公开(公告)号：US20190239351A1

公开(公告)日：2019-08-01

申请号：US16381708

申请日：2019-04-11

Applicant: Microsoft Technology Licensing, LLC

Inventor： James David Holbery ,  Siyuan Ma ,  Michael David Dickey ,  Andrew L. Fassler

IPC: H05K1/03 ,  C08K7/00 ,  H05K3/00 ,  H05K1/09 ,  H01L23/538 ,  C09D183/04 ,  G06F1/16 ,  C08K3/08 ,  H05K1/02 ,  H05K3/28 ,  C09D5/24

CPC classification number: H05K1/0393 ,  C08K3/08 ,  C08K7/00 ,  C08K2003/0806 ,  C08K2201/001 ,  C08K2201/011 ,  C09D5/24 ,  C09D183/04 ,  G06F1/1669 ,  H01L23/5386 ,  H01L23/5387 ,  H05K1/028 ,  H05K1/0313 ,  H05K1/09 ,  H05K1/148 ,  H05K3/0014 ,  H05K3/285 ,  H05K2201/0245 ,  H05K2201/026 ,  H05K2201/0391 ,  H05K2203/0776

Abstract: One example provides a circuit structure comprising a liquid metal conductive path enclosed in an encapsulant, a polymer circuit support comprising a polymer having a functional species available for a condensation reaction, and a cross-linking agent covalently bonding the encapsulant to the polymer circuit support via the functional species.

公开(公告)号：US20180254566A1

公开(公告)日：2018-09-06

申请号：US15449808

申请日：2017-03-03

Applicant: Microsoft Technology Licensing, LLC

Inventor： James David Holbery ,  Siyuan Ma ,  Flavio Protasio Ribeiro ,  Michael David Dickey ,  Collin Alexander Ladd ,  Andrew Lewis Fassler

IPC: H01R3/08 ,  H01R12/61 ,  H01L23/00 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H05K1/09 ,  H05K3/28 ,  H05K3/10 ,  H05K3/34

CPC classification number: H01R3/08 ,  H01L23/4985 ,  H01L23/49866 ,  H01L23/5389 ,  H01L24/69 ,  H01L24/89 ,  H01R12/613 ,  H05K1/028 ,  H05K1/09 ,  H05K1/111 ,  H05K1/18 ,  H05K3/10 ,  H05K3/28 ,  H05K3/34 ,  H05K2201/05 ,  H05K2201/10977

Abstract: Examples are disclosed that relate to flexible electrical interconnects in electronic devices. One example provides a device including a flexible substrate, a conductive trace disposed on the flexible substrate, an electronic component mounted to the flexible substrate, a liquid metal interconnect bridging between a pad on the component and the trace on the flexible substrate, and an encapsulant covering the interconnect.

公开(公告)号：US09872390B1

公开(公告)日：2018-01-16

申请号：US15239645

申请日：2016-08-17

Applicant: Microsoft Technology Licensing, LLC

Inventor： James David Holbery ,  Siyuan Ma ,  Michael David Dickey ,  Andrew L. Fassler

IPC: H05K1/09 ,  H05K1/03 ,  H01R4/58 ,  H05K1/14 ,  H05K1/02 ,  H05K3/10 ,  H05K3/28

CPC classification number: H05K1/14 ,  H01L21/486 ,  H01L23/49872 ,  H01L23/5387 ,  H05K1/0283 ,  H05K1/0296 ,  H05K1/0393 ,  H05K3/107 ,  H05K3/28 ,  H05K2201/032 ,  H05K2201/0391 ,  H05K2201/10977 ,  H05K2203/1305

Abstract: One example provides a flexible electrical interconnect comprising a substrate, a liquid conductive pathway supported by the substrate, and a conductively anisotropic, magnetic particle-embedded encapsulant that interfaces with the liquid conductive pathway for connecting to another circuit element.

公开(公告)号：US20170350773A1

公开(公告)日：2017-12-07

申请号：US15170877

申请日：2016-06-01

Applicant: Microsoft Technology Licensing, LLC

Inventor： Siyuan Ma ,  James David Holbery ,  Anatoly Churikov ,  Flavio Protasio Ribeiro

IPC: G01L1/20 ,  C09D5/24 ,  C09D165/00 ,  G06F3/041

CPC classification number: G01L1/205 ,  C09D5/24 ,  C09D165/00 ,  G01L1/18 ,  G01L1/20 ,  G06F3/0414 ,  G06F2203/04103 ,  G06F2203/04105

Abstract: Examples for force-sensing elements are disclosed. An example method for forming a force sensor includes printing a suspension of a hollow-sphere conductive polymer in a liquid carrier over an electrode pair on a substrate, evaporating the liquid carrier, and encapsulating the electrode pair and hollow-sphere conductive polymer to form a force sensor.

