公开(公告)号：JP2002069419A

公开(公告)日：2002-03-08

申请号：JP2000261443

申请日：2000-08-30

Applicant: UBE INDUSTRIES

Inventor： ISHIKAWA SEIJI ,  SONOYAMA KENJI ,  HAYASHI KOJI

IPC: B32B7/10 ,  B32B15/08 ,  B32B15/088 ,  C09J7/02 ,  C09J179/08 ,  C09J183/04

Abstract: PROBLEM TO BE SOLVED: To provide a heat resistant adhesive capable of laminating an ultra thin polyimide film with a metal foil such as a copper foil at a relatively low temperature of 250 deg.C or lower and also having sufficient adhesive properties, and a laminates using the same. SOLUTION: The heat resistant adhesive comprises (a) a polyimide siloxane of 100 pats.wt., (b) an epoxy resin of 5 to 100 pts.wt., (c) an epoxy modified polysiloxane of 0 to 50 pts.wt., (d) an epoxy curing agent of 0 to 100 pts.wt., (e) a silane coupling agent of 0 to 50 pts.wt. and (f) a bismaleimide-triazine resin of 0 to 100 pts.wt., and can contact-bond the polyimide film having a thickness of 20 μm or less with a metal foil at a temperature of lower than 250 deg.C.

公开(公告)号：JP2001240650A

公开(公告)日：2001-09-04

申请号：JP2000055779

申请日：2000-03-01

Applicant: UBE INDUSTRIES

Inventor： ISHIKAWA SEIJI ,  ICHIKAWA YU

IPC: C08K3/00 ,  C08G18/61 ,  C08G73/10 ,  C08G77/455 ,  C08L75/12 ,  C08L79/08 ,  C09D179/08 ,  C09D183/10 ,  H01B3/30 ,  H01B17/56 ,  H01L21/312

Abstract: PROBLEM TO BE SOLVED: To provide a composition for polyimide insulating film that has excellent storage stability (a relatively low viscosity is constantly maintained) good printability and gives the insulating film (cured film) that has the conflicting properties of solvent resistance, heat resistance and flexibility, the insulating film therefrom and a method of forming the insulating film. SOLUTION: The objective composition of polyimide insulating film characteristically comprises (a) 100 pts.wt. of an organic solvent-soluble polyimide-siloxane that is obtained from the tetra-carboxylic acid component, the diamine component including 45-90 mol.% of diamino-polysiloxane represented by the general formula, 0.5-40 mol.% of a polar group-bearing aromatic diamine and 0-50 mol.% of a plurality of benzene rings-bearing aromatic diamine, (b) 2-40 pts.wt. of a polyvalent isocyanate and (c) an organic solvent.

公开(公告)号：JP2001215702A

公开(公告)日：2001-08-10

申请号：JP2000021962

申请日：2000-01-31

Applicant: UBE INDUSTRIES

Inventor： ISHIKAWA SEIJI ,  NISHIO KAZUAKI ,  YAMAMOTO SHIGERU ,  TAGUCHI MITSUSHI

IPC: G03F7/038 ,  C08F2/44 ,  C08F2/46 ,  C08G77/455 ,  C08K5/1515 ,  C08K5/17 ,  C08L83/10 ,  H05K3/28

Abstract: PROBLEM TO BE SOLVED: To provide an imide type photosensitive resin composition which can be post-baked at a relatively low temperature and gives an insulating film having heat resistance and acid, alkali and heat resistances and to provide an insulating film and a method for forming the film. SOLUTION: The imide type photosensitive resin composition comprises (1) an imidosiloxane oligomer which is half-esterified after pre-baking at the latest, (2) a photosensitive monomer, (3) a photopolymerization initiator, (4) an auxiliary crosslinking agent, (5) a fine inorganic filler and (6) a solvent, and the proportions of the components 2-5 are 0.1-100 pts.wt. photosensitive monomer, 0.01-30 pts.wt. photopolymerization initiator, 1-75 pts.wt. auxiliary crosslinking agent and 1-50 pts.wt. fine inorganic filler, on the basis of 100 pts.wt. half-esterified imidosiloxane oligomer 1. The insulating film is formed using the composition.

