公开(公告)号：JP2006185931A

公开(公告)日：2006-07-13

申请号：JP2004374446

申请日：2004-12-24

Applicant: TOKUYAMA CORP

Inventor： YAMAMOTO YASUYUKI ,  MAEDA MASAKATSU

IPC: H01S5/022

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor laser device in which a metallization layer is formed on the side face of an element mounting substrate such as a submount, and to provide its convenient fabrication process. SOLUTION: The semiconductor laser device comprises an element mounting substrate 2, and a semiconductor laser element 1 bonded onto the element mounting substrate through a solder layer 3 wherein the light emitting surface of the semiconductor laser element 1 is flush with the upper surface of the element mounting substrate at the front end thereof and the lower surface of the element mounting substrate at the front end thereof is projecting from the upper surface of the element mounting substrate at the front end thereof in the traveling direction of laser beam. A bevel is formed at least partially on the front side face of the element mounting substrate from the front end of the upper surface of the element mounting substrate toward the front end of the lower surface and a metallization layer is formed on the bevel of the front side face of the element mounting substrate. COPYRIGHT: (C)2006,JPO&NCIPI

公开(公告)号：JP2006100688A

公开(公告)日：2006-04-13

申请号：JP2004286971

申请日：2004-09-30

Applicant: Tokuyama Corp ,  株式会社トクヤマ

Inventor： MAEDA MASAKATSU ,  YAMAMOTO YASUYUKI

IPC: H01L33/60

CPC classification number: H01L33/486 ,  H01L24/73 ,  H01L33/46 ,  H01L33/62 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/45144 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/15153 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/0401

Abstract: PROBLEM TO BE SOLVED: To provide a method of efficiently manufacturing a package for housing a light-emitting element by which a fraction defective due to the deformation of a substrate accompanying forming of a through hole for wiring is reduced in the case of forming the through hole for wiring which is extended vertically through an insulation substrate, in the package for housing a light-emitting element in a recess for housing the light-emitting element consisting of the insulation substrate and a reflector frame.
SOLUTION: The package for housing the light-emitting element is constituted so as to position the through hole for wiring provided so as to be extended through the insulation substrate at the lower part of the reflector frame. A substrate green sheet and a frame green sheet are prepared separately, and a paste containing ceramic powder is interposed between both of them to connect both of them. Then, it is degreased/sintered to be integrated.
COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 解决问题的方案：提供一种有效地制造用于容纳发光元件的封装的方法，在发光元件的封装中，伴随着形成用于布线的通孔的基板的变形而导致的不良的部分减少 在用于容纳由绝缘基板和反射器框架组成的发光元件的凹部的凹部中容纳发光元件的封装中，形成用于垂直延伸穿过绝缘基板的布线用通孔。 解决方案：用于容纳发光元件的封装被构造成将布线用通孔定位成在反射器框架的下部延伸穿过绝缘基板。 单独制备基板生片和框架坯片，并且在两者之间插入含有陶瓷粉末的糊料以将它们连接。 然后，将其脱脂/烧结成一体化。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2006024778A

公开(公告)日：2006-01-26

申请号：JP2004202097

申请日：2004-07-08

Applicant: Tokuyama Corp ,  株式会社トクヤマ

Inventor： SUGAWARA KEN ,  MAEDA MASAKATSU

IPC: H01L21/301

Abstract: PROBLEM TO BE SOLVED: To provide a method for efficiently manufacturing a submount chip applied sheet to which a plurality of submount chips are applied with a substantially continuous surface forming one end surface of a substrate and one end surface of a solder pattern. SOLUTION: A metallic layer formed as an element bonding electrode is formed on the surface of a substrate, a submount chip material substrate is prepared as an insulating substrate having a plurality of solder patterns arranged and formed on the metallic layer, and a glass plate is bonded to one surface of the submount chip material substrate having the solder patterns. Thereafter, parts of the glass plate, the solder patterns, the metallic layer, and the insulating substrate are sequentially ground to form a cut guide groove; and then the glass plate is removed. Next, an adhesive sheet is applied to one surface of the obtained substrate having the solder patterns and to the opposing surface of the substrate, and then the substrate is cut into submount chips without fully cutting the adhesive sheet. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 解决问题的方案：提供一种用于有效地制造安装有多个基座芯片的基座芯片的基板的基板连续表面的方法，所述基板连续的表面形成基板的一个端面和焊料图案的一个端面。 解决方案：在基板的表面上形成作为元件接合电极形成的金属层，准备基板芯片材料基板作为在金属层上布置并形成多个焊料图案的绝缘基板，并且 玻璃板与具有焊料图案的基板芯片材料基板的一个面接合。 然后，依次研磨玻璃板，焊锡图案，金属层，绝缘基板的一部分，形成切割导槽; 然后移除玻璃板。 接下来，将粘合片施加到所获得的具有焊料图案的基板的一个表面和基板的相对表面上，然后将基板切割成基座芯片而不完全切割粘合片。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JPH08167674A

