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公开(公告)号:US20200294301A1
公开(公告)日:2020-09-17
申请号:US16355364
申请日:2019-03-15
Applicant: Intel Corporation
Inventor: Prasoonkumar Surti , Arthur Hunter, JR. , Kamal Sinha , Scott Janus , Brent Insko , Vasanth Ranganathan , Lakshminarayanan Striramassarma
Abstract: Embodiments are generally directed to multi-tile graphics processor rendering. An embodiment of an apparatus includes a memory for storage of data; and one or more processors including a graphics processing unit (GPU) to process data, wherein the GPU includes a plurality of GPU tiles, wherein, upon geometric data being assigned to each of a plurality of screen tiles, the apparatus is to transfer the geometric data to the plurality of GPU tiles.
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公开(公告)号:US10580109B2
公开(公告)日:2020-03-03
申请号:US16417899
申请日:2019-05-21
Applicant: Intel Corporation
Inventor: Altug Koker , Lakshminarayanan Striramassarma , Akif Ali
Abstract: One embodiment provides for a processor comprising a three-dimensional (3D) integrated circuit stack including multiple graphics processor cores and interconnect logic to interconnect the graphics processor cores of the 3D integrated circuit stack to enable data distribution between the graphics processor cores over a virtual channel including multiple programmatically pre-assigned traffic classifications.
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公开(公告)号:US20190272615A1
公开(公告)日:2019-09-05
申请号:US16417899
申请日:2019-05-21
Applicant: Intel Corporation
Inventor: Altug Koker , Lakshminarayanan Striramassarma , Akif Ali
Abstract: One embodiment provides for a processor comprising a three-dimensional (3D) integrated circuit stack including multiple graphics processor cores and interconnect logic to interconnect the graphics processor cores of the 3D integrated circuit stack to enable data distribution between the graphics processor cores over a virtual channel including multiple programmatically pre-assigned traffic classifications.
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公开(公告)号:US10346946B2
公开(公告)日:2019-07-09
申请号:US16039509
申请日:2018-07-19
Applicant: Intel Corporation
Inventor: Altug Koker , Lakshminarayanan Striramassarma , Akif Ali
Abstract: In on embodiment, a hybrid fabric interconnects multiple graphics processor cores within a processor. The hybrid fabric interconnect includes multiple data channels, including programmable virtual data channels. The virtual data channels carry multiple traffic classes of packet-based messages. The virtual data channels and multiple traffic classes may be assigned one of multiple priorities. The virtual data channels may be arbitrated independently. The hybrid fabric is scalable and can support multiple topologies, including multiple stacked integrated circuit topologies.
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公开(公告)号:US12182035B2
公开(公告)日:2024-12-31
申请号:US17428529
申请日:2020-03-14
Applicant: Intel Corporation
Inventor: Altug Koker , Joydeep Ray , Elmoustapha Ould-Ahmed-Vall , Abhishek Appu , Aravindh Anantaraman , Valentin Andrei , Durgaprasad Bilagi , Varghese George , Brent Insko , Sanjeev Jahagirdar , Scott Janus , Pattabhiraman K , SungYe Kim , Subramaniam Maiyuran , Vasanth Ranganathan , Lakshminarayanan Striramassarma , Xinmin Tian
IPC: G06F12/00 , G06F12/0875 , G06F12/0891 , G06F12/123 , G06T1/60
Abstract: Systems and methods for improving cache efficiency and utilization are disclosed. In one embodiment, a graphics processor includes processing resources to perform graphics operations and a cache controller of a cache memory that is coupled to the processing resources. The cache controller is configured to set an initial aging policy using an aging field based on age of cache lines within the cache memory and to determine whether a hint or an instruction to indicate a level of aging has been received.
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公开(公告)号:US12141094B2
公开(公告)日:2024-11-12
申请号:US17428233
申请日:2020-03-14
Applicant: INTEL CORPORATION
Inventor: Prasoonkumar Surti , Subramaniam Maiyuran , Valentin Andrei , Abhishek Appu , Varghese George , Altug Koker , Mike Macpherson , Elmoustapha Ould-Ahmed-Vall , Vasanth Ranganathan , Joydeep Ray , Lakshminarayanan Striramassarma , SungYe Kim
IPC: G06F9/30 , G06F7/544 , G06F7/575 , G06F7/58 , G06F9/38 , G06F9/50 , G06F12/02 , G06F12/06 , G06F12/0802 , G06F12/0804 , G06F12/0811 , G06F12/0862 , G06F12/0866 , G06F12/0871 , G06F12/0875 , G06F12/0882 , G06F12/0888 , G06F12/0891 , G06F12/0893 , G06F12/0895 , G06F12/0897 , G06F12/1009 , G06F12/128 , G06F15/78 , G06F15/80 , G06F17/16 , G06F17/18 , G06T1/20 , G06T1/60 , H03M7/46 , G06N3/08 , G06T15/06
Abstract: Embodiments described herein include software, firmware, and hardware logic that provides techniques to perform arithmetic on sparse data via a systolic processing unit. One embodiment provides techniques to optimize training and inference on a systolic array when using sparse data. One embodiment provides techniques to use decompression information when performing sparse compute operations. One embodiment enables the disaggregation of special function compute arrays via a shared reg file. One embodiment enables packed data compress and expand operations on a GPGPU. One embodiment provides techniques to exploit block sparsity within the cache hierarchy of a GPGPU.
