公开(公告)号：DE69839861D1

公开(公告)日：2008-09-25

申请号：DE69839861

申请日：1998-03-31

Applicant: LUCENT TECHNOLOGIES INC

Inventor： GABARA THADDEUS JOHN ,  TAI KING LIEN

IPC: H01L23/538 ,  H01L23/50 ,  H01L25/065

Abstract: In a multi-chip module ("MCM") (200) and methods of operation and manufacture thereof, the MCM includes: (1) a substrate (210) for supporting a plurality of separate integrated circuit (IC) chips (111, 121) thereon, (2) first and second separate IC chips (111, 121) mounted on the substrate, the first separate IC chip including first (112) and second (114, 115) circuit portions coupled together by at least one signal conductor (113), and (3) interconnecting means (230) that directly couples at least one signal conductor of the first separate IC chip to the second separate IC chip, the interconnecting means bypassing the second circuit portion (114, 115) of the first separate IC chip.

公开(公告)号：AU4603801A

公开(公告)日：2001-11-29

申请号：AU4603801

申请日：2001-05-17

Applicant: LUCENT TECHNOLOGIES INC

Inventor： GABARA THADDEUS JOHN ,  MUJTABA SYED AON

IPC: H01Q3/26 ,  H04B7/26 ,  H04W16/32 ,  H04W88/08 ,  H01Q3/08 ,  H04Q3/30

公开(公告)号：SG78287A1

公开(公告)日：2001-02-20

申请号：SG1998000535

申请日：1998-03-10

Applicant: LUCENT TECHNOLOGIES INC

Inventor： GABARA THADDEUS JOHN ,  TAI KING LIEN

IPC: H01L23/50 ,  H01L23/538 ,  H01L25/065

Abstract: In a multi-chip module ("MCM") (200) and methods of operation and manufacture thereof, the MCM includes: (1) a substrate (210) for supporting a plurality of separate integrated circuit (IC) chips (111, 121) thereon, (2) first and second separate IC chips (111, 121) mounted on the substrate, the first separate IC chip including first (112) and second (114, 115) circuit portions coupled together by at least one signal conductor (113), and (3) interconnecting means (230) that directly couples at least one signal conductor of the first separate IC chip to the second separate IC chip, the interconnecting means bypassing the second circuit portion (114, 115) of the first separate IC chip.