公开(公告)号：JPH1072684A

公开(公告)日：1998-03-17

申请号：JP15201097

申请日：1997-06-10

Applicant: NGK INSULATORS LTD

Inventor： OHASHI TOSHIO ,  ASAI MICHIO

IPC: H05H1/24 ,  B01J19/08 ,  C04B35/115 ,  C23C16/50 ,  C23F4/00 ,  H01L21/205 ,  H01L21/302 ,  H01L21/3065

Abstract: PROBLEM TO BE SOLVED: To provide a passing tube for gas for generating plasma high in the transmissivity of ultraviolet rays and high in corrosion resistance to corrosive gas. SOLUTION: A passing tube for passing gas for generating plasma and irradiating the gas for generating plasma in the process of the passing with ultraviolet rays is provided. The passing tube is provided with the slender and thin passing tube main body for passing the gas for generating plasma to the inside and irradiating the gas for generating plasma in the process of the passing of the ultraviolet rays from the outside. The passing tube main body is formed by translucent alumina. The center line average surface roughness Ra in the part to be exposed to plasma in the passing tube main body is regulated to

公开(公告)号：JPH07273457A

公开(公告)日：1995-10-20

申请号：JP9101691

申请日：1991-03-30

Applicant: NGK INSULATORS LTD ,  N G K ELECTRON KK

Inventor： ASAI MICHIO ,  HASEGAWA ISAMU

IPC: H05K3/46

Abstract: PURPOSE:To obtain the title ceramic multilayer wiring substrate and manufacturing method thereof capable of avoiding the defective connection to a wiring layer connecting to a conductor layer in a via hole. CONSTITUTION:When the conductor material 5 in the via hole of the first layer 2 in contact with the surface and rear surface of multiple wiring layers 4 is different from the conductor material 6 comprising the lower wiring layer 4 connecting to the conductor material 5, the different part is printed with normal wiring pattern after printing a land pattern or the wiring pattern including the part is thickly printed to be baked later for the thicker formation thereby enabling the reliability upon connection to be enhanced without any defective connection at all.

公开(公告)号：JPH0563367A

公开(公告)日：1993-03-12

申请号：JP12314491

申请日：1991-04-26

Applicant: NGK INSULATORS LTD

Inventor： OHARA MINORU ,  ASAI MICHIO

IPC: H01L23/12 ,  H01L23/15 ,  H05K1/00 ,  H05K1/09 ,  H05K3/34 ,  H05K3/40 ,  H05K3/46

Abstract: PURPOSE:To obtain a low temperature fired ceramic multilayer board wherein the pitch and the size of a gold bonding pad part can be made minimum and high density constitution can be realized. CONSTITUTION:In a low temperature fired ceramic multilayer board 1 having at least a gold bonding pad part 6 on the surface of a ceramic multilayer wiring board, a via hole 7 using gold as conductor material is formed just under the gold bonding pad part 6.

公开(公告)号：JPH0529765A

公开(公告)日：1993-02-05

申请号：JP20444991

申请日：1991-08-14

Applicant: NGK INSULATORS LTD

Inventor： MORIMOTO TADAHIKO ,  ASAI MICHIO

IPC: H05K3/46

Abstract: PURPOSE:To provide a ceramic multilayer wiring board capable of preventing the generation of insulation degradation which may be caused by leakage pass or the formation of a through hole and protecting the board from potential insulation breakdown and its manufacturing method. CONSTITUTION:A ceramic multilayer wiring board comprises a first insulation layer 14a and a second insulation layer 20 in structure where the second insulation layer 20 is installed between the first insulation layer 14a and a surface conductor layer 30 separately added to the upper layer of the first insulation layer 14a and sintered at a burning temperature identical to or lower than that of the first insulation layer 14a at a different period. In addition, the lamination structure is available from a manufacturing method which laminates and sinters insulation paste on the first insulation layer 14a of the ceramic multilayer wiring board and laminates the second insulation layer 20 where the insulation paste uses an insulation material to be sintered at a temperature equivalent to or lower than that of the first insulation layer 14a. The ceramic multilayer wiring board and its manufacturing method makes it possible to seal voids and inhibit the communication of leakage pass.

公开(公告)号：JPH04316394A

公开(公告)日：1992-11-06

申请号：JP10831891

申请日：1991-04-15

Applicant: NGK INSULATORS LTD

Inventor： OHASHI TAKASHI ,  ASAI MICHIO ,  MIYATA KEIZO

IPC: H05K3/12

Abstract: PURPOSE:To accurately align two or more types of wiring patterns by printing paste to be baked in an oxidative atmosphere with at least two positioning through holes or viaholes provided on a surface of a ceramic board as a reference. CONSTITUTION:Through holes or viaholes 3 for electrically connecting or positioning a lower wiring layer are provided at predetermined positions on a surface of a ceramic board 2. After gold pattern-forming patterns are printed on the surface of the board 2 at least with the two through holes or the viaholes 3 as a reference of the positions, they are baked in an oxidative atmosphere, and gold conductors 5 of gold pads, etc., are formed. After resistors, etc., to be baked in the atmosphere are printed necessary times, they are baked and formed. Eventually, after copper paste is printed at predetermined positions, they are baked in a nitrogen atmosphere to form a copper conductors 6.

