公开(公告)号：JP2005302924A

公开(公告)日：2005-10-27

申请号：JP2004115144

申请日：2004-04-09

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： ITO TATSUYA

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a capacitor near a semiconductor chip mounted on a coreless multilayer substrate by using the coreless multilayer substrate. SOLUTION: A stiffener 130 is bonded to the coreless multilayer substrate 120. A ceramic substrate 150 in a size for covering an opening 132 where capacitor chips 160 are mounted is fitted in a position corresponding to the opening 132 of the stiffener 130 at the rear face of the coreless multilayer substrate 120. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：通过使用无芯多层基板在安装在无芯多层基板上的半导体芯片附近提供电容器。 解决方案：加强件130结合到无芯多层基板120上。用于覆盖安装电容器芯片160的开口132的尺寸的陶瓷基板150被装配在对应于加强件130的开口132的位置 无芯多层基板120的背面。（C）2006，JPO＆NCIPI

公开(公告)号：JP2005244140A

公开(公告)日：2005-09-08

申请号：JP2004055574

申请日：2004-02-27

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： ITO TATSUYA

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a wiring board that reduces the diameter of a via for making connection to a connection terminal on the side of an electronic component, narrows the pitch, and improves the formation precision in the wiring board, without having a core substrate.
SOLUTION: In the manufacturing method of the wiring board that does not have core substrates, allows both the main surfaces to be composed of a dielectric layer, and is made of a wiring lamination section, the following processes are performed in this order; namely a support removal process of forming a wiring lamination section 10' on a first dielectric layer via a metal thin-film layer 51, made of a metal material that differs from the conductive layer on at least one main surface of a support for reinforcement, removing the support, and exposing the metal thin-film layer 51; a process of forming an opening at the metal thin-film layer 51, forming an opening for vias by laser, and exposing the conductive layer 11; a process of removing the metal thin-film layer 51 by selective etching; and a process of filling the opening with a conductor, and forming the connection terminal of the wiring board on the exposed surface of the filled conductor.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：为了提供一种制造布线板的方法，该布线板减小了用于连接到电子部件侧的连接端子的通孔的直径，缩小了间距，并且提高了在 接线板，不具有芯基板。 解决方案：在不具有芯基板的布线板的制造方法中，允许两个主表面由电介质层构成，并且由布线层压部制成，按以下顺序进行以下处理 ; 即通过金属薄膜层51在第一电介质层上形成布线层叠部分10'的支撑移除过程，金属薄膜层51由与用于增强的支撑体的至少一个主表面上的导电层不同的金属材料制成， 去除载体，暴露金属薄膜层51; 在金属薄膜层51形成开口的过程，通过激光形成用于过孔的开口，以及使导电层11露出; 通过选择性蚀刻除去金属薄膜层51的工序; 以及用导体填充开口的过程，并且在填充导体的暴露表面上形成布线板的连接端子。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005243980A

公开(公告)日：2005-09-08

申请号：JP2004052707

申请日：2004-02-27

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： ITO TATSUYA

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method for easily obtaining a wiring board, in which a dielectric layer made of a polymer material and a conductive layer are alternately laminated without having a core substrate. SOLUTION: On the main surface of a foundation dielectric sheet formed on a support substrate for reinforcement in manufacture, a laminated sheet body, having a first dielectric sheet arranged via an adhesive layer so that it is included on the main surface, and a second dielectric sheet is formed so that it covers the first dielectric sheet and seals the first dielectric sheet, by adhering to the ground dielectric sheet at the peripheral region of the first dielectric sheet. The first dielectric sheet and a region on it are set to be a wiring laminate that should serve as a wiring board in the lamination sheet body, the peripheral section is removed, the end face of the wiring laminate is exposed, and the wiring laminate is released between the first dielectric sheet and the adhesive layer from the support substrate. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种容易获得布线板的制造方法，其中由聚合物材料制成的电介质层和导电层交替层叠而不具有芯基板。 解决方案：在制造中用于加强的支撑基板上形成的基底电介质片的主表面上，具有通过粘合剂层布置成使其包含在主表面上的第一电介质片的层叠片体，以及 形成第二电介质片，使得其覆盖第一电介质片并通过粘附到第一电介质片的周边区域处的接地电介质片来密封第一电介质片。 将第一电介质片及其上的区域设置为在层叠片体中作为布线基板的布线层叠体，除去周边部，将布线层叠体的端面露出，将布线层叠体 从支撑基板在第一电介质片和粘合剂层之间释放。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005072085A

