公开(公告)号：JPH0444255A

公开(公告)日：1992-02-14

申请号：JP14928690

申请日：1990-06-07

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI ,  NOUZUMI ATSUO

IPC: H01L23/50

Abstract: PURPOSE:To obtain an accurate lead frame having high reliability by forming a shape at the tips of inner leads in a state that connecting parts remain, coining them to reduce the tips in thickness, then so forming uneven parts as to absorb excess parts formed by elongation, heat-treating them, and then removing the connecting parts to individually separate them. CONSTITUTION:A stripe material made mainly of steel is mounted in a mold having punching dies for punching parts of inner leads 1, tie bars 2, outer leads 3 of desired shape from four corners of a lead frame unit, and pressed to be patterned except the tip face of the inner leads. Then, it is coined to reduce them (a) in thickness. Thereafter, protrusions T are so formed partly at a region to become a cavity region as to absorb excess parts elongated by the coining (b), (c). Subsequently, in order to remove an inner stress, they are heat treated. Further, the cativy region C is punched to include the protrusion T, a die pad 11 is formed, and the tip edge of the inner lead is formed to complete patterning (d).

公开(公告)号：JPH0362959A

公开(公告)日：1991-03-19

申请号：JP19887389

申请日：1989-07-31

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI

IPC: H01L21/56 ,  H01L23/50

Abstract: PURPOSE:To enhance adhesion with a sealing resin and to reduce time change by machining the shape of a lead frame, performing plating as required, and performing primer treatment in the vicinity of at least a package line other than a bonding area and outer leads with a silane coupling agent. CONSTITUTION:A lead frame 1 is formed, Then coining is performed. The flat width of the tip part of each inner lead 4 is secured. Then, plating M is performed at the tip part. Said lead frame is mounted on a rack made of Teflon. Then, the entire body is immersed into primer solution wherein a silane coupling agent of several % is dissolved into hexane and isopropyl alcohol for several seconds. The lead frame is made to remain for 4-5 hours at normal temperature. Then the lead frame is dried. A film 10 having the thickness in the order of Angstrom is formed on the surface. Therefore, the film of the coupling agent formed on the surface of the Iead frame reacts with both the resin and the surface of the lead frame in a resin sealing step. An intermediate material is formed between the surface of the lead frame and the resin, and adhesion is improved to a large extent.

公开(公告)号：JP2007081439A

公开(公告)日：2007-03-29

申请号：JP2006345829

申请日：2006-12-22

Applicant: Mitsui High Tec Inc ,  株式会社三井ハイテック

Inventor： FUKUI ATSUSHI ,  KIMOTO KEISUKE

IPC: H01L31/04

CPC classification number: Y02E10/546 ,  Y02E10/548

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a solar battery by which the problem of an electrical short-circuit during an assembly step can be radically solved and which has high quality and advantageous yield. SOLUTION: This manufacturing method comprises: a step for adhering a plurality of first conductive-type spherical substrates 11 to a conductive module substrate 13; a step for coating the spherical substrates 11 with an insulating resin 14; and a step for disposing a second conductive-type silicon thin film 17 on the surfaces of the spherical substrates 11 and the surface of the insulating resin 14. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种太阳能电池的制造方法，通过该方法可以彻底地解决组装步骤期间的电短路问题，并且具有高质量和有利的产率。 解决方案：该制造方法包括：将多个第一导电型球形基板11粘合到导电模块基板13的步骤; 用绝缘树脂14涂覆球形基板11的步骤; 以及在球形基板11和绝缘树脂14的表面上设置第二导电型硅薄膜17的步骤。（C）2007，JPO＆INPIT

公开(公告)号：JP2002056991A

公开(公告)日：2002-02-22

申请号：JP2000241170

申请日：2000-08-09

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI ,  KIMOTO KEISUKE

IPC: F21S2/00 ,  F21S9/02 ,  H05B37/02

Abstract: PROBLEM TO BE SOLVED: To obtain a road traffic equipment which saves and eliminates the waste of energy while aiming at a traffic safety by lighting as road by a solar cell, and utilizes energy by circulation. SOLUTION: The road traffic equipment comprises a solar cell 4 installed at a road 1 generating electromotive force by receiving sun light or illumination light, a capacitor 5 storing the electromotive force generated at the solar cell 4, an outdoor lamps 2 with variable brightness, facing the road and installed with a prescribed distance, which lights when circumambient lightness becomes less than a prescribed lightness by dint of the electromotive force of the solar cell 4, a sensors 8 installed on the road 1 with prescribed distance, detecting the moving objects 9 like passers by or vehicles, and a control device 7 heightening the brightness of the neighboring outdoor lamp or several numbers of the outdoor lamps located at the forward direction of the traffic during a prescribed period depending on the signal from the sensor 8.