公开(公告)日：1996-06-25

申请号：JP31068094

申请日：1994-12-14

Applicant: TOKUYAMA CORP

Inventor： MAEDA MASAKATSU ,  MIYAHARA KENICHIRO ,  OGOSHI TOKIO

IPC: H01L23/12

Abstract: PURPOSE: To provide a surface mount package which can effectively prevent the noise generated by the potential difference between a power source layer and an earth layer at the time of high-speed operation by suppressing the inductance between the power source layer and the earth layer and a terminal for external connection. CONSTITUTION: This is a package where a ground layer 5A and/or a power source layer 5B are stacked on a signal layer 6 through an insulating layer 7, and here a terminal 10 for external connection of a package is made, and the signal layer 6, the ground layer 5A, and the power source layer 5B are connected to the terminal 10 for external connection, and besides the ground layer 5A or the power source layer 5B is connected to the terminal 10 for external connection by the connection wiring going by way of the side face of the package.

公开(公告)号：JP2007207914A

公开(公告)日：2007-08-16

申请号：JP2006023274

申请日：2006-01-31

Applicant: Tokuyama Corp ,  株式会社トクヤマ

Inventor： YAMAMOTO YASUYUKI ,  YATABE OSAMU ,  MAEDA MASAKATSU

IPC: H05K3/24 ,  H01L23/12

CPC classification number: H01L23/15 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H05K1/092 ,  H05K3/4667 ,  H05K2201/0266 ,  H05K2201/0352 ,  Y10T428/131 ,  Y10T428/24355 ,  Y10T428/24917 ,  Y10T428/24926 ,  Y10T428/24942 ,  Y10T428/31 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a metallized ceramic substrate which can ensure an airtight property even in a multilayer substrate having a plurality of metallized layers. SOLUTION: A method for manufacturing the metallized ceramic substrate has the steps of forming a first conductive paste layer containing a metal powder on a ceramic sintered body substrate, forming a second conductive paste layer containing the metal powder having an average particle size different from the metal powder constituting the first conductive paste layer, and sintering the first conductive paste layer and the second conductive paste layer to form a first conductive layer and a second conductive layer. A surface roughness of the first conductive layer differs from that of the second conductive layer. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供即使在具有多个金属化层的多层基板中也能确保气密性的金属化陶瓷基板。 解决方案：一种用于制造金属化陶瓷基板的方法包括以下步骤：在陶瓷烧结体基板上形成含有金属粉末的第一导电浆料层，形成含有平均粒径不同的金属粉末的第二导电浆料层 从构成第一导电膏层的金属粉末中烧结第一导电浆料层和第二导电浆料层，形成第一导电层和第二导电层。 第一导电层的表面粗糙度与第二导电层的表面粗糙度不同。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JPH08118032A

公开(公告)日：1996-05-14

申请号：JP25179694

申请日：1994-10-18

Applicant: TOKUYAMA CORP

Inventor： MAEDA MASAKATSU

IPC: B23K11/00 ,  B21F15/08 ,  B23K11/11 ,  B23K11/24 ,  H01L23/50

Abstract: PURPOSE: To execute welding of good external appearance and high reliability by joining the overlapped place of a metal thin wire by inverter type resistance welding. CONSTITUTION: Plural metal thin wires, in which at least one wire consists of a metal having

公开(公告)号：JPH0897343A

公开(公告)日：1996-04-12

申请号：JP23328394

申请日：1994-09-28

Applicant: TOKUYAMA CORP

Inventor： MAEDA MASAKATSU ,  MIYAHARA KENICHIRO

IPC: H01L23/50

Abstract: PURPOSE: To provide package manufacture which allows easy removal of unnecessary lead parts and improves shear position accuracy by connecting some leads of a lead frame for a signal layer with the leads for forming the outer lead of a power source layer plane and the outer lead of a grounding layer plane. CONSTITUTION: A power source layer plane 3a and a grounding layer plane 4a have a metal strip-shaped outer lead 6, whose edge is held by a tie-bar 8, on the outer circumference. A signal layer lead frame 5 is formed of a plurality of strip-shaped leads 7, which include a lead held by a tie-bar 10 at the edge and is to be the connecting terminal to the outer leads of the power source layer plane and the grounding layer plane. The power source layer plane 3a, the grounding layer plane 4a and the signal layer lead frame 5 are stacked, and the outer leads 6 of the power source layer plane and the grounding layer plane are connected with the lead to be the connecting terminal for the signal layer lead frame 5. Then the tie-bar 8 for the power source layer plane and the grounding layer plane is moved to and fro, using the connecting part as a supporting point and the joint 11 is bent. Then, unnecessary outer leads are removed by shearing and a package is manufactured.