公开(公告)号：JPS62100527A

公开(公告)日：1987-05-11

申请号：JP23961885

申请日：1985-10-28

Applicant: TORAY INDUSTRIES

Inventor： OKUMURA ATSUSHI ,  KATAOKA SHIRO

IPC: C08G63/68 ,  C08G63/06 ,  C08G63/682

Abstract: PURPOSE:A polyester that is composed of two kinds of specific structure units, thus being melt-formable, having good flame, retardancy, chemical resistance and wear resistance and moreover, showing outstanding mechanical properties and heat resistance. CONSTITUTION:A fluorine-containing copolyester is composed of 30-90mol% of formula I units and 70-10mol% of formula II units. The copolymer is preferably prepared using 4-hydroxybenzoic acid and 4-hydroxy-2,3,5,6- tetrafluorobenzoic acid by deacetoxylation. The ratio of I/II is preferably 40/60-90/10, and the polymerization degree is over 100.

公开(公告)号：JP2570708B2

公开(公告)日：1997-01-16

申请号：JP25578486

申请日：1986-10-29

Applicant: TORAY INDUSTRIES

Inventor： INOE SHUNEI ,  OKAMOTO MASARU ,  KATAOKA SHIRO

IPC: C08G63/60 ,  C08G63/682

公开(公告)号：JP2541314B2

公开(公告)日：1996-10-09

申请号：JP21215689

申请日：1989-08-17

Applicant: TORAY INDUSTRIES

Inventor： KATAOKA SHIRO ,  OONISHI KOJI ,  CHIBA KAZUMASA

IPC: C08L77/00 ,  C08K3/16 ,  C08K5/3475 ,  H01R13/46

公开(公告)号：JP2530654B2

公开(公告)日：1996-09-04

申请号：JP14586587

申请日：1987-06-11

Applicant: TORAY INDUSTRIES

Inventor： INOE SHUNEI ,  SUZUE SHIGERU ,  KATAOKA SHIRO

IPC: C08G63/60 ,  C09K19/38

公开(公告)号：JP2515744B2

公开(公告)日：1996-07-10

申请号：JP13612786

申请日：1986-06-13

Applicant: TORAY INDUSTRIES

Inventor： INOE SHUNEI ,  OKAMOTO MASARU ,  KATAOKA SHIRO

IPC: C08G63/60 ,  C08G63/66 ,  C08G63/672 ,  C08G63/68 ,  C08G63/682 ,  C08G63/688 ,  C09K19/38 ,  F16L23/028

公开(公告)号：JPH05214246A

公开(公告)日：1993-08-24

申请号：JP1896092

申请日：1992-02-04

Applicant: TORAY INDUSTRIES

Inventor： KATAOKA SHIRO ,  NISHIMURA TORU ,  IWAMOTO MASAAKI

IPC: C08K5/3492 ,  C08L77/00

Abstract: PURPOSE:To provide the title composition having good flowability and mold releaseability, a shortened molding cycle time, and a markedly improved productivity and being capable of giving a molding having good appearance, excellent mechanical properties and flame retardancy. CONSTITUTION:The title composition comprises 100 pts.wt. polyamide resin, 0.001-10 pts.wt. polyamide oligomer terminated with a 6-30C hydrocarbon group and has a molecular weight of 5000 or below and 1-25 pts.wt. triazine flame retardant.

公开(公告)号：JPH04288341A

公开(公告)日：1992-10-13

申请号：JP5287791

申请日：1991-03-18

Applicant: TORAY INDUSTRIES

Inventor： ONISHI KOJI ,  KATAOKA SHIRO ,  IWAMOTO MASAAKI

IPC: B29C45/00 ,  B29C49/00 ,  B29C49/02 ,  B29D23/00 ,  B29K77/00 ,  B29K105/06 ,  C08J5/04 ,  C08L23/26 ,  C08L77/00

Abstract: PURPOSE:To obtain a polyamide blow molding, especially a three-dimensional blow molding excellent in rigidity, heat resistance and impact resistance by mixing a specified polyamide with a specified resin and a fibrous reinforcement to form an intimate mixture improved in rigidity and heat distortion temperature characteristics. CONSTITUTION:A polyamide blow molding made from a polyamide composition comprising 100 pts.wt. intimate mixture comprising 50-90 wt. % hexamethylenedipamide component, 5-40wt.% hexamethyleneterephthalamide component and 5-30wt.% hexamethylene isophthalamide component and satisfying the relationships: melting temperature(Tm) >=225 deg.C and crystallization temperature (Tc)