公开(公告)日：2005-03-17

申请号：JP2003209372

申请日：2003-08-28

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： ITO TATSUYA

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method by which a wiring board that has no core substrate and is formed by alternately laminating dielectric layers composed of a polymer material and conductor layers upon another can be manufactured easily, and to provide a wiring board.
SOLUTION: In the method of manufacturing the wiring board, a laminated sheet body 10 having a closely-adhered metal foil body 5 which is formed on a supporting substrate 20 for reinforcement at manufacturing time by closely adhering two pieces of metal foil 5a and 5b which can be separated from each other by heating and a first dielectric sheet 11 sealing the metal foil body 5 is formed. Then the peripheral section of the laminated sheet body 10 is removed by using a region on the metal foil body 5 as a wiring laminating section 100 which must become a wiring board by performing electroplating on the exposed principal surface of the laminated sheet body 10 by supplying an electric current from one of a plurality of metallic terminal pads 33 through conductor layers 31 and 32 and via conductors 41-43 provided among dielectric sheets 11-14. Thereafter, the laminated sheet body 10 is peeled on the interface between the metal foil 5a and 5b by heating.
COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种方法，通过该方法可以容易地制造不具有芯基板并且通过交替层叠由高分子材料和导体层组成的电介质层而形成的布线基板的方法，并且提供布线 板。 解决方案：在制造布线板的方法中，具有紧密附着的金属箔体5的层压片体10，该金属箔体5形成在制造时通过紧密粘合两片金属箔5a 和5b，其可以通过加热彼此分离，并且形成密封金属箔体5的第一电介质片11。 然后，通过使用金属箔体5上的区域作为布线层压部100去除层压片体10的周边部，该布线层叠部100必须通过在层叠片体10的露出的主面上进行电镀而成为布线基板 来自多个金属端子焊盘33中的一个通过导体层31和32的电流以及设置在电介质片11-14之间的通孔导体41-43。 然后，通过加热在层叠片体10的金属箔5a，5b的界面上剥离。 版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2005072061A

公开(公告)日：2005-03-17

申请号：JP2003209104

申请日：2003-08-27

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： ITO TATSUYA

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board containing a relatively thin metallic core substrate, high-density wiring layers, etc., and to provide a method by which the wiring board can be manufactured accurately and efficiently. SOLUTION: The wiring board 1 (1a) comprises the metallic core substrate 2 having a front surface 3 and a rear surface 4, a plurality of insulating layers 5, 6, 13, and 15 respectively formed above the front and rear surfaces 3 and 4 of the substrates 2, and the wiring layers 12 and 14 positioned among the insulating layers 5, 6, 13 and 15. The wiring board 1 (1a) also comprises through holes 2a formed through the core substrate 2 from the front surface 3 to the rear surface 4 and via conductors 10 which are passed through the through holes 2a through insulators 7 to connect the wiring layer 12 above the front surface 3 of the core substrate 2 to the wiring layer 14 above the rear surface 4 of the substrate 2. COPYRIGHT: (C)2005,JPO&NCIPI

Abstract translation: 要解决的问题：提供一种包含相对薄的金属芯基板，高密度布线层等的布线板，并且提供可以精确高效地制造布线板的方法。 解决方案：布线板1（1a）包括具有前表面3和后表面4的金属芯基板2，分别形成在前表面和后表面上的多个绝缘层5,6,13和15 基板2的3和4以及位于绝缘层5,6,13和15之间的布线层12和14.布线板1（1a）还包括从前表面穿过芯基板2形成的通孔2a 3到后表面4和通孔导体10，其通过绝缘体7穿过通孔2a，以将芯基板2的前表面3上方的布线层12连接到基板的后表面4上方的布线层14 2.版权所有（C）2005，JPO＆NCIPI

公开(公告)号：JP2003309359A

公开(公告)日：2003-10-31

申请号：JP2003034499

申请日：2003-02-13

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： ITO TATSUYA ,  KIMURA YUKIHIRO

