公开(公告)号：US20150069618A1

公开(公告)日：2015-03-12

申请号：US13987871

申请日：2013-09-11

Applicant: Innovative Micro Technology

Inventor： Christopher S. Gudeman ,  Prosenjit Sen

IPC: H01L21/48 ,  H01L23/48

CPC classification number: H01L21/486 ,  B81B7/007 ,  B81B2207/095 ,  B81B2207/096 ,  B81C1/00095 ,  H01L21/76898 ,  H01L23/481 ,  H01L31/02167 ,  H01L31/03529 ,  H01L31/052 ,  H01L31/068 ,  H01L2924/0002 ,  Y02E10/547 ,  H01L2924/00

Abstract: A method for forming through substrate vias (TSVs) in a non-conducting, glass substrate is disclosed. The method involves patterning a silicon template substrate with a plurality of lands and spaces, bonding a slab or wafer of glass to the template substrate, and melting the glass so that it flows into the spaces formed in the template substrate. The template substrate may then be removed to leave a plurality of TSVs in the glass slab or wafer.

Abstract translation: 公开了一种用于在非导电玻璃基板中形成贯穿衬底通孔（TSV）的方法。 该方法包括用多个焊盘和间隔图案化硅模板衬底，将玻璃板或玻璃晶片粘合到模板衬底上，并使玻璃熔化，使其流入模板衬底中形成的空间。 然后可以移除模板衬底以在玻璃板或晶片中留下多个TSV。

公开(公告)号：US09162878B2

公开(公告)日：2015-10-20

申请号：US14194794

申请日：2014-03-02

Applicant: Innovative Micro Technology

Inventor： Christopher S Gudeman ,  Prosenjit Sen

IPC: H01L21/56 ,  B81C1/00

CPC classification number: B81C1/00269 ,  B81C1/00849 ,  B81C2203/019

Abstract: Systems and methods for forming an encapsulated device include a substantially hermetic seal which seals a device in an environment between two substrates. The substantially hermetic seal is formed by an alloy of two metal layers, one having a lower melting temperature than the other. The metal layers may be deposited two substrates, along with a raised feature formed under at least one of the metal layers. The two metals may form an alloy of a predefined stoichiometry in at least two locations on either side of the midpoint of the raised feature. The formation of the alloy may be improved by the use of an organic wetting layer adjacent to the lower melting temperature metal. Design guidelines are set forth for reducing or eliminating the leakage of molten metal into the areas adjacent to the bondlines.

Abstract translation: 用于形成封装装置的系统和方法包括在两个基板之间的环境中密封装置的基本上气密的密封。 基本上气密的密封由两个金属层的合金形成，一个熔化温度低于另一个。 金属层可以沉积两个基底，以及形成在至少一个金属层下面的凸起特征。 两种金属可以在凸起特征的中点的任一侧上的至少两个位置中形成预定化学计量的合金。 可以通过使用与较低熔点金属相邻的有机润湿层来改善合金的形成。 阐述了设计准则，以减少或消除熔融金属泄漏到与粘接线相邻的区域。

公开(公告)号：US20150266726A1

公开(公告)日：2015-09-24

申请号：US14194794

申请日：2014-03-02

Applicant: Innovative Micro Technology

Inventor： Christopher S. GUDEMAN ,  Prosenjit Sen

IPC: B81C1/00

CPC classification number: B81C1/00269 ,  B81C1/00849 ,  B81C2203/019

Abstract: Systems and methods for forming an encapsulated device include a substantially hermetic seal which seals a device in an environment between two substrates. The substantially hermetic seal is formed by an alloy of two metal layers, one having a lower melting temperature than the other. The metal layers may be deposited two substrates, along with a raised feature formed under at least one of the metal layers. The two metals may form an alloy of a predefined stoichiometry in at least two locations on either side of the midpoint of the raised feature. The formation of the alloy may be improved by the use of an organic wetting layer adjacent to the lower melting temperature metal. Design guidelines are set forth for reducing or eliminating the leakage of molten metal into the areas adjacent to the bondlines.

Abstract translation: 用于形成封装装置的系统和方法包括在两个基板之间的环境中密封装置的基本上气密的密封。 基本上气密的密封由两个金属层的合金形成，一个熔化温度低于另一个。 金属层可以沉积两个基底，以及形成在至少一个金属层下面的凸起特征。 两种金属可以在凸起特征的中点的任一侧上的至少两个位置中形成预定化学计量的合金。 可以通过使用与较低熔点金属相邻的有机润湿层来改善合金的形成。 阐述了设计准则，以减少或消除熔融金属泄漏到与粘接线相邻的区域。