公开(公告)号：US20220407202A1

公开(公告)日：2022-12-22

申请号：US17350791

申请日：2021-06-17

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Neelam PRABHU GAUNKAR ,  Georgios C. DOGIAMIS ,  Veronica STRONG ,  Aleksandar ALEKSOV

IPC: H01P3/00 ,  H01L23/15 ,  H01L23/498 ,  H01L23/66

Abstract: Embodiments disclosed herein include coplanar waveguides and methods of forming coplanar waveguides. In an embodiment, a coplanar waveguide comprises a core, and a signal trace on the core. In an embodiment, the signal trace has a first edge and a second edge. In an embodiment, a first ground trace is over the core, and the first ground trace is adjacent to the first edge of the signal trace. In an embodiment, a first ground via plane is below the first ground trace. The coplanar waveguide may further comprise a second ground trace over the core, and the second ground trace is adjacent to the second edge of the signal trace. In an embodiment, a second ground via plane below the second ground trace.

公开(公告)号：US20220406696A1

公开(公告)日：2022-12-22

申请号：US17349697

申请日：2021-06-16

Applicant: Intel Corporation

Inventor： Aleksandar ALEKSOV ,  Telesphor KAMGAING ,  Veronica STRONG ,  Georgios C. DOGIAMIS ,  Neelam PRABHU GAUNKAR

IPC: H01L23/498 ,  H01L23/15 ,  H01L21/48 ,  H01L23/00

Abstract: Embodiments disclosed herein include package substrates and methods of forming such package substrates. In an embodiment the package substrate comprises a core and buildup layers on the core. In an embodiment, first level interconnect (FLI) pads are on a topmost buildup layer, and the FLI pads have a pitch. In an embodiment, a plurality of vertically oriented planes are embedded in the core, and the vertically oriented planes are spaced at the pitch.

公开(公告)号：US20220394858A1

公开(公告)日：2022-12-08

申请号：US17339420

申请日：2021-06-04

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING

IPC: H05K3/40 ,  H05K1/11

Abstract: Embodiments disclosed herein comprise package substrates and methods of forming package substrates. In an embodiment, a package substrate comprises a core substrate. A hole is disposed into the core substrate, and a via is disposed in the hole. In an embodiment, the via completely fills the hole. In an embodiment, a method of forming a package substrate comprises exposing a region of a core substrate with a laser. In an embodiment, the laser changes the morphology of the exposed region. The method may further comprise etching the core substrate, where the exposed region etches at a faster rate than the remainder of the core substrate to form a hole in the core substrate. The method may further comprise disposing a via in the hole.

公开(公告)号：US20220394849A1

公开(公告)日：2022-12-08

申请号：US17339434

申请日：2021-06-04

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING

IPC: H05K1/03 ,  H05K1/11 ,  H05K3/40

Abstract: Embodiments disclosed herein include package substrates for electronic packaging applications. In an embodiment, a package substrate comprises a first glass layer, where the first glass layer comprises a first via through the first glass layer, and the first via has an hourglass shaped cross-section. The package substrate may further comprise a second glass layer over the first glass layer, where the second glass layer comprises a second via through the second glass layer, and where the second via has the hourglass shaped cross-section. In an embodiment, the first via is electrically coupled to the second via.

公开(公告)号：US20210400740A1

公开(公告)日：2021-12-23

申请号：US17462855

申请日：2021-08-31

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING

IPC: H04W76/10 ,  H01L25/065 ,  H01L25/16 ,  H01L23/66 ,  H01Q1/22 ,  H04B1/48 ,  H01L23/00 ,  H04Q1/02 ,  H05K7/14

Abstract: A patch on interposer (PoINT) package is described with a wireless communications interface. Some examples include an interposer, a main patch attached to the interposer, a main integrated circuit die attached to the patch, a second patch attached to the interposer, and a millimeter wave radio die attached to the second patch and coupled to the main integrated circuit die through the interposer to communicate data between the main die and an external component.