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公开(公告)号:US12112398B2
公开(公告)日:2024-10-08
申请号:US18470652
申请日:2023-09-20
Applicant: Intel Corporation
Inventor: Naveen Matam , Lance Cheney , Eric Finley , Varghese George , Sanjeev Jahagirdar , Altug Koker , Josh Mastronarde , Iqbal Rajwani , Lakshminarayanan Striramassarma , Melaku Teshome , Vikranth Vemulapalli , Binoj Xavier
CPC classification number: G06T1/20 , G06F13/4027
Abstract: Embodiments described herein provide techniques to disaggregate an architecture of a system on a chip integrated circuit into multiple distinct chiplets that can be packaged onto a common chassis. In one embodiment, a graphics processing unit or parallel processor is composed from diverse silicon chiplets that are separately manufactured. A chiplet is an at least partially and distinctly packaged integrated circuit that includes distinct units of logic that can be assembled with other chiplets into a larger package. A diverse set of chiplets with different IP core logic can be assembled into a single device.
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公开(公告)号:US20240320184A1
公开(公告)日:2024-09-26
申请号:US18620284
申请日:2024-03-28
Applicant: Intel Corporation
Inventor: Altug Koker , Ben Ashbaugh , Scott Janus , Aravindh Anantaraman , Abhishek R. Appu , Niranjan Cooray , Varghese George , Arthur Hunter , Brent E. Insko , Elmoustapha Ould-Ahmed-Vall , Selvakumar Panneer , Vasanth Ranganathan , Joydeep Ray , Kamal Sinha , Lakshminarayanan Striramassarma , Prasoonkumar Surti , Saurabh Tangri
IPC: G06F15/78 , G06F7/544 , G06F7/575 , G06F7/58 , G06F9/30 , G06F9/38 , G06F9/50 , G06F12/02 , G06F12/06 , G06F12/0802 , G06F12/0804 , G06F12/0811 , G06F12/0862 , G06F12/0866 , G06F12/0871 , G06F12/0875 , G06F12/0882 , G06F12/0888 , G06F12/0891 , G06F12/0893 , G06F12/0895 , G06F12/0897 , G06F12/1009 , G06F12/128 , G06F15/80 , G06F17/16 , G06F17/18 , G06N3/08 , G06T1/20 , G06T1/60 , G06T15/06 , H03M7/46
CPC classification number: G06F15/7839 , G06F7/5443 , G06F7/575 , G06F7/588 , G06F9/3001 , G06F9/30014 , G06F9/30036 , G06F9/3004 , G06F9/30043 , G06F9/30047 , G06F9/30065 , G06F9/30079 , G06F9/3887 , G06F9/5011 , G06F9/5077 , G06F12/0215 , G06F12/0238 , G06F12/0246 , G06F12/0607 , G06F12/0802 , G06F12/0804 , G06F12/0811 , G06F12/0862 , G06F12/0866 , G06F12/0871 , G06F12/0875 , G06F12/0882 , G06F12/0888 , G06F12/0891 , G06F12/0893 , G06F12/0895 , G06F12/0897 , G06F12/1009 , G06F12/128 , G06F15/8046 , G06F17/16 , G06F17/18 , G06T1/20 , G06T1/60 , H03M7/46 , G06F9/3802 , G06F9/3818 , G06F9/3867 , G06F2212/1008 , G06F2212/1021 , G06F2212/1044 , G06F2212/302 , G06F2212/401 , G06F2212/455 , G06F2212/60 , G06N3/08 , G06T15/06
Abstract: Embodiments are generally directed to a multi-tile architecture for graphics operations. An embodiment of an apparatus includes a multi-tile architecture for graphics operations including a multi-tile graphics processor, the multi-tile processor includes one or more dies; multiple processor tiles installed on the one or more dies; and a structure to interconnect the processor tiles on the one or more dies, wherein the structure to enable communications between processor tiles the processor tiles.
