公开(公告)号：JPH09197678A

公开(公告)日：1997-07-31

申请号：JP428497

申请日：1997-01-14

Applicant: LUCENT TECHNOLOGIES INC

Inventor： FERRY ALAN E ,  LAU MAUREEN YEE ,  BYUNG JOON HAN ,  SCRUTON ROBERT T SR ,  TAI KING LIEN

IPC: G03F7/20 ,  H05K3/00 ,  H05K3/06

Abstract: PROBLEM TO BE SOLVED: To form a metal or insulating precise pattern on a print circuit board. SOLUTION: A reversible projecting lens 13 serves as a size decreasing lens for a conventional lithography stepper but as a magnifying lens, having a large focal distance sufficient for absorbing a flat displacement of an PC board. This reversible lens decreases the size of an image required by a mask 15, and accordingly, a plurality of mask levers can be combined on a single glass pane. Accordingly, the cost for assembling the masks can be lowered, and accordingly, a small glass mask can be used, having a size which is precise and stable in dimensions in comparison with a conventional miler mask. The projecting lens is reversed on a sophisticated old type stepper, and thereby it is possible to form a metal pattern with a high degree of precise dimensions which have not ever been experienced.

公开(公告)号：JP2000261219A

公开(公告)日：2000-09-22

申请号：JP2000056110

申请日：2000-03-01

Applicant: LUCENT TECHNOLOGIES INC

Inventor： FRYE ROBERT CHARLES ,  II REN ROO ,  TAI KING LIEN

IPC: H01P3/08 ,  H01P11/00 ,  H05K3/24

Abstract: PROBLEM TO BE SOLVED: To realize a method for improving sharpness of the edge of a conductive metal strip formed by thick film paste technique. SOLUTION: This method produces a hybrid thick film in order to produce a metallic strip line. For the purpose of obtaining a minute shape of the strip, a trim strip 42 of a thin film is formed so as to cover the end part of a thick film strip 17. Though electric characteristics of this line are mainly prescribed by bulk characteristics of materials of the thick film 17, the shape of the like is prescribed by the thin film trim strip.

公开(公告)号：DE69715056D1

公开(公告)日：2002-10-10

申请号：DE69715056

申请日：1997-01-14

Applicant: LUCENT TECHNOLOGIES INC

Inventor： FERRY ALAN E ,  LAU MAUREEN YEE ,  BYUNG JOON HAN ,  SCRUTON SR ,  TAI KING LIEN

IPC: G03F7/20 ,  H05K3/00 ,  H05K3/06

Abstract: Fine patterns of metal or insulator can be formed on printed circuit board using conventional lithographic steppers with inverted projection lenses. The inverted projection lenses act as enlargement lenses rather than reducing lenses and exhibit a large depth of focus sufficient to accommodate the deviations of PC board from planarity. The inverted lens reduces the size of the image needed at the mask, permitting multiple mask levels to be combined on a single glass. This reduces the cost of the mask set and permits the use of smaller glass masks having greater accuracy and dimensional stability than the convention mylar masks used for PC board. By inverting the projection lenses on near-obsolete steppers, applicants were able to form metal patterns on PC board of finer dimension than heretofore reported. Inverting a 5X ZEISS lens on a GCA 6300A stepper, applicants were able to form vias of less than 25 mu m diameter, pattern metal lines and spaces of less than 25 mu m, and obtain overlay registration accuracy of less than 25 mu m. The field size was larger than 1 in , and the depth of focus was greater than 50 mu m.

公开(公告)号：DE69941168D1

公开(公告)日：2009-09-10

申请号：DE69941168

申请日：1999-01-19

Applicant: LUCENT TECHNOLOGIES INC

Inventor： TAI KING LIEN ,  ZHAO JINGSONG

IPC: H01L21/822 ,  H03H3/00 ,  H01L23/12 ,  H01L23/64 ,  H01L27/04 ,  H01P7/00 ,  H01P7/08 ,  H03H5/02 ,  H03H7/01 ,  H03H9/05 ,  H05K1/16

Abstract: An MCM including a resonator made using conventional MCM fabrication techniques. The MCM's resonator is constructed with overlapping first and second spiral-shaped regions of metallic material separated by a layer of dielectric material. A via disposed in the layer of dielectric material, couples the spiral-shaped regions of metallic material together, thereby utilizing self winding and internal capacitance to gain resonance at frequencies between 500 MHz to 3GHz. The internal capacitance is increased by controlling the overlap between the first and second spiral-shaped regions of metallic materials. On a high-resistivity substrate, the monolithic resonator achieves a Q of at least 19 at approximately 900MHz and at least 24 at approximately 2GHz.

公开(公告)号：DE60018121D1

公开(公告)日：2005-03-24

申请号：DE60018121

申请日：2000-02-28

Applicant: LUCENT TECHNOLOGIES INC

Inventor： FRYE ROBERT CHARLES ,  LOW YEE LENG ,  TAI KING LIEN

IPC: H01P11/00 ,  H05K3/24 ,  H01P3/08

Abstract: The specification describes a method for improving the edge acuity of conductive metal strips formed by thick film paste techniques. The advantages of the bulk properties of strips formed using thick film technology are realized while the drawback of poor edge definition is overcome using a thin film trim strip (42) at the edge of the conductive strip (17).

