PHOTOSENSITIVE ADHESIVE COMPOSITION

    公开(公告)号:JPS54133527A

    公开(公告)日:1979-10-17

    申请号:JP4197678

    申请日:1978-04-10

    Applicant: KAO CORP

    Abstract: PURPOSE:To provide a photosensitive adhesive composition rapidly curable with UV-irradiation, having excellent adhesivity, and composed mainly of a (meth) acrylurethane resin, an OH-containing (meth)acrylate and a photosensitizer. CONSTITUTION:A photosensitive adhesive composition composed of (A) an acrylurethane resin obtained by the reaction of (a) a polyoxyalkylene bisphenol A derivative of formula I or II (R is 2-4C alkylene; X is halogen, methyl; a is 1,2; m, n >= 1; and m+n is an integer of 2-8), (b) a polyisocyanate, and (c) an OH- containing (meth)acrylate, (B) an OH-containing (meth)acrylate, and (C) a photosensitizer.

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