公开(公告)号：JPH1095961A

公开(公告)日：1998-04-14

申请号：JP20341597

申请日：1997-07-29

Applicant: UBE INDUSTRIES

Inventor： ISHIKAWA SEIJI ,  YASUNO HIROSHI

IPC: C09J7/02 ,  C09J163/00 ,  C09J179/08 ,  H05K3/38

Abstract: PROBLEM TO BE SOLVED: To prepare the subject tape capable of having heat resistance without requiring thermo compression bonding at high temperatures by forming a bonding layer containing a mixture of a noncrystalline polyimidosiloxane with an epoxy resin on a substrate film. SOLUTION: This tape with an adhesive is prepared by coating at least one surface of a substrate film with a solution of a composition obtained by mixing (A) a noncrystalline polyimidosiloxane prepared from (i) an aromatic tetracarboxylic acid, a dianhydride of the acid or an ester of the acid, (ii) a diaminopolysiloxane and (iii) an aromatic diamine containing the one having at least one functional group reactive with epoxy groups in the benzene ring with (B) an epoxy resin in an organic solvent, treating the resultant coated layer at a temperature without substantially causing the curing of the component B and forming a tackfree adhesive layer without any surface tackiness. The components A and B are preferably mixed in amounts of 100 pts.wt. component A with 1-50 pts.wt. component B.

公开(公告)号：JPH08253677A

公开(公告)日：1996-10-01

申请号：JP5904495

申请日：1995-03-17

Applicant: UBE INDUSTRIES

Inventor： ISHIKAWA SEIJI ,  NAKATANI MASAYUKI ,  FUKUDA HIROYUKI ,  YAMAMOTO SHIGERU

IPC: C08L63/00 ,  C08G73/10 ,  C08L79/08 ,  H05K3/28

Abstract: PURPOSE: To obtain the subject composition, comprising a specific polyimide siloxane and an epoxy resin, excellent in heat and solder flux resistances, adhesion and storage stability and suitable as a printing ink, a coating varnish, etc., capable of forming a protecting film on a flexible wiring board. CONSTITUTION: This composition comprises (A) 100 pts.wt. polyimide siloxane, having a structure of formula I [R1 is a tetravalent residue after removing a carboxylic acid from an aromatic tetracarboxylic acid; R2 is a bivalent residue (Z1 ) after removing NH2 from a compound of formula II [R5 is a bivalent hydrocarbon group, etc.; R6 is a 1-3C alkyl, etc.; n1 is 3-30], a bivalent residue (Z2 ) after removing NH3 from a compound of formula III (X is a direct bond, O, etc.; γ1 is OH, etc.; n2 is 1 or 2; n3 is 0-3) and a bivalent residue (Z3) after removing NH2 from other diamines; m1 is the number of structural units] in which m1 , m2 and m3 are each the number of structural units containg Z1 , Z2 and Z3 and (B) 1-50 pts.wt. epoxy resin. The component (A) is soluble in organic solvents and has >=0.16 inherent viscosity. The respective ratios of m1 , m2 and m3 in which R2 is Z1 , Z2 and Z3 in the polymer are 45-80mol%, 0.5-40mol% and the balance based on 100mol% sum total.

公开(公告)号：JPH08146210A

公开(公告)日：1996-06-07

申请号：JP28047894

申请日：1994-11-15

Applicant: UBE INDUSTRIES

Inventor： ISHIKAWA SEIJI ,  YASUNO HIROSHI

IPC: G03F7/004 ,  G02B5/20 ,  G03F7/032 ,  G03F7/037

Abstract: PURPOSE: To improve printing property, heat resistance and adhesion property by preparing the compsn. by dispersing soluble polyimide siloxane, epoxy resin and coloring pigments. CONSTITUTION: This ink compsn. for a color filter is prepared by uniformly kneading 100 pts.wt. soluble polyimide siloxane, 1-50 pts.wt. epoxy resin, 10