公开(公告)号：DE69836944T2

公开(公告)日：2007-10-25

申请号：DE69836944

申请日：1998-09-29

Applicant: LUCENT TECHNOLOGIES INC

Inventor： KOSSIVES DEAN PAUL ,  TAI KING LIEN ,  REN FAN

IPC: H01L23/522 ,  H05K1/11 ,  H01L21/60 ,  H01L21/768 ,  H01L23/14 ,  H01L23/485 ,  H01L23/538 ,  H01L25/00

Abstract: The specification describes integrated circuit air isolated crossover interconnections designed for flip chip multi-chip module interconnection technology. The crossovers are made using a crossover interconnection substrate separate from the interconnection substrate of the integrated circuit. In one embodiment the integrated circuit is flip chip bonded to a multi-chip or multi-component interconnection substrate, and the crossover interconnections are made through solder bumps or balls soldered to a conductive layer on the crossover interconnection substrate. In another embodiment the crossover is made via a crossover substrate flip chip bonded to an integrated circuit mounted on a multi-chip or multi-component interconnection substrate.

公开(公告)号：DE69836944D1

公开(公告)日：2007-03-15

申请号：DE69836944

申请日：1998-09-29

Applicant: LUCENT TECHNOLOGIES INC

Inventor： KOSSIVES DEAN PAUL ,  TAI KING LIEN ,  REN FAN

IPC: H01L23/522 ,  H05K1/11 ,  H01L21/60 ,  H01L21/768 ,  H01L23/14 ,  H01L23/485 ,  H01L23/538 ,  H01L25/00

Abstract: The specification describes integrated circuit air isolated crossover interconnections designed for flip chip multi-chip module interconnection technology. The crossovers are made using a crossover interconnection substrate separate from the interconnection substrate of the integrated circuit. In one embodiment the integrated circuit is flip chip bonded to a multi-chip or multi-component interconnection substrate, and the crossover interconnections are made through solder bumps or balls soldered to a conductive layer on the crossover interconnection substrate. In another embodiment the crossover is made via a crossover substrate flip chip bonded to an integrated circuit mounted on a multi-chip or multi-component interconnection substrate.

公开(公告)号：DE60112003T2

公开(公告)日：2006-06-01

申请号：DE60112003

申请日：2001-05-31

Applicant: LUCENT TECHNOLOGIES INC ,  AGERE SYST OPTOELECTRONICS

Inventor： DEGANI YINON ,  DUDDERAR THOMAS DIXON ,  TAI KING LIEN

IPC: B81B7/00 ,  G02B26/08 ,  B81B7/02 ,  H01L23/538

Abstract: The specification describes interconnection strategies for micro-electronic machined mechanical systems (MEMS). Typical MEMS device array comprise a large number of individual mechanical devices each electrically driven by multi-chip modules (MCMs). High density interconnection is achieved by mounting the MCMs mounted on both sides of a system interconnection substrate. Overall interconnection length is reduced by locating the MCMs in a common circuit driving a given mechanical element on opposite sides of the system interconnection substrate and interconnecting them using vias through the substrate. Rapid replacement/repair is facilitated by mounted all active elements in sockets using contact pin arrays for electrical connections. In service reliability is obtained by providing spare sockets for redundant MCMs.

公开(公告)号：DE69715056T2

公开(公告)日：2003-05-22

申请号：DE69715056

申请日：1997-01-14

Applicant: LUCENT TECHNOLOGIES INC

Inventor： FERRY ALAN E ,  LAU MAUREEN YEE ,  BYUNG JOON HAN ,  SCRUTON SR ,  TAI KING LIEN

IPC: G03F7/20 ,  H05K3/00 ,  H05K3/06

Abstract: Fine patterns of metal or insulator can be formed on printed circuit board using conventional lithographic steppers with inverted projection lenses. The inverted projection lenses act as enlargement lenses rather than reducing lenses and exhibit a large depth of focus sufficient to accommodate the deviations of PC board from planarity. The inverted lens reduces the size of the image needed at the mask, permitting multiple mask levels to be combined on a single glass. This reduces the cost of the mask set and permits the use of smaller glass masks having greater accuracy and dimensional stability than the convention mylar masks used for PC board. By inverting the projection lenses on near-obsolete steppers, applicants were able to form metal patterns on PC board of finer dimension than heretofore reported. Inverting a 5X ZEISS lens on a GCA 6300A stepper, applicants were able to form vias of less than 25 mu m diameter, pattern metal lines and spaces of less than 25 mu m, and obtain overlay registration accuracy of less than 25 mu m. The field size was larger than 1 in , and the depth of focus was greater than 50 mu m.

公开(公告)号：DE69839861D1

公开(公告)日：2008-09-25

申请号：DE69839861

申请日：1998-03-31

Applicant: LUCENT TECHNOLOGIES INC

Inventor： GABARA THADDEUS JOHN ,  TAI KING LIEN

IPC: H01L23/538 ,  H01L23/50 ,  H01L25/065

Abstract: In a multi-chip module ("MCM") (200) and methods of operation and manufacture thereof, the MCM includes: (1) a substrate (210) for supporting a plurality of separate integrated circuit (IC) chips (111, 121) thereon, (2) first and second separate IC chips (111, 121) mounted on the substrate, the first separate IC chip including first (112) and second (114, 115) circuit portions coupled together by at least one signal conductor (113), and (3) interconnecting means (230) that directly couples at least one signal conductor of the first separate IC chip to the second separate IC chip, the interconnecting means bypassing the second circuit portion (114, 115) of the first separate IC chip.