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    TRIVALENT CHROMIUM ELECTROPLATING SOLUTION
    31.
    发明专利
    TRIVALENT CHROMIUM ELECTROPLATING SOLUTION 未知

    公开(公告)号：AU5268979A

    公开(公告)日：1980-05-15

    申请号：AU5268979

    申请日：1979-11-09

    Applicant: IBM

    Inventor： BARCLAY DONALD JOHN ,  VIGAR JAMES MICHAEL LINFORD

    IPC: C25D3/06 ,  C25D3/10 ,  C25D5/14

    Abstract: A very low concentration trivalent chromium plating bath in which the source of chromium is an aqueous solution of a chromium (III)- thiocyanate complex (Cr less than 0.03 M) gives a deposit of unexpectedly light colour. Such a bath is employed to produce thin overcoatings of light coloured chromium and may replace the rinse tank of a first chromium (III)- thiocyanate process which is optimized for efficiency and bath stability rather than colour.

    33.
    发明专利
    未知

    公开(公告)号：DK151975C

    公开(公告)日：1988-06-06

    申请号：DK475879

    申请日：1979-11-09

    Applicant: IBM

    Inventor： BARCLAY DONALD JOHN ,  VIGAR JAMES MICHAEL LINFORD

    IPC: C25D3/06 ,  C25D5/14

    Abstract: A very low concentration (below 0.03 M) trivalent chromium plating bath in which the source of chromium is an equilibrated aqueous solution of a chromium (III) - thiocyanate complex gives a deposit of unexpectedly light color. Such a bath is employed to produce thin overcoatings of light colored chromium for decorative applications. The bath and process is also used to plate the initial layer of a thick (greater than 5 micron) deposit for engineering applications, the major part of which is plated from a higher chromium concentration bath. Such thick deposits from a higher concentration bath are more cohesive and smoother when plated over an initial layer from the low concentration bath.

    ELECTRODEPOSITION OF CHROMIUM AND ITS ALLOYS
    34.
    发明专利
    ELECTRODEPOSITION OF CHROMIUM AND ITS ALLOYS 未知

    公开(公告)号：DE3278369D1

    公开(公告)日：1988-05-26

    申请号：DE3278369

    申请日：1982-12-10

    Applicant: IBM

    Inventor： BARCLAY DONALD JOHN

    IPC: C25D3/06 ,  C25D5/34

    Abstract: A process for electroplating chromium comprising pre-treating the surface of a part to be plated with chromium by forming a deposit of a sulphur compound thereon, which sulphur compound accelerates the reduction of chromium ions to chromium metal. Preferably the deposit is formed cathodically in a solution containing a sulphur species. The sulphur species include thiocyanate, or species having S-O or S-S bonds: or a species having a -C=S or -C-S group within the molecule. Alternatively the sulphur compound can be chemically deposited by evaporating sulphur on to the surface or by immersing the part in a solution of sulphide ions.

    39.
    发明专利
    未知

    公开(公告)号：AT15239T

    公开(公告)日：1985-09-15

    申请号：AT82306020

    申请日：1982-11-11

    Applicant: IBM

    Inventor： BARCLAY DONALD JOHN ,  MORGAN WILLIAM MORRIS ,  VIGAR JAMES MICHAEL LINFORD

    IPC: C25D3/06 ,  C25D3/10 ,  C25D3/56

    Abstract: A chromium electroplating electrolyte containing trivalent chromium ions, a complexant, a buffer agent and thiocyanate ions for promoting chromium deposition, the thiocyanate having a molar concentration lower than that of the chromium ions. The chromium preferably has a concentration lower than 0.01M. Preferably the complexant is selected so that the stability constant K1 of chromium complex is in the range 10 M . Complexants in this range include aspartic acid, iminodiacetic acid, nitrilotriacetic acid and 5-sulphosalicylic acid.

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