公开(公告)号：JPH06141492A

公开(公告)日：1994-05-20

申请号：JP32718892

申请日：1992-10-23

Applicant: MITSUI HIGH TEC

Inventor： ISAYAMA MINAO

IPC: H02K1/16 ,  H02K1/14 ,  H02K1/18 ,  H02K15/02

Abstract: PURPOSE:To provide a precision motor with laminated iron core indispensable which is excellent in the shape property such as the squareness, the parallelism, etc., of the laminated iron core, and in which the air gap between a stator iron core and a rotor iron core is small, and the step rotation of which can be done accurately with its angle of rotation small. CONSTITUTION:The laminated iron core for a motor is made by manufacturing one or both of stator iron core pieces 7 and rotor core pieces 5 so that they may include the regions where thin places 10 are made coaxially and pressed and extended flat, and laminating the stator iron core pieces 7 and rotor iron core pieces 5, respectively.

公开(公告)号：JPH053648A

公开(公告)日：1993-01-08

申请号：JP18290791

申请日：1991-06-26

Applicant: MITSUI HIGH TEC

Inventor： ISAYAMA MINAO

IPC: H02K1/18 ,  H02K15/02

Abstract: PURPOSE:To mount a coil on a core without using any special jig, simplify a facility, and improve working efficiency by uniting main magnetic pole sections to one body by coupling the sections by means of upper and lower connecting magnetic pole core sections. CONSTITUTION:A laminated magnetic pole core section 24 is provided with a main magnetic pole section 25 and connecting magnetic pole sections 26 and 27. The main magnetic pole section 25 is formed by successively piling up a large number of magnetic pole pieces 17 divided into magnetic poles and polymerizing them together with glue and equally arranged in the radial direction so that gaps can be formed between each magnetic pole. The connecting magnetic pole core sections 26 and 27 divide the large number of main magnetic poles 25 into two or more groups and have magnetic pole core pieces 16 provided with connecting sections so as to fill the gaps between each magnetic pole belonging to each group. In addition, the sections 26 and 27 are formed by polymerizing together with glue the pieces 16 in the circumferential direction and firmly stuck to the upper and lower surfaces of each main magnetic pole section 25.

公开(公告)号：JPH0422157A

公开(公告)日：1992-01-27

申请号：JP12709990

申请日：1990-05-17

Applicant: MITSUI HIGH TEC

Inventor： OKAMOTO TATSUMI ,  ISAYAMA MINAO

IPC: C21D9/00 ,  C21D1/42 ,  H01L23/50

Abstract: PURPOSE:To execute a heating operation with good efficiency and uniformly while the shape of an object having a fine size is being maintained with high accuracy by a method wherein a heating plate composed of a ferromagnetic substance is pushed to the prescribed position of an object to be heated and the heating operation is executed. CONSTITUTION:At a high-frequency heating plate 10 which is composed of a dust core 1, an induction heating coil 2, a heating plate 4 and the like, the coil 2 composed of a hollow flat-type copper wire is wound on the core 1, and the plate 4 composed of a Cr ferromagnetic substance is brought into contact with its one face. A pressure plate 6 is arranged and installed so as to be faced with the coil 2 and can press a lead-frame continuous body (an object to be heated) F to the direction of the plate 4 by using actuators 21. The plate 6 is moved to the direction of the plate 4. While regions excluding side rails of a lead frame are being pressed, the plate is heated. When the plate 4 is pushed to the prescribed position of the object F to be heated and is heated in this manner, it can be heated with good efficiency. Since it can uniformly be heated and it is heated while it is being pressed, its shape can be corrected and the shape can be worked with high acuracy.

公开(公告)号：JPH03278563A

公开(公告)日：1991-12-10

申请号：JP7936190

申请日：1990-03-28

Applicant: MITSUI HIGH TEC

Inventor： ISAYAMA MINAO ,  UMEDA KAZUHIKO

IPC: H01L23/50 ,  B21D28/00 ,  B26F1/00

Abstract: PURPOSE:To obtain a highly accurate and reliable lead frame by making a through-hole, at least partially, at a part between the tip of an inner lead and the circumference of pad and then making a recess at the tip of the inner lead. CONSTITUTION:At first it is mounted on a metal die comprising an inner lead(except the tip face) having desired profile 1, a tie-bar 2 and a trimming die such as a part of an outer lead 3, and pressed to form a first punched area Al. It is then mounted on a metal die comprising an inner lead(except the tip face) 1 in next area juxtaposed to the first punched area A1, a tie-bar 2 and a trimming die such as a part of the outer lead 3, and pressed to form a first punched area A1. A through-hole (b) is then made between a die pad forming area 11 and the tip of the inner lead, pressed in the metal die with a flat punch thus forming a recess 22.

公开(公告)号：JPS63272043A

公开(公告)日：1988-11-09

申请号：JP10749887

申请日：1987-04-30

Applicant: MITSUI HIGH TEC

Inventor： ISAYAMA MINAO ,  KITA MICHIAKI

IPC: H01L21/60

Abstract: PURPOSE:To avoid deformations of internal leads and facilitate improving the manufacturing yield and the reliability of a semiconductor device by a method wherein the tip parts of the internal leads are linked and fixed by an insulating film provided so as to keep away from bonding areas. CONSTITUTION:A semiconductor element 3 is mounted on the die pad 2 of a lead frame 1 and, at the same time, the semiconductor element 3 is connected to the internal leads 4 of the lead frame 1 by bonding wires 5 and housed in a sealing package 6. In a semiconductor device like this, an insulating film 7 which is fixed so as to keep away from the bonding areas of the tips of the internal leads 4 and links the respective internal leads 4 is provided. Some 4b of the internal leads 4 of the lead frame 1 extended close to the die pad 2 are extended closer to the die pad 2 with smaller lead widths than the other leads 4a to form widened parts (f) at the tips of the leads 4b.