公开(公告)号：US20170261388A1

公开(公告)日：2017-09-14

申请号：US15068306

申请日：2016-03-11

Applicant: Microsoft Technology Licensing, LLC

Inventor： Siyuan Ma ,  James David Holbery ,  Flavio Protasio Ribeiro

IPC: G01L1/22 ,  G06F1/16 ,  G02B27/01 ,  G06F3/041

CPC classification number: G01L1/2287 ,  A61B5/0022 ,  A61B5/02133 ,  A61B5/0488 ,  A61B5/1036 ,  A61B5/1114 ,  A61B5/1118 ,  A61B5/6803 ,  A61B5/6891 ,  A61B5/6895 ,  A61B2505/09 ,  A61B2560/04 ,  A61B2562/0247 ,  A61B2562/0252 ,  A61B2562/0261 ,  A61B2562/046 ,  A61B2562/125 ,  G01L1/22 ,  G02B27/017 ,  G02B2027/0134 ,  G06F1/163 ,  G06F3/017 ,  G06F3/02 ,  G06F3/0414 ,  G06F3/0416 ,  G06F3/04883 ,  G06F19/00 ,  G06F2203/04102 ,  G06F2203/04103 ,  G06F2203/04105 ,  G16H40/67 ,  H03K17/9625

Abstract: Examples of force sensors that may be incorporated into a number of devices or other objects are disclosed. In one example, a sensor comprises a substrate comprising a first electrode and a second electrode, the first electrode and the second electrode being spaced by an insulating gap, and a compliant material with plural conductive pathways disposed over the gap and contacting the first electrode and the second electrode such that a resistance of an electrical path passing through the compliant material between the first electrode and the second electrode changes in response to force of the compliant material against one or more of the first electrode and the second electrode.

公开(公告)号：US20170249041A1

公开(公告)日：2017-08-31

申请号：US15056247

申请日：2016-02-29

Applicant: Microsoft Technology Licensing, LLC

Inventor： Christian N. Moller ,  James David Holbery ,  Andrew L. Fassler

IPC: G06F3/041 ,  G06F3/044 ,  G02B27/01 ,  G06F3/01

CPC classification number: G06F3/0414 ,  G02B27/017 ,  G06F1/163 ,  G06F3/011 ,  G06F3/012 ,  G06F3/013 ,  G06F3/016 ,  G06F3/044 ,  G06F2203/04102

Abstract: Various examples of deformable sensors are disclosed. In one example, a deformable sensor comprises a ground electrode comprising a plurality of spatially separated lines, and a set of individually-indexed signal channels interdigitated with the spatially separated lines, each individually-indexed signal channel comprising a stretchable conductive path encapsulated in an elastomeric material.

公开(公告)号：US11531397B2

公开(公告)日：2022-12-20

申请号：US17150046

申请日：2021-01-15

Applicant: Microsoft Technology Licensing, LLC

Inventor： Siyuan Ma ,  James David Holbery

IPC: G06F3/01 ,  H01L41/08

Abstract: An electronic device comprises a haptic feedback system. The haptic feedback system includes a first haptic actuator coupled to a controller via a first set of two or more electrodes, and a second haptic actuator coupled to the first haptic actuator, and further coupled to the controller via a second set of two or more electrodes. The controller is configured to provide a first drive signal to the first haptic actuator via the first set of two or more electrodes, and to provide a second drive signal, different from the first drive signal, to the second haptic actuator via the second set of two or more electrodes. Combining two haptic actuators allows for a broader range of feedback and a heightened user experience.

公开(公告)号：US11091855B2

公开(公告)日：2021-08-17

申请号：US15707865

申请日：2017-09-18

Applicant: Microsoft Technology Licensing, LLC

Inventor： James David Holbery ,  Siyuan Ma ,  Don Pasindu Vijai Lugoda ,  Timothy Jerome Coomes ,  James Alec Ishihara ,  Kelly Marie Bogan

IPC: D02G3/00 ,  D02G3/44 ,  D02G3/40 ,  D02G3/36 ,  D03D1/00 ,  G03F7/00 ,  H05K3/10 ,  H05K1/03

Abstract: A yarn adaptable to incorporation into a textile comprises a core including one or more electrically conductive traces arranged on the core and distributed over at least a portion of the length of the yarn. The yarn also comprises an electrically contactable terminal arranged at a terminus of the one or more conductive traces and a winding wrapped around the core.

公开(公告)号：US11061476B2

公开(公告)日：2021-07-13

申请号：US16422611

申请日：2019-05-24

Applicant: Microsoft Technology Licensing, LLC

Inventor： Jacquelin Leah Remaley ,  Sang Ho Yoon ,  James David Holbery

IPC: G06F3/01

Abstract: Examples disclosed herein relate to providing haptic feedback. One disclosed example provides a wearable article configured to provide haptic feedback, the wearable article including a base configured to be worn on a body part, a force-applying mechanism coupled with the base, and a haptic feedback apparatus coupled with the base, the haptic feedback apparatus including a lever supported by a frame and coupled with the force-applying mechanism, the lever positioned to move relative to the frame and apply pressure on a surface of the body part when a force is applied by the force applying mechanism.

公开(公告)号：US10935436B2

公开(公告)日：2021-03-02

申请号：US15647080

申请日：2017-07-11

Applicant: Microsoft Technology Licensing, LLC

Inventor： Benjamin Sullivan ,  Siyuan Ma ,  James David Holbery ,  Collin Alexander Ladd ,  Kelly Marie Bogan

IPC: G01K3/00 ,  G01K7/04 ,  G01K3/14 ,  A41D1/00 ,  A61B5/01 ,  A61B5/00 ,  A63B71/00 ,  G01K1/14

Abstract: Examples are disclosed that relate to mapping a plurality of temperatures across an area. One example provides a temperature sensing device including a flexible support and a temperature sensing structure having a plurality of individually readable temperature sensing junctions. The temperature sensing structure includes a line of a first conductive material extending across an area of the support, and a plurality of lines of a second conductive material each intersecting the line of the first junction material at a corresponding sensing junction.