Abstract:
PROBLEM TO BE SOLVED: To provide a thin film capacitance element and its manufacturing method wherein the capacitance per occupied area of a semiconductor substrate is increased and dispersion in capacitance and short-circuit defects are suppressed. SOLUTION: An insulation film 2 is provided on a semiconductor substrate 1 having an even surface, and a thin film electrode 3a is provided on it. A bump electrode 3b is selectively provided on the thin film electrode 3a, and the thin film electrode 3a and the bump electrode 3b constitute a lower electrode 3. An insulation film 4 and an upper layer electrode 5 are laminated on the lower electrode 3 in this order, thus an MIM capacitor is constituted.
Abstract:
PURPOSE:To prevent baking due to pattern by displaying a prescribed pattern whose brightness is changed at random to a blank part caused in the case of displaying a picture of the existing standard broadcast in a TV receiver whose aspect ratio is 16:9. CONSTITUTION:A high definition TV signal VHD is inputted to an input terminal 1 and a standard TV signal VNT is fed to an input terminal 2. A tie axis conversion circuit 5 compresses a video period TV1 in the horizontal direction of a signal VNT into a video period TV2 and blank periods T1, T2 are provided to both ends of the horizontal period and a switch control signal SW is outputted. Moreover, a pattern generating circuit 7 outputs a pattern whose brightness changes at random. A switch circuit 6 is switched to the position of a contact (a) at the video period TV2 and switched to the position of a contact (b) at the blank periods T1, T2 added with the pattern. Then the output of the circuit 6 is fed to a receiver 10 via the position (b) of the switch circuit 4.
Abstract:
PROBLEM TO BE SOLVED: To provide a PSG test device appropriate for home monitoring.SOLUTION: The PSG-test headgear includes an electroencephalogram electrode and an electrooculogram electrode and an oxygen saturation sensor. The electroencephalogram electrode obtains the electroencephalogram of a user. The electrooculogram electrode obtains the electrooculogram of the user. The oxygen saturation sensor obtains the oxygen saturation level of the user. PSG test device further has a PSG test chest brace having a chin electromyogram electrode to obtain a chin electromyogram, an airflow sensor which obtains nasal and mouth breathing, an electrocardiogram sensor to obtain an electrocardiogram and a respiratory movement sensor which obtains respiratory movement.
Abstract:
PROBLEM TO BE SOLVED: To accurately obtain waiting time up to command retransmission from a controller. SOLUTION: After card command transmission processing, a reader/writer calculates total waiting time and transmits the calculated total waiting time to a controller 11 as an accepted packet (step S13). Concretely, the reader/writer calculates card waiting time by adding card command transmission processing time to the maximum response waiting time of card response. Further, the reader/writer calculates total waiting time according to following formula: total wait time = card waiting time × (retrial frequency +1)+ card access response generation time. This invention can be applied to a non-contact communication system. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an imaging apparatus for miniaturizing a chassis, and being superior in establishing a degree of freedom of designability while improving operability in imaging. SOLUTION: The chassis 12 has an elongated shape, wherein one of surfaces in a thickness direction is a front surface 12A, and the other surface in the thickness direction is a rear surface 12B which is parallel to the front surface 12A. An imaging optical system 14 includes an objective lens 14A which is located nearest to an object side, wherein the objective lens 14A is provided at a portion near one end portion in a longitudinal direction of the chassis 12. A shutter button 25 is provided on the same surface as a surface (front surface 12A) of the chassis 12 wherein the objective lens 14A is provided, and at a portion of the other end side in a longitudinal direction of the chassis 12 nearer than the objective lens 14A at near the objective lens 14A. COPYRIGHT: (C)2009,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a manufacturing method of a field effect transistor and the field effect transistor which can reduce IMD (intermodulation distortion), and to provide a semiconductor device equipped with this field effect transistor and a communication apparatus. SOLUTION: This field effect transistor 1 has a buried gate region 5 formed by doping an impurity in a compound semiconductor substrate 19, wherein concave portions 6L and 6R are provided on both the sides of the buried gate region 5 of the compound semiconductor substrate 19. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a management server, information processor, management method, and information processing method for protecting copyright of a content. SOLUTION: A management server 20 is provided with: a group management part 232 for registering one or more information processor 30 owned by an identical user in one group and distributing a user key granted uniquely to the group-registered information processor for each user; a licence issuing part 238 for issuing a license obtained by encrypting a use condition of the content and a content key for decoding an encrypted content with the user key in response to a request from the information processors; and a right information issuing part 260 for issuing right information to permit use of the content based on the license in a specific use form to an information processor whose use in the specific use form is permitted among group-registered information processors. COPYRIGHT: (C)2008,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a bias circuit for uniformly suppressing bias currents even when the threshold voltage of a transistor fluctuates. SOLUTION: A resistance element R1 whose resistance value fluctuates while being linked with the threshold of a transistor FET1 is connected between a gate bias supply terminal T3 and a gate terminal G. Even when the threshold of the transistor FET1 fluctuates, the resistance value is increased/decreased according to the increase/decrease of the threshold. When the threshold is increased, the resistance value is decreased, and a bias voltage is adjusted so as to be increased according to a resistance partial pressure. When the threshold is decreased, the resistance value is increased, and the bias voltage is adjusted so as to be decreased according to the resistance partial pressure. The transistor FET1 is constituted as a junction transistor having a first conductive channel and a second conductive gate, and a resistance element R1 is manufactured by a second conductive type semiconductor area. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a semiconductor device which has high productivity, even though the device can operate at a high speed and at high frequencies, and to provide its manufacturing method. SOLUTION: A sidewall 12b, of an end edge 12a of an insulation film 12 on a semiconductor substrate 11, is provided with a compound film 15 of a conductor element and a metal element, and this compound film 15 serves as a gate. The compound film 15 can be formed matching itself with the sidewall 12b, by using semiconductor elements in the insulation film 12, semiconductor elements of a semiconductor film formed on the side wall 12b without using masks, etc. Consequently, the length of a gate can be set at right angles with respect to the sidewall 12b, and then when the gate is formed, application of lithography for prescribing the gate length is not necessary, so that a fine gate can be formed easily without using special exposure apparatus for fine processing. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To realize an ohmic electrode having characteristics which are practically satisfactory for a GaAs-base semiconductor or the like. SOLUTION: A Ni thin film 3 having a thickness of 8 to 30 nm, an In thin film 4 having a thickness of 2 to 6 nm, and a Ge thin film 5 having a thickness of 10 to 50 nm are formed in a predetermined pattern on an n + -type GaAs substrate 1, and then the n + -type GaAs substrate 1 on which the Ni thin film 3, the In thin film 4, and the Ge thin film 5 are formed is subjected to a heat treatment at 300 to 600°C for several seconds to several minutes to form an ohmic electrode having a laminated structure including an n ++ -type GaAs layer 6 which is further grown from the n + -type GaAs substrate 1, an InGaAs layer 7, and a NiGe thin film 8; or a high-melting metal thin film like a Nb thin film or a thin film made of the compound of the metal is formed further on the Ge thin film 5, or a thin film made of wiring metal like an Au thin film is further formed thereon, and then the n + -type GaAs substrate 1 is subjected to a heat treatment to form an ohmic electrode. COPYRIGHT: (C)1999,JPO