IPC: H05K3/00 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board which is superior in corrosion resistance, which does not require finish machining and which has low possibility of careless electrical conduction with an outer part or that in a wiring board, and to provide a manufacturing method for efficiently obtaining the wiring board. SOLUTION: The wiring board 1 is provided with metal core substrates 2 whose plane views show rectangles and which have surfaces 4 and rear faces 5 and built-up layers BU, formed of insulating layers 10, 14, 11 and 15 and wiring layers 12, 18, 13 and 19, which are formed on the surfaces 4 and the rear faces 5 of the metallic core substrates 2. Tie bars 3 and 3 are integrally disposed on respective sides of the metal core substrates 2. COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：提供一种耐腐蚀性优异的布线基板，其不需要精加工，并且与外部部分或布线板中的粗略电导率可能性低，并且提供 用于有效地获得布线板的制造方法。 解决方案：布线板1设置有金属芯基板2，其平面图示出矩形，并且具有由绝缘层10,14,11和15形成的表面4和背面5以及堆叠层BU和布线 层12,18,13和19，其形成在金属芯基板2的表面4和背面5上。拉杆3和3一体地设置在金属芯基板2的相应侧上。 （C）2004，JPO

公开(公告)号：JPH1167900A

公开(公告)日：1999-03-09

申请号：JP15946597

申请日：1997-06-17

Applicant: NGK SPARK PLUG CO

Inventor： ITO TATSUYA ,  TOYOSHIMA TAKESHI

IPC: H01L21/768 ,  H01L21/304 ,  H01L21/306 ,  H01L23/522 ,  H05K1/02 ,  H05K3/40 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To reduce the continuity defects of a via while keeping adhesion of a wiring pattern in a multi-layer printed-circuit board which is provided with a plurality of layers of wiring patterns, via respective resin insulating layers and with respective vias which set the wiring patterns into continuity. SOLUTION: First, the surface of a resin-insulating layer 6 which is formed in the upper part of a lower-layer wiring pattern 4 formed on a core substrate 1 and in which a via hole 7 is formed on the surface of the lower-layer wiring pattern 4 is roughened by an etchant. Then, the roughened surface 6a of the resin-insulating layer 6 is polished. After that, surfaces 6b, 7a, including the via holes 7 of the polished resin insulating layer 6, are roughened in the same manner. Thereby, a resin residue and a shape defect are hardly generated in the bottom part of a via which is formed later inside the via hole 7, and the close contact strength of an upper-layer wiring pattern which is formed later on the surface of the resin insulating layer 6 is maintained to be strong.

公开(公告)号：JP2014192176A

公开(公告)日：2014-10-06

申请号：JP2013063369

申请日：2013-03-26

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： NAGAI MAKOTO ,  MORI SEIJI ,  ITO TATSUYA ,  HAYASHI TAKAHIRO

IPC: H01L23/12 ,  H05K1/02 ,  H05K3/34

CPC classification number: H01L23/49838 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/544 ,  H01L2223/5442 ,  H01L2223/54426 ,  H01L2223/54486 ,  H01L2224/16237 ,  H01L2924/15311 ,  H05K1/141 ,  H05K3/3436 ,  H05K3/3457 ,  H05K3/4007 ,  H05K2201/098 ,  H05K2201/099

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board capable of improving reliability by surely preventing the progress of a crack in a solder bump.SOLUTION: This wiring board 10 comprises a board body 11, a pad 61, and a solder resist 81. The pad 61 is disposed on the reverse side of board 13, allowing a solder bump 84 used for connection with a mother board 91 to be formed on a surface 62. The solder resist 81 covers the reverse side of board 13 and has formed therein an opening 82 for the pad 61 to be exposed. A convex part 71 is formed on part of the surface 62 of the pad 61. The convex part 71 is set so that a height A4 from the surface 62 of the pad 61 to a tip face 72 is smaller than the depth of the opening 82, and is disposed inside the opening 82 in such a way that an outer surface 73 faces the inner surface of the opening 82, the shape of the convex part 71 in a plan view being similar to the shape in a plan view of the opening 82.

Abstract translation: 要解决的问题：提供一种能够可靠地防止焊料凸块中的裂纹的进步来提高可靠性的布线板。解决方案：该布线板10包括板主体11，焊盘61和阻焊剂81。 焊盘61设置在板13的背面，允许在表面62上形成用于与母板91连接的焊料凸块84.阻焊剂81覆盖板13的背面，并且在其中形成有开口 82用于垫61暴露。 凸部71形成在垫61的表面62的一部分上。凸部71被设定为使得从垫61的表面62到尖端面72的高度A4小于开口82的深度 并且设置在开口82的内部，使得外表面73面对开口82的内表面，凸部71的平面图形状与开口82的平面图中的形状相似 。