公开(公告)号：US20210194966A1

公开(公告)日：2021-06-24

申请号：US16757751

申请日：2017-12-30

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Sasha N. OSTER ,  Adel A. ELSHERBINI ,  Erich N. EWY ,  Johanna M. SWAN ,  Telesphor KAMGAING

IPC: H04L29/08 ,  H01P3/08 ,  H04L5/14 ,  G08C23/06 ,  H04B1/3822 ,  B60R16/023 ,  B60R16/03

Abstract: Embodiments include a sensor node, an active sensor node, and a vehicle with a communication system that includes sensor nodes. The sensor node include a package substrate, a diplexer/combiner block on the package substrate, a transceiver communicatively coupled to the diplexer/combiner block, and a first mm-wave launcher coupled to the diplexer/combiner block. The sensor node may have a sensor communicatively coupled to the transceiver, the sensor is communicatively coupled to the transceiver by an electrical cable and located on the package substrate. The sensor node may include that the sensor operates at a frequency band for communicating with an electronic control unit (ECU) communicatively coupled to the sensor node. The sensor node may have a filter communicatively coupled to the diplexer/combiner block, the transceiver communicatively coupled to the filter, the filter substantially removes frequencies from RF signals other than the frequency band of the sensor.

公开(公告)号：US20200287520A1

公开(公告)日：2020-09-10

申请号：US16648639

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Feras EID ,  Georgios C. DOGIAMIS ,  Vijay K. NAIR ,  Johanna M. SWAN

IPC: H03H9/54 ,  H03H9/13 ,  H03H9/56 ,  H03H9/05

Abstract: Hybrid filters and more particularly filters having acoustic wave resonators (AWRs) and lumped component (LC) resonators and packages therefor are described. In an example, a packaged filter includes a package substrate, the package substrate having a first side and a second side, the second side opposite the first side. A first acoustic wave resonator (AWR) device is coupled to the package substrate, the first AWR device comprising a resonator. A plurality of inductors is in the package substrate.

公开(公告)号：US20200259478A1

公开(公告)日：2020-08-13

申请号：US16648115

申请日：2017-12-28

Applicant: Intel Corporation

Inventor： Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Feras EID ,  Vijay K. NAIR ,  Johanna M. SWAN

IPC: H03H9/05 ,  H03H9/10 ,  H03H9/13 ,  H03H9/54 ,  H03H9/52

Abstract: Embodiments of the invention include an acoustic wave resonator (AWR) module. In an embodiment, the AWR module may include a first AWR substrate and a second AWR substrate affixed to the first AWR substrate. In an embodiment, the first AWR substrate and the second AWR substrate define a hermetically sealed cavity. A first AWR device may be positioned in the cavity and formed on the first AWR substrate, and a second AWR device may be positioned in the cavity and formed on the second AWR substrate. In an embodiment, a center frequency of the first AWR device is different than a center frequency of the second AWR device. In additional embodiment of the invention, the AWR module may be integrated into a hybrid filter. The hybrid filter may include an AWR module and other RF passive devices embedded in a packaging substrate.

公开(公告)号：US20200045754A1

公开(公告)日：2020-02-06

申请号：US16600276

申请日：2019-10-11

Applicant: Intel Corporation

Inventor： Telesphor KAMGAING ,  Rahul KHANNA

IPC: H04W76/10 ,  H01L25/065 ,  H01L25/16 ,  H01L23/66 ,  H01Q1/22 ,  H04B1/48 ,  H01L23/00 ,  H04Q1/02 ,  H05K7/14

Abstract: A blade computing system is described with a wireless communication between blades. In one embodiment, the system includes a first blade in the enclosure having a radio transceiver to communicate with a radio transceiver of a second blade in the enclosure. The second blade has a radio transceiver to communicate with the radio transceiver of the first blade. A switch in the enclosure communicates with the first blade and the second blade and establishes a connection through the respective radio transceivers between the first blade and the second blade.

公开(公告)号：US20180331051A1

公开(公告)日：2018-11-15

申请号：US15776021

申请日：2015-12-22

Applicant: Georgios C. DOGLAMIS ,  Telesphor KAMGAING ,  Eric J. LI ,  Javier A. FALCON ,  INTEL CORPORATION

Inventor： Georgios C. DOGIAMIS ,  Telesphor KAMGAING ,  Eric J. LI, Sr. ,  Javier A. FALCON ,  Yoshihiro TOMITA ,  Vijay K. NAIR ,  Shawna M. LIFF

IPC: H01L23/66 ,  H01L23/552 ,  H01L25/16 ,  H01L23/498 ,  H01L23/31

Abstract: Embodiments of the invention include a microelectronic device that includes a first die having a silicon based substrate and a second die coupled to the first die. In one example, the second die is formed with compound semiconductor materials. The microelectronic device includes a substrate that is coupled to the first die with a plurality of electrical connections. The substrate including an antenna unit for transmitting and receiving communications at a frequency of approximately 4 GHz or higher.