PRODUCTION OF POLYARYLENE SULFIDE RESIN MOLDING

    公开(公告)号:JPS57164131A

    公开(公告)日:1982-10-08

    申请号:JP4936681

    申请日:1981-04-03

    Abstract: PURPOSE:To provide the titled molding having high thermal distortion temperature and excellent heat-resistance, by melt-molding polyarylene sulfide resin and by subsequent thermal treatment. CONSTITUTION:A polyarylene sulfide resin having a repeating unit of -(Ar-S)- (where Ar is a divalent aromatic radical containing a 6C-membered ring) as a main constructional unit is melt-molded. The moldings are then heated at 250- 280 deg.C for 10hr. By this thermal treatment a thermal distortion temperature can be enhanced by at least 30 deg.C, and a good heat-resistant molding is obtained. If the thermal treatment temperature is =280 deg.C a size distortion of the molding occurs unfavorably. If a thermal treatment time is

    IMPACTTRESISTANT POLYMER COMPOSITION

    公开(公告)号:JPS5661456A

    公开(公告)日:1981-05-26

    申请号:JP13754979

    申请日:1979-10-26

    Abstract: PURPOSE:To provide a polymer compsn. in which impact resistance is improved, by a method wherein a polar elastomer is blended witha polyarylene ether sufone- polyamide block copolymer. CONSTITUTION:50-3pts.wt. of a polar elastomer is blended with 50-97pts.wt. of a polyarylene ether sulfone-polyamide block copolymer in such a proportion that the combined amount of the elastomer an the blocked copolymer becomes 100pts.wt. The polyarylene ether sulfone used in a linear polymer composed of an arylene linkage, an ether linkage and a sulfone linkage in combination with one another. When the amount of the elastomer is below 3pts.wt., there can be obtd. little effect on the improvement of impact resistance. It is preferred to use the elastomer in an amount of more than 50pts.wt. because the thermal properties ans the mechanical properties of the block copolymer are greatly reduced.

    POLYAMIDEEIMIDE RESIN COMPOSITION
    33.
    发明专利

    公开(公告)号:JPS5610557A

    公开(公告)日:1981-02-03

    申请号:JP8587079

    申请日:1979-07-09

    Abstract: PURPOSE:A polyamide-imide resin composition, having balanced flow characteristics and mechanical properties, composed of an aromatic polyamide-imide resin and a specified amount of a phenoxy resin. CONSTITUTION:A composition, composed of (A) 5-99.9wt% of an aromatic polyamide-imide resin having a repeating unit of formula I (wherein Ar is a trivalent aromatic residue, including a 6C ring; R is a bivalent aromatic and/or aliphatic residue; R is H, methyl or phenyl) as the main structural unit, (B) 0.1-50wt% of a phenoxy resin, having melt viscosity poise at 350 deg.C, and (C) 0- 70wt% of a filler. The phenoxy resin is a polymer of formula II (wherein Y is bivalent phenol residue; X is a hydroxy group-containing epoxide residue; n>=30), synthesized by the reaction of phenol with a halogenated epoxide in the presence of an alkali.

    RESIN COMPOSITION
    34.
    发明专利

    公开(公告)号:JPS55102650A

    公开(公告)日:1980-08-06

    申请号:JP1066179

    申请日:1979-02-01

    Abstract: PURPOSE:A composition that is made by combining a specific aromatic polysulfon resin with an aromatic polyamideimide resin with specific recurring structure units, thus having improved melt molding properties. CONSTITUTION:Said composition comprises 50-99.9pts.wt. of an aromatic polyamideimide resin having the recurring units of formula I (Ar is aromatic, R is aromatic and aliphatic residue, R' is H, methyl, phenyl) and 0.1-50 parts of a polyarylenepolyetherpolysulfone resin with a melt flow of over 0.1g/10min at 350 deg.C and 2160g load and a decomposition point of over 350 deg.C as a fluidization agent. EFFECT:Said composition has improved flow properties and give moldings with high physical properties.

    RESIN COMPOSITION
    35.
    发明专利

    公开(公告)号:JPS5580457A

    公开(公告)日:1980-06-17

    申请号:JP15313778

    申请日:1978-12-13

    Abstract: PURPOSE:To provide resin compsn. having improved melt processability, consisting of arom. polyamidoimide resin and a specified fluidizing promotor. CONSTITUTION:(B) From 0.1-40pts.wt. of polyamide polymer (having a decomposition temp below 350 deg.C, a melt viscosity below 1X10 poises at 300 deg.C) as fluidizing agent is blended with (A) from 60-99.9pts.wt. of arom. polyamidoimide resin contg. from 50-100mol% of repeating unit, as main constituting unit, of formula (wherein Ar is trivalent arom. gp. contg. at least one carbon six-membered ring, R is divalent arom. and/or aliph. residual gp., R is H, methyl or phenyl). The blend is mixed in the molten state at a temp. of from 250-400 deg.C.

    THERMOPLASTIC AROMATIC POLYAMIDE-IMIDE COPOLYMER

    公开(公告)号:JPH0297527A

    公开(公告)日:1990-04-10

    申请号:JP25021888

    申请日:1988-10-04

    Abstract: PURPOSE:To form a polyamide-imide copolymer having both good heat stability and good flow at high temperatures, thus having good melt moldability, and giving a molding of an excellent balance among the properties by using a specified imido diamine. CONSTITUTION:This copolymer is composed of structural units A of formula I, structural units B of formula II and structural units C of formula III, wherein 1mol of (B+C) is present per mol of A and 0.95-0mol of C is present per 0.05-1mol of B. It has a structure in which A and B or C are alternately bonded together, and the Ar groups of units B and units C are composed, on the whole, of 0.05-0.70mol of bivalent residues of formula IV and 0.95-0.30mol of bivalent residues of formula V. This copolymer has an inherent viscosity of 0.2-5.0dl/g as measured in N-methylpyrrolidone in a concentration of 0.5g/dl at 30 deg.C. In the above formulas, Z is a trifunctional aromatic group two of the three functional groups of which are bonded to adjacent carbon atoms; X is formula VI or the like; a is 0 or 1-4; b is 0, 1 or 2; and x is 1-500.

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