) exposée vers l'extérieur, caractérisé en ce que les composants sont agencés de manière à présenter leur face principale respective (F1, F2) orientée dans des directions opposées l'une par rapport à l'autre. L'invention concerne également le dispositif correspondant.
Abstract:
The invention relates to an electronic module (10) comprising a dielectric support film (11) having a first side, conductor paths (20) that are printed on said first side, and a semiconductor component (15) which connects the conductor paths by means of electrical connections. The electronic module (10) of the invention is characterized in that each electrical connection includes a lead wire (19, 24) that connects a contact of the semiconductor component to each path directly or via an island or an interconnection pad (17).
Abstract:
The invention relates to a chip holder, such as a smartcard (2), comprising: a holding body element, such as a card body (4), comprising a printed circuit board (14) and a photovoltaic sensor (12) that is at least partially transparent to visible light and that extends over at least part of one face of the holding body element and that is electrically connected to the printed circuit board by an electrical connection; and a layer or film of a material that is opaque to visible light, which layer or film is located between the printed circuit board and the photovoltaic sensor (12) and at least partially masks the printed circuit board, characterised in that said electrical connection extends through an aperture in the opaque film or layer.
Abstract:
The invention relates to a device having an integrated-circuit chip, and including an insulating body (2) containing at least one conductive pad (3, 4), at least one electrical contact (5, 6) opposite said electrically conductive pad, at least one recess (7, 8) provided in the body, including a bottom (9, 10) and one aperture (11, 12), said recess being connected, at the bottom thereof, to the conductive pad (3, 4) and, at the aperture thereof, to the electrical contact (5, 6). The device further includes at least one coil spring (12, 13) arranged in the recess (8) and connecting the conductive pad to the electrical contact. The device is characterized in that it includes means (8, 16, 42) configured to facilitate the installation of the spring in the recess thereof and to support same at least by means of the friction of the central portion (C) of the spring relative to the walls of the recess thereof. The invention also relates to a method for producing an electrical connection between at least one conductive pad arranged in an insulating body and at least one electrical contact arranged opposite said electrically conductive pad.