公开(公告)号：JPH0738251A

公开(公告)日：1995-02-07

申请号：JP20097193

申请日：1993-07-21

Applicant: SONY CORP

Inventor： ATSUMI JUN ,  MIIKEDA KAORU ,  ASAGI OSAMU ,  ARAI MASATAKA

IPC: B23P21/00 ,  H05K3/30 ,  H05K3/34 ,  H05K13/04

Abstract: PURPOSE:To provide a method for mounting an electronic component on a double-sided printed board in which floating of leads at the time of solder reflowing, dropping of the component can be prevented. CONSTITUTION:QFP type semiconductor components 2, 3 are mounted on a double-sided printed board by a solder reflowing method. Four corners of a resin-molded package of the component 2 of a surface B in which reflow soldering is finished are so coated with thermosetting adhesive 4 as to enclose the four corners over a height of a top 2a of a taper formed at the time of molding. The adhesive 4 is cured at a stage of preheating the component 3 of a surface A at the time of solder reflowing, and the component 3 is held. Drop of the component 2 due to deterioration of draping of adhesive with mold release agent at the time of transfer molding adhered to a surface of a resin mold can be prevented by holding it with the adhesive 4.

公开(公告)号：JPH05129499A

公开(公告)日：1993-05-25

申请号：JP31989491

申请日：1991-11-07

Applicant: SONY CORP

Inventor： ASAGI OSAMU ,  TAWARA HIROKI ,  MIIKEDA KAORU ,  AOKI YUKIO

IPC: H01L21/60 ,  H01L23/50 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H05K7/20

Abstract: PURPOSE:To mount electronic components on a board in a reduced thickness and a high density and to improve heat dissipation. CONSTITUTION:An IC chip 1 is connected to a copper pattern 6 for wiring on a board 5 through TCP leads 21 by a TAB mounting method, heat conductive adhesive 32 is charged between the chip 1 and a heat dissipating copper pattern 31 formed on the board 5, and heat generated from the chip 1 is let escape to the board 5 through the adhesive 32.

公开(公告)号：JPH05114443A

公开(公告)日：1993-05-07

申请号：JP27365991

申请日：1991-10-22

Applicant: SONY CORP ,  HIROSE ELECTRIC CO LTD

Inventor： ASAGI OSAMU ,  ENAMI YASUHIRO

IPC: H01R13/639 ,  H01R13/74

Abstract: PURPOSE:To simplify the assembly of an electric device and prevent a connector from being damaged at the time of mounting of the connector. CONSTITUTION:A square connector 27 is mounted in a panel 21 of an electric device by a fitting screw 26. A square connector insertion inlet 22 in which a part of the square connector 27 can be inserted is formed in the panel 21, a lock metal fitting 37 to join the square connector 27 to the back side periphery of the open part of the square connector insertion inlet 22 is fixed, and the installation screw 26 to penetrate the panel 21 and the square connector 27 is screwed in the lock metal fitting 37. Consequently, mounting of the square connector in the panel 21 can be carried out in the parts-storing position side of the inside of the electric device and also the fastening force of the fitting screw 26 does not directly work on the square connector 27 at the time of mounting of the connector.

公开(公告)号：JPS5629469A

公开(公告)日：1981-03-24

申请号：JP10422179

申请日：1979-08-16

Applicant: SONY CORP

Inventor： ASAGI OSAMU ,  SAKAI MASAAKI

IPC: G11B15/18 ,  H02M7/48 ,  H02P5/68

Abstract: PURPOSE:To reduce unnecessary radiation and to improve the utility efficiency of a common DC power source by providing different phases of a carrier pulse signals to be supplied to a plurality of pulse width modulation circuits. CONSTITUTION:A DC current is supplied from a common power source +B to a plurality of, for example, two switching circuits SW1, SW2. Pulse width modulation circutis K1, K2 supply switching control signals to the switching circuits SW1, SW2. A signal generator circuit SG generates two carrier pulse signals having different phase at 180 deg. and the same frequency to the two pulse width modulation circuits K1, K2, respectively. the rectangular pulse signals from the switching circuits SW1, SW2 are supplied through low pass filters LF1, LF2 to motors M1, M2, respectively.