公开(公告)号：JP2002050780A

公开(公告)日：2002-02-15

申请号：JP2000235296

申请日：2000-08-03

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI ,  ISHIDA KEN ,  KAI HIDEYOSHI ,  KIMOTO KEISUKE

IPC: H01L31/04

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing solar cell which can clear the process for formation of the inner electrode of the solar cell, formation of the outer electrode, and formation of an insulating layer between both electrodes with a single process, and is satisfactory in adhesion between a substrate and a spherical cell and high in reliability, and to provide the solar cell. SOLUTION: This manufacturing process includes a process of preparing a substrate 17, where circular processing is applied to expose the two layers inside a three-layered structure, consisting of the first conductive layer 17a, an insulating layer 17b, and the second conductive layer 17c; a process of preparing a spherical cell 10 which is constituted by forming a second conductivity-type semiconductor layer 11, such that one part of a first conductivity-type semiconductor layer 11 is exposed, on the surface of the spherical substrate having the first conductivity-type semiconductor layer 11; and a process of electrically connecting the exposed section of the first conductivity-type semiconductor layer 11 with the first conductive layer 17a and electrically connecting a second conductivity-type semiconductor layer 12 with the second conductive layer 17c, and forming a recess 17d such that the substrate 17 is moved along the spherical cell 10 by placing the spherical cell 10, so that the section where the first conductivity-type semiconductor layer 11 is exposed of the spherical cell 10 abuts against the section, where circular processing is applied such that the two layers within the substrate 17 is exposed.

公开(公告)号：JP2002009314A

公开(公告)日：2002-01-11

申请号：JP2000185011

申请日：2000-06-20

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI ,  ISHIDA KEN ,  KIMOTO KEISUKE

IPC: H01L31/04

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a solar battery with improved working efficiency and high output, and the solar battery, by solving the problem of the continuity between inner and outer electrodes in high-density packaging and improving reliability. SOLUTION: This method for manufacturing a solar battery includes a process for preparing a spherical cell where a second-conductivity type semiconductor layer is formed so that one portion of the first-conductivity-type semiconductor layer is exposed on the surface of a spherical substrate having the first- conductivity-type semiconductor layer, a process for forming a conductive substrate having a projecting part on the surface, a process for forming an insulating resin member on the projection, a process for electrically connecting the exposed part of the first-conductivity-type semiconductor layer to a conductive substrate by placing the spherical cell so that the exposed part of the first- conductivity-type semiconductor layer of the spherical cell comes into contact with the insulating resin member for pressurization, and a process for forming an outer electrode on the surface of the second-conductivity-type semiconductor layer.

公开(公告)号：JP2001156316A

公开(公告)日：2001-06-08

申请号：JP33678999

申请日：1999-11-26

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI ,  KIMOTO KEISUKE

IPC: H01L31/04 ,  H01L31/0236 ,  H01L31/0352 ,  H01L31/0392 ,  H01L31/042 ,  H01L31/048

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device that can be manufactured easily, has stable characteristics, and is highly reliable. SOLUTION: The solar battery is provided with an insulation substrate where semispherical projections are arranged on a surface, a first electrode layer that is formed on the insulation substrate surface, a semiconductor layer with a pn junction being formed on the first electrode layer, and a second electrode layer that is made of a light-transmission material being formed on the semiconductor layer surface.

公开(公告)号：JPH11347653A

公开(公告)日：1999-12-21

申请号：JP16249998

申请日：1998-06-10

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI

IPC: B21D37/01

Abstract: PROBLEM TO BE SOLVED: To shorten the working time and to easily and uniformly obtain a desired clearance by placing a die component member with a metallic coating thereon in a forming die filled with a hard material powder, performing the compaction and the sintering, heating it to a temp. higher than the melting point of a coating metal and separating it. SOLUTION: A coating 4 by a chromium sputtering is applied by the plasma coating over a whole surface of a punch 1 of a punching die. The thickness of the coating 4 is set to be clearance between the punch 1 and a die 2. A raw material powder 5 of a cemented carbide which is a material to form the die 2 is filled in a forming die 6, and the compression and forming are performed while the punch 1 is inserted in the raw material powder 5 of the cemented carbide. An obtained compact 7 is sintered to obtain a sintered compact 8. The sintered compact 8 is heated to the temperature higher than the melting point of a coating metal, and the coating metal is melted to separate the sintered compact 8 as the die from the punch 1. The chromium coating after the separation is removed with hydrochloric acid.

公开(公告)号：JPH09260561A

公开(公告)日：1997-10-03

申请号：JP7242896

申请日：1996-03-27

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI

IPC: H01L23/50

Abstract: PROBLEM TO BE SOLVED: To obtain a noble metal layer manufacturable at low temperature having a small film thickness and excellent film quality by a method wherein, after a lead frame is shaped, a metal film is formed by plasma. SOLUTION: In a lead flame, a top end of an inner lead 12 and a die pad 11 are coated with a metal having a film thickess of about 1 micron formed by a plasma method. That is, the inner leads 12 are radially arranged round the die pad 11 and coupled by a die bar, and further each of the inner leads is continued to an outer lead 14 and the top end is supported by the bar again. Herein, on the face of the inner lead 12 of the lead frame and the rear face of the outer lead 14, a golden layer (m) of a film thickness of about 1 micron is formed. The lead flame formed as described above can be formed at a low temperature of 250 deg.C irrespective of after shaping and the lead frame less in a distortion and a transformation is obtained.

公开(公告)号：JPH0828449B2

公开(公告)日：1996-03-21

申请号：JP14928690

申请日：1990-06-07

Applicant: MITSUI HIGH TEC

Inventor： FUKUI ATSUSHI ,  NOZUMI ATSUO

IPC: H01L23/50