公开(公告)号：JPH02292896A

公开(公告)日：1990-12-04

申请号：JP11254389

申请日：1989-05-01

Applicant: NGK INSULATORS LTD

Inventor： MIYATA KEIZO ,  ASAI MICHIO

IPC: H05K3/46

Abstract: PURPOSE:To obtain a wiring board which is high in reliability and whose high melting conductor layer is free of oxidation even if it is exposed to environment of high temperature and humidity for a long time by a method wherein copper and gold or palladium are fused in solid solution between the exposed region of a high melting metal layer and a copper conductor layer to form an oxidation resistant protective layer to cover the exposed region of the high melting metal layer. CONSTITUTION:A ceramic green sheet 11 on which a high melting point metal conductor layer 12 and an insulting layer 14 have been formed is fired in a reducing atmosphere. Then, a plating layer 15 of nickel or copper is fomred on the exposed high melting point metal conductor layer 12, if necessary. Then, conductive paste whose main component is Cu and which contains 0.5wt.% or more by weight of Au or Pd is screen-printed on the plating layer 15, which is subjected to a thermal treatment at a temperature of 850-1100 deg.C to alloy the conductive paste for the formation of an oxidation resistant protective layer 16. Moreover, thick film conductor paste is printed into a required circuit pattern and fired to form a copper conductor layer 17. Furthermore, if necessary, a resistor 18 and a protective glass layer 19 can be provided.

公开(公告)号：JPH02252297A

公开(公告)日：1990-10-11

申请号：JP7197889

申请日：1989-03-27

Applicant: NGK INSULATORS LTD

Inventor： MORIMOTO TADAHIKO ,  ASAI MICHIO

IPC: H05K3/46

Abstract: PURPOSE:To prevent the generation of pinhole and the like and to obtain a ceramic multilayer wiring board, whose insulation properties are not deteriorated, by a method wherein in case insulating paste layers are stacked on a conductor paste in a multilayer, the viscosities of the paste layers of the second time and succeeding times are made higher than that of the paste layer of the first time. CONSTITUTION:A conductor paste 2 is provided on an alumina ceramics green sheet 1. Then, an insulating paste 3 of the first time is printed excepting an interlayer through hole (a via hole) 5. A conductor paste is filled in the through hole and an insulating layer (an insulating paste) 4 of a viscosity higher than that of the paste 3 is applied on the paste 3 excepting the through hole. After this, the through hole is filled according to the need and an application of insulating pastes of the third time and succeeding times is executed and the insulating pastes are fired at 1600 deg.C to form a multilayer wiring board. In an application of the insulating pastes of a plurality of times, as the viscosities of the pastes are selected in a prescribed relation, there is no generation of pinholes and the deterioration of the electrical characteristics of the board is not generated.

公开(公告)号：JPH02250392A

公开(公告)日：1990-10-08

申请号：JP7042589

申请日：1989-03-24

Applicant: NGK INSULATORS LTD

Inventor： MIYAMURA KIKUJI ,  ASAI MICHIO

IPC: H01L23/12 ,  H05K1/02 ,  H05K1/09 ,  H05K3/12

Abstract: PURPOSE:To reduce a cost by forming a Cu thick film electrode section after forming an Au electrode section and by forming a specified connecting section between the Au electrode section and the Cu electrode section through specified burning. CONSTITUTION:After an Au electrode 4 is formed, a pattern is formed through screen printing method. Then, it is burned in an inert gas atmosphere to form an Cu thick film electrode section 6 and a conductor paste is burned in an inert gas atmosphere of 700 deg.C or lower to form a connecting section 5. Accordingly, disconnection caused by diffusion through Kirkendall effect of Au into Cu can be effectively eliminated, and the Au electrode section 4 is formed, thereby applying wire bonding and die bonding readily as in a conventional method. It is thereby possible to reduce an amount of used Au and to acquire a wiring board at a low cost.

公开(公告)号：JPH02250302A

公开(公告)日：1990-10-08

申请号：JP7042689

申请日：1989-03-24

Applicant: NGK INSULATORS LTD

Inventor： OTAKE YOSHIO ,  ASAI MICHIO

IPC: H01C17/242 ,  H01C17/24 ,  H05K1/16

Abstract: PURPOSE:To obtain a thick-film resistor whose power-resistant characteristic and pulse-resistant characteristic are good by a method wherein a resistor and a conductor are trimmed simultaneously by using a laser along a direction of an electric current flowing in the resistor and the laser beam is scanned on an overlapped part of the resistor and the conductor twice or more. CONSTITUTION:A thick-film resistor 3 is formed between pillow electrodes 2-1, 2-2 protruding from conductor patterns 1-1, 1-2; a trimming operation is executed by using a laser beam along a direction of an electric current flowing from the pillow electrode 2-1 to 2-2 or from the pillow electrode 2-2 to 2-1. The laser beam is scanned on an overlapped part of the pillow electrodes 2-1 and 2-2 and the thick-film resistor 3 twice or more in order to eliminate a residue after the trimming operation in the overlapped part and to obtain a stable resistance value. Thereby, it is possible to eliminate a part in which an electric field is concentrated, such as a tip part of a pattern, a part where the pattern is bent perpendicularly or the like; it is possible to obtain the thick- film resistor whose power-resistant property and pulse-resistant property are good and which has a stable resistance value.

公开(公告)号：JPS5914894B2

公开(公告)日：1984-04-06

申请号：JP9412478

申请日：1978-08-03

Applicant: Ngk Insulators Ltd

Inventor： SUZUKI TAKESHI ,  ASAI MICHIO

IPC: H01L23/12 ,  H01L23/08 ,  H01L23/48

CPC classification number: H01L2224/48091 ,  H01L2924/00014