公开(公告)号：US20160126696A1

公开(公告)日：2016-05-05

申请号：US14931883

申请日：2015-11-04

Applicant: Innovative Micro Technology

Inventor： Christopher S. GUDEMAN

IPC: H01S5/022 ,  H04B10/516 ,  G02B27/09 ,  H01S5/026 ,  G02F1/09

CPC classification number: H04B10/516 ,  B81B7/0067 ,  B81C1/00301 ,  G02B27/0955 ,  H01S5/0064 ,  H01S5/021 ,  H01S5/02216 ,  H01S5/02248 ,  H01S5/02288 ,  H01S5/02292 ,  H01S5/02296 ,  H01S5/0607 ,  H01S5/4025 ,  H01S5/4031

Abstract: A microfabricated optical apparatus that includes a light source driven by a waveform, a turning mirror, and a beam shaping element, wherein the waveform is delivered to the light source by at least one through silicon via.

Abstract translation: 一种微波加工的光学装置，包括由波形驱动的光源，转向镜和光束整形元件，其中波形通过至少一个通过硅通孔传送到光源。

公开(公告)号：US20150266726A1

公开(公告)日：2015-09-24

申请号：US14194794

申请日：2014-03-02

Applicant: Innovative Micro Technology

Inventor： Christopher S. GUDEMAN ,  Prosenjit Sen

IPC: B81C1/00

CPC classification number: B81C1/00269 ,  B81C1/00849 ,  B81C2203/019

Abstract: Systems and methods for forming an encapsulated device include a substantially hermetic seal which seals a device in an environment between two substrates. The substantially hermetic seal is formed by an alloy of two metal layers, one having a lower melting temperature than the other. The metal layers may be deposited two substrates, along with a raised feature formed under at least one of the metal layers. The two metals may form an alloy of a predefined stoichiometry in at least two locations on either side of the midpoint of the raised feature. The formation of the alloy may be improved by the use of an organic wetting layer adjacent to the lower melting temperature metal. Design guidelines are set forth for reducing or eliminating the leakage of molten metal into the areas adjacent to the bondlines.

Abstract translation: 用于形成封装装置的系统和方法包括在两个基板之间的环境中密封装置的基本上气密的密封。 基本上气密的密封由两个金属层的合金形成，一个熔化温度低于另一个。 金属层可以沉积两个基底，以及形成在至少一个金属层下面的凸起特征。 两种金属可以在凸起特征的中点的任一侧上的至少两个位置中形成预定化学计量的合金。 可以通过使用与较低熔点金属相邻的有机润湿层来改善合金的形成。 阐述了设计准则，以减少或消除熔融金属泄漏到与粘接线相邻的区域。