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公开(公告)号：JP2004038002A
公开(公告)日：2004-02-05
申请号：JP2002197313
申请日：2002-07-05
Inventor： OSAKO JUNICHI , KAKINUMA MASAYASU , NAKABACHI HIDEYA , HAYASHI HIROSHI
CPC classification number: G03B21/56
Abstract: PROBLEM TO BE SOLVED: To provide a screen for projection which not only makes it possible to obtain a sharp image without being influenced by a projection environment, but also can improve visual field characteristics. SOLUTION: A plurality of projection parts 11A are formed as a light diffusion part on the surface of a substrate 11. On the substrate 11, an optical thin film 12 is formed and on the surface of the optical thin film 12, projection parts 12A in the same shape with the projection parts 11A on the substrate are formed. When external light is incident on the optical thin film 12 together with primary-color wavelength range light, the optical thin film 12 reflects only the primary-color light wavelength range light, and at least visible wavelength range light of the external light is absorbed by the substrate 11. Here, when the primary-color wavelength range light is incident on the optical thin film 12, for example, at right angles, the primary-color wavelength range light has a specified angle θ of incidence to the optical thin film 12 through the projection parts 12A of the optical thin film 12 and is scattered as diffused reflected light at a reflection angle 2θ at a specified ratio, so the visual field angle of the screen increases. COPYRIGHT: (C)2004,JPO
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公开(公告)号：JP2003017246A
公开(公告)日：2003-01-17
申请号：JP2001195124
申请日：2001-06-27
Inventor： KAYAMA TAKASHI , OSAKO JUNICHI , AMANO SHUNJI
Abstract: PROBLEM TO BE SOLVED: To provide an electrical connection device in which a second substrate can be simply removed from a first substrate and repairing can be made and cost reduction can be achieved without using ACF in the case in which the second substrate such as a flexible printed circuit board is electrically connected to the organic electroluminescent element formed on the first substrate, and a display having the electrical connection device.
SOLUTION: This is an electrical connection devices 300, 301 in which a second substrate 50 is electrically connected to the organic electroluminescent element 80 formed on a first substrate 121, and comprises a first connection electrode part 200 which is made of a first Ni film 310 that is electrically connected to the electrode of the organic electroluminescent element and a first Au membrane 320 that is laminated on the first Ni film 310 and a second connection electrode part 201 which is made of a second Ni film 330 laminated on the first Au film 320 of the first connection electrode part 200 and a second Au film 340 that is laminated on the second Ni film 330 and is electrically connected to the second substrate 50.
COPYRIGHT: (C)2003,JPOAbstract translation: 要解决的问题：提供一种电连接装置，其中可以从第一基板简单地移除第二基板并且可以进行修理，并且可以在不使用ACF的情况下实现成本降低，其中第二基板例如柔性 印刷电路板电连接到形成在第一基板上的有机电致发光元件，以及具有电连接装置的显示器。 解决方案：这是一种电连接装置300,301，其中第二基板50电连接到形成在第一基板121上的有机电致发光元件80，并且包括由第一Ni膜310制成的第一连接电极部分200 电连接到有机电致发光元件的电极和层叠在第一Ni膜310上的第一Au膜320和由层叠在第一Au膜320上的第二Ni膜330制成的第二连接电极部201 并且层压在第二Ni膜330上并与第二基板50电连接的第二Au膜340。
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公开(公告)号：JP2002216955A
公开(公告)日：2002-08-02
申请号：JP2001007399
申请日：2001-01-16
Applicant: SONY CORP
Inventor： KAKINUMA MASAYASU , OSAKO JUNICHI
Abstract: PROBLEM TO BE SOLVED: To provide an organic electric field light-emitting display device and its manufacturing method wherein the manufacturing is easily carried out, the yield is improved and a large-sized screen is made possible. SOLUTION: A positive electrode layer 12 and an insulating layer 15 are laminated on a substrate 11, and a penetrating part 15A is formed in the stripe state to be orthogonal to the positive electrode layer 12 of the depth not reaching the positive electrode layer 12 in this insulating layer 15. Next, Ni plating is applied on the penetrating part 15A, and at the same time, inside is filled up, and a projection H projecting on the insulating layer 15 is formed, and a picture element separating part 16A is made to be bolt-shaped in a cross- sectional shape. A negative electrode layer 18 is formed at one side on the substrate state 11 at this state. At that time, in the picture element separating part 16A, a projection H is one step higher than the other region on the substrate 11, and the negative electrode 18 is automatically divided at the projection part H. By this, patterning of the negative electrode layer 18 is precisely carried out without using a metal mask or an insulating wall or the like.
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公开(公告)号：JP2002184375A
公开(公告)日：2002-06-28
申请号：JP2000379154
申请日：2000-12-13
Applicant: SONY CORP
Inventor： KAYAMA TAKASHI , OKAYASU YOSHISADA , TOMURA KIYOSHI , AMANO SHUNJI , OSAKO JUNICHI
IPC: H01M2/10
Abstract: PROBLEM TO BE SOLVED: To provide a cell enabled to make the size small and thin and to reduce the cost, with improved reliability of electric connection, and to provide an electronic device using the cell. SOLUTION: The electronic device comprises a case 200, a cell body 34 arranged inside the case 200 having electrode taking out parts 50, 52, lands 42, 44 arranged inside the case 200 electrically connecting the electrode taking out parts 50, 52, and a solder part 200 arranged at an opening 300 which is formed to the electrode taking out parts 50, 52 electrically and mechanically connecting the electrode taking out part 50, 52 with the lands 42, 44.