公开(公告)号：JPH04288340A

公开(公告)日：1992-10-13

申请号：JP5287891

申请日：1991-03-18

Applicant: TORAY INDUSTRIES

Inventor： ONISHI KOJI ,  KATAOKA SHIRO ,  IWAMOTO MASAAKI

IPC: B29C49/00 ,  B29K77/00 ,  B29K105/06 ,  B29L22/00 ,  C08J5/00 ,  C08L23/26 ,  C08L77/00

Abstract: PURPOSE:To produce a polyamide blow molding especially a three-dimensional blow molding excellent in impact resistance by mixing a specified polyamide with a specified resin, a fibrous reinforcement and a heat resistance improver to form an intimate mixture improved in rigidity, heat distortion temperature properties and residence stability in a molten state. CONSTITUTION:A polyamide blow molding made from mixture comprising 100 pts.wt. intimate mixture comprising 50-95wt.% crystalline polyamide (A) comprising 50-90wt.% hexamethyleneadipamide component, 5-40wt.% hexamethyleneterephthalamide component and 5-30wt.% hexamethyleneisophthalamide component and satisfying the relationships: melting temperature (Tm)>=225 deg.C and crystallization temperature (Tc)

公开(公告)号：JPH04149234A

公开(公告)日：1992-05-22

申请号：JP27500390

申请日：1990-10-11

Applicant: TORAY INDUSTRIES

Inventor： ONISHI KOJI ,  KATAOKA SHIRO ,  IWAMOTO MASAAKI

IPC: B29C49/00 ,  B29C49/08 ,  B29K77/00 ,  C08G69/26 ,  C08K7/00 ,  C08K7/02 ,  C08L77/00 ,  C08L77/06

Abstract: PURPOSE:To obtain a polyamide, composed of a hexamethylene adipamide component, a hexamethylene terephthalamide component and a hexamethylene isophthalamide component, having specific melting point and crystallization temperature and excellent in resistance to heat and antifreezing agents for roads, dimensional stability, etc. CONSTITUTION:The objective crystalline polyamide is composed of (A) 50-90wt.% hexamethylene adipamide component, (B) 5-40wt.% hexamethylene terephthalamide component and (C) 5-30wt.% hexamethylene isophthalamide component. The aforementioned polyamide has >=225 deg.C melting point (Tm) and ) shearing rate. The resultant composition is further blow molded to provide the objective molded product.

公开(公告)号：JPH0376754A

公开(公告)日：1991-04-02

申请号：JP21215889

申请日：1989-08-17

Applicant: TORAY INDUSTRIES

Inventor： KATAOKA SHIRO ,  ONISHI KOJI ,  CHIBA KAZUMASA

IPC: C08L77/00 ,  C08K5/47

Abstract: PURPOSE:To obtain the title composition which does not corrode coexistent metals, such as copper (alloy), in a high temperature environment and has excellent heat resistance by incorporating a copper halide, an alkali metal halide, and a specified thiazole compound each in a specified amount into a polyamide resin. CONSTITUTION:The title composition is prepared by mixing 100 pts.wt. polyamide resin (e.g. polyhexamethyleneadipamide) with 0.001-1 pt.wt. copper halide (e.g. CuI), 0.01-5 pts.wt. alkali metal halide (e.g. KI), and 0.005-5 pts.wt. thiazole compound selected from compounds of formulas I to IX [wherein R1 to R7 are each H, phenyl, benzyl, alkyl, nitro, (alkyl)amino, carboxyl (except N- substituted carboxyl), hydroxyl, alkoxy, aryl, phenoxy, halogen, anilino, tolyl or benzyloxy; A is a single bond or a group of any one of formulas X to XII].