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公开(公告)号:US12099461B2
公开(公告)日:2024-09-24
申请号:US17431034
申请日:2020-03-14
Applicant: Intel Corporation
Inventor: Abhishek R. Appu , Altug Koker , Aravindh Anantaraman , Elmoustapha Ould-Ahmed-Vall , Valentin Andrei , Nicolas Galoppo Von Borries , Varghese George , Mike Macpherson , Subramaniam Maiyuran , Joydeep Ray , Lakshminarayanan Striramassarma , Scott Janus , Brent Insko , Vasanth Ranganathan , Kamal Sinha , Arthur Hunter , Prasoonkumar Surti , David Puffer , James Valerio , Ankur N. Shah
IPC: G06F16/00 , G06F7/544 , G06F7/575 , G06F7/58 , G06F9/30 , G06F9/38 , G06F9/50 , G06F12/02 , G06F12/06 , G06F12/0802 , G06F12/0804 , G06F12/0811 , G06F12/0862 , G06F12/0866 , G06F12/0871 , G06F12/0875 , G06F12/0882 , G06F12/0888 , G06F12/0891 , G06F12/0893 , G06F12/0895 , G06F12/0897 , G06F12/1009 , G06F12/128 , G06F15/78 , G06F15/80 , G06F17/16 , G06F17/18 , G06T1/20 , G06T1/60 , H03M7/46 , G06N3/08 , G06T15/06
CPC classification number: G06F15/7839 , G06F7/5443 , G06F7/575 , G06F7/588 , G06F9/3001 , G06F9/30014 , G06F9/30036 , G06F9/3004 , G06F9/30043 , G06F9/30047 , G06F9/30065 , G06F9/30079 , G06F9/3887 , G06F9/5011 , G06F9/5077 , G06F12/0215 , G06F12/0238 , G06F12/0246 , G06F12/0607 , G06F12/0802 , G06F12/0804 , G06F12/0811 , G06F12/0862 , G06F12/0866 , G06F12/0871 , G06F12/0875 , G06F12/0882 , G06F12/0888 , G06F12/0891 , G06F12/0893 , G06F12/0895 , G06F12/0897 , G06F12/1009 , G06F12/128 , G06F15/8046 , G06F17/16 , G06F17/18 , G06T1/20 , G06T1/60 , H03M7/46 , G06F9/3802 , G06F9/3818 , G06F9/3867 , G06F2212/1008 , G06F2212/1021 , G06F2212/1044 , G06F2212/302 , G06F2212/401 , G06F2212/455 , G06F2212/60 , G06N3/08 , G06T15/06
Abstract: Methods and apparatus relating to techniques for multi-tile memory management. In an example, an apparatus comprises a cache memory, a high-bandwidth memory, a shader core communicatively coupled to the cache memory and comprising a processing element to decompress a first data element extracted from an in-memory database in the cache memory and having a first bit length to generate a second data element having a second bit length, greater than the first bit length, and an arithmetic logic unit (ALU) to compare the data element to a target value provided in a query of the in-memory database. Other embodiments are also disclosed and claimed.
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公开(公告)号:US11892950B2
公开(公告)日:2024-02-06
申请号:US17865666
申请日:2022-07-15
Applicant: Intel Corporation
Inventor: Vikranth Vemulapalli , Lakshminarayanan Striramassarma , Mike MacPherson , Aravindh Anantaraman , Ben Ashbaugh , Murali Ramadoss , William B. Sadler , Jonathan Pearce , Scott Janus , Brent Insko , Vasanth Ranganathan , Kamal Sinha , Arthur Hunter, Jr. , Prasoonkumar Surti , Nicolas Galoppo von Borries , Joydeep Ray , Abhishek R. Appu , ElMoustapha Ould-Ahmed-Vall , Altug Koker , Sungye Kim , Subramaniam Maiyuran , Valentin Andrei
IPC: G06F12/084 , G06F12/0862 , G06T1/20 , G06T1/60
CPC classification number: G06F12/0862 , G06T1/20 , G06T1/60 , G06F2212/602 , G06F2212/608
Abstract: Embodiments are generally directed to data prefetching for graphics data processing. An embodiment of an apparatus includes one or more processors including one or more graphics processing units (GPUs); and a plurality of caches to provide storage for the one or more GPUs, the plurality of caches including at least an L1 cache and an L3 cache, wherein the apparatus to provide intelligent prefetching of data by a prefetcher of a first GPU of the one or more GPUs including measuring a hit rate for the L1 cache; upon determining that the hit rate for the L1 cache is equal to or greater than a threshold value, limiting a prefetch of data to storage in the L3 cache, and upon determining that the hit rate for the L1 cache is less than a threshold value, allowing the prefetch of data to the L1 cache.
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