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公开(公告)号：JP2002169483A
公开(公告)日：2002-06-14
申请号：JP2000368664
申请日：2000-12-04
Applicant: SONY CORP
Inventor： OMI MOTOSUKE , KAYAMA TAKASHI , KOTAKE RYOTA , OZAKI YUJI , AMANO SHUNJI , OSAKO JUNICHI
Abstract: PROBLEM TO BE SOLVED: To provide a display device, an electronic appliance and a method for manufacturing a display device such that the conductive connecting part of a flexible wiring board can be electrically surely connected to a conductive metal film on the substrate where an organic electroluminescent element is formed and that the above electric connection can be performed even in the vicinity of the organic electroluminescent element. SOLUTION: The device is equipped with an organic electroluminescent element formed on a first substrate 121, a conductive metal film 170 formed in the position on the first substrate 121 not overlapping with the organic electroluminescent element, a second substrate 50 having a plurality of holes and a conductive connecting part 220 in the surrounding part forming the holes, and a solder part 330. The solder part 330 is supplied into the holes of the second substrate 50 before the second substrate 50 is adhered to the first substrate 121 and is fused to electrically connect the conductive metal film 170 on the first substrate 121 to the conductive connecting part 220 of the second substrate 50 to electrically connect the organic electroluminescent element to the second substrate 50.
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Patent Agency Ranking
公开(公告)号：JP2001313487A
公开(公告)日：2001-11-09
申请号：JP2000131383
申请日：2000-04-28
Applicant: SONY CORP
Inventor： OKITA HIROYUKI , OSAKO JUNICHI , ISHIKAWA HIROKAZU , OKAYASU YOSHISADA
IPC: H05K7/12 , H01M2/10 , H01M10/60 , H01M10/613 , H01M10/615 , H01M10/6561 , H01M10/658 , H05K7/20 , H01M10/50
Abstract: PROBLEM TO BE SOLVED: To solve the influence of the change of heat or temperature from the outside part on electronic components, and to hold the use temperature of the electronic components as a proper temperature, so that the degree of freedom for optimizing the mounting design of the electronic components in electronic equipment or the like from the point of view of signal processing can be ensured without being affected by any constraint associated with the change of heat or temperature, and that the high density of the mounting technique can be achieved without being affected by any constraint related with the change of heat or temperature. SOLUTION: The primary part of a heat insulating member 1 for electronic components is constituted of film-shaped housings 3a and 3b arranged so as to be faced to each other with an interval, so that a heat insulating layer 2 in a sealed structure can be formed with the surroundings sealed, a spacer 4 for mechanically holding the interval of the housings 3a and 3b, and a gas barrier film 5 formed on the inner face sides of the housings 3a and 3b.
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公开(公告)号：JP2000183500A
公开(公告)日：2000-06-30
申请号：JP36126398
申请日：1998-12-18
Applicant: SONY CORP
Inventor： SHIMODA KAZUTO , KAKINUMA MASAYASU , KAWASHIMA TOSHITAKA , OSAKO JUNICHI
Abstract: PROBLEM TO BE SOLVED: To provide an apparatus and a method for pattern formation, which are used to manufacturing a flexible printed-wiring board or the like and in which mass productivity is provided. SOLUTION: In this pattern formation method, a support 3 is run and moved to a take-up roll 6 via a roll 5a, a guide roll 5b and a guide roll 5c from a feed roll 4. A mask 10 is arranged so as to face the support 3. A required pattern is formed continuously on the moved support 3 through a sputtering or etching, by operating a pattern forming source 9 in a reduced pressure atmosphere.
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公开(公告)号：JPH06322542A
公开(公告)日：1994-11-22
申请号：JP13536393
申请日：1993-05-13
Applicant: SONY CORP
Inventor： MORITA YOICHI , OSAKO JUNICHI , HONJO TEIJI , MIYAI SEIICHI
IPC: C23C14/56
Abstract: PURPOSE:To provide a compact device capable of efficiently forming a multilayer thin film. CONSTITUTION:Plural independent process chambers 21 to 24 are formed in a small-sized vacuum thin film forming device, a substrate holder 37 with a substrate 38 mounted thereon in a load locking chamber 11 is moved by a conveyor 32 successively through the chambers 21 to 24, and a multilayer thin film is continuously formed.
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公开(公告)号：JPH0559537A
公开(公告)日：1993-03-09
申请号：JP22190791
申请日：1991-09-03
Applicant: SONY CORP
Inventor： OSAKO JUNICHI
Abstract: PURPOSE:To provide a deposition apparatus capable of always maintaining the accuracy of oblique deposition to certain one and in which cleaning is needless or, if cleaning is needed, it can simply be finished because deposition is not applied to a shutter by providing the shutter with a heating unit. CONSTITUTION:The space between the source of deposition melting a magnetic metal 2 in a crucible 25 and a supporting body 1 on which the magnetic metal is deposited with a shutter 11 for regulating the incident angle of the magnetic metal as the material to be deposited, and this shutter 11 is provided with a heating unit 12.
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公开(公告)号：JPS63121652A
公开(公告)日：1988-05-25
申请号：JP26588386
申请日：1986-11-08
Applicant: SONY CORP
Inventor： KANEDA YOSHIYUKI , ARITA KOICHIRO , OSAKO JUNICHI
Abstract: PURPOSE:To obtain a metal mold for molding plastics having satisfactory heat resistance, releasability and slidability as well as superior wear resistance and a long service life by forming an Al2O3 film or i-C film by ion plating on the surface of a metal mold made or a light alloy. CONSTITUTION:The Al2O3 film or i-C film is formed by ion plating on the surface of a metal mold made of a light alloy such as an Al alloy. The pref. thickness of the formed film is about 1-5mum. The wear resistance of the metal mold is improved, the deterioration of the dimensional accuracy is prevented and the service life is prolonged. The film has very high smoothness and superior thermal stability and improves the heat resistance, slidability and releasability of the metal mold.
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