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    DATEN BERTRAGUNGSSTRECKE MIT EINRICHTUNG ZUR PRUEFUNG DER DATENINTEGRITAET
    34.
    发明公开
    DATEN BERTRAGUNGSSTRECKE MIT EINRICHTUNG ZUR PRUEFUNG DER DATENINTEGRITAET 审中-公开
    使用设备进行测试DATENINTEGRITAET数据BERTRAGUNGSSTRECKE

    公开(公告)号：EP1665611A1

    公开(公告)日：2006-06-07

    申请号：EP04762641.1

    申请日：2004-08-10

    Applicant: ROBERT BOSCH GMBH

    Inventor： HEINEBRODT, Martin ,  WILHELM, Ulf ,  HAFFMANS, Paco

    IPC: H04L1/00

    CPC classification number: H04L1/0061 ,  H04L1/0045

    Abstract: Disclosed is a data transmission path (1) comprising an apparatus for verifying the integrity of data transmitted from the transmitter end (2) to the receiver end (4) of the data transmission path (3), particularly in a motor vehicle. Said data transmission path (1) further comprises a first data-modifying device (5) at the transmitter end and a second data-modifying device (6) at the receiver end, both of which have one identical transmission function, respectively, and a comparator that compares the output data (A1, A2) of the data-modifying devices (5, 6). Input data (E1) is processed into output data (A1) at the transmitter end (2) and is transmitted to the receiver end (4) while identical input data (E2) is transmitted to the receiver end (4) and is modified into output data (A2) there. Also disclosed is a data integrity verification method.

    BAUELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG
    35.
    发明公开
    BAUELEMENT UND VERFAHREN ZU DESSEN HERSTELLUNG 审中-公开
    COMPONENT与方法研究

    公开(公告)号：EP1515909A1

    公开(公告)日：2005-03-23

    申请号：EP02807519.0

    申请日：2002-12-11

    Applicant: ROBERT BOSCH GMBH

    Inventor： KRONMUELLER, Silvia ,  WILHELM, Ulf

    IPC: B81B3/00 ,  B81C1/00

    CPC classification number: B81C1/00095 ,  B81B2203/0307 ,  B81B2203/033 ,  B81C2201/0109 ,  G01P15/0802 ,  G01P15/125 ,  G01P2015/0814

    Abstract: The invention relates to a concept for anchoring fixed structural elements and in particular for anchoring electrodes for components, whose component structure is configured in a silicon layer (2) by means of a substrate (4) that acts as a mount. Said concept is particularly suitable for components produced from SOI wafers. According to the invention, the fixed element (6) is connected mechanically to the substrate (4) by means of at least one anchoring element (7), consisting of an anchoring material, said element extending through the silicon layer (2). If an SOI wafer is used, the anchoring element (7) extends through the silicon layer (2) and the sacrificial layer (3) of said SOI wafer. To achieve this, at least one cavity is created in the silicon layer (2) in the vicinity of the fixed element (6), said cavity extending through the entire silicon layer (2) and the sacrificial layer (3) to the substrate (4). The cavity is then filled with an anchoring material in such a way that the fixed element (6) is mechanically connected to the substrate (4) by means of the anchoring element (7) thus produced.

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