公开(公告)号：JP2014179659A

公开(公告)日：2014-09-25

申请号：JP2014124834

申请日：2014-06-17

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HAYASHI TAKAHIRO ,  NAGAI MAKOTO ,  ITO TATSUYA ,  MORI SEIJI ,  WAKAZONO MAKOTO ,  NISHIDA TOMOHIRO

IPC: H01L23/12 ,  H01L21/60 ,  H05K3/28 ,  H05K3/34

CPC classification number: H01L2224/16225

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board which surely protects a wiring conductor with a fine and strong dam portion formed on the outermost layer of a laminated body, and is excellent in connection reliability with a semiconductor chip.SOLUTION: A laminated body 31 constituting a wiring board 10 includes a plurality of connection terminal portions 41, and a wiring conductor 62, which function as conductor layers 24 on the outermost layer. The wiring conductor 62 is disposed pass through between the plurality of connection terminal portions 41 for flip-chip mounting a semiconductor chip 51. A resin insulating layer 23 on the outermost layer of the laminated body has a dam portion 63 and a reinforcement portion 64. The dam portion 63 covers the wiring conductor 62. The reinforcement portion 64 is formed between the wiring conductor 62 and the connection terminal portions 41 adjacent to the wiring conductor 62 so as to be lower than a height H3 of the dam portion 63. The reinforcement portion 64 is connected to the side face of the dam portion 63. A curvature of a corner of an upper edge site 63a of the dam portion 63 is larger than a curvature of a corner of a connection site 63b between the dam portion 63 and the reinforcement portion 64.

Abstract translation: 要解决的问题：提供一种布线板，其可靠地保护布线导体与形成在层叠体的最外层上的细小且牢固的坝部，并且与半导体芯片的连接可靠性优异。解决方案：层叠体31 构成布线板10包括多个连接端子部分41和布线导体62，其在最外层上用作导体层24。 布线导体62布置在多个连接端子部41之间，用于半导体芯片51的倒装芯片安装。层叠体的最外层的树脂绝缘层23具有阻挡部63和加强部64。 坝部63覆盖布线导体62.加强部64形成在布线导体62和与布线导体62相邻的连接端子部41之间，以比坝部63的高度H3低。 部分64连接到坝部63的侧面。坝部63的上边缘部位63a的角部的曲率大于坝部63和坝部63之间的连接部位63b的角部的曲率 加强部分64。

公开(公告)号：JP2013093538A

公开(公告)日：2013-05-16

申请号：JP2012055808

申请日：2012-03-13

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HAYASHI TAKAHIRO ,  ITO TATSUYA ,  MORI SEIJI

IPC: H05K3/34 ,  H01L23/12 ,  H05K3/46

CPC classification number: H05K3/244 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L2224/81411 ,  H01L2924/15311 ,  H05K1/111 ,  H05K3/3436 ,  H05K3/3452 ,  H05K2201/0338 ,  Y02P70/611 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To provide a wiring board having excellent reliability in connection with a semiconductor chip.SOLUTION: An organic wiring board 10 comprises a first build-up layer 31 formed on a substrate principal surface 11 side, in which resin insulation layers 21-23 and a conductor layer 24 are laminated. The conductor layer 24 in an uppermost layer in the first build-up layer 31 includes a plurality of connection terminal areas 41 for flip-chip mounting semiconductor chips, respectively. The plurality of connection terminal areas 41 are exposed on openings 43 of a solder resist 25. Each connection terminal area 41 has a connection region 51 of a semiconductor chip, and a wiring region 52 extending from the connection region 51 in a plane direction and having a width narrower than that of the connection region 51. Solder wettability of a surface of the wiring region 52 is lower than solder wettability of a surface of the connection region 51.

Abstract translation: 要解决的问题：提供一种与半导体芯片相关的具有优异的可靠性的布线板。 解决方案：有机布线板10包括形成在层叠有树脂绝缘层21-23和导体层24的基板主表面11侧上的第一堆积层31。 第一堆叠层31的最上层的导体层24分别具有用于倒装芯片安装半导体芯片的多个连接端子区域41。 多个连接端子区域41暴露在阻焊剂25的开口43上。每个连接端子区域41具有半导体芯片的连接区域51和从连接区域51沿平面方向延伸的布线区域52，并且具有 宽度比连接区域51的宽度窄。布线区域52的表面的焊料润湿性低于连接区域51的表面的焊料润湿性。（C）2013，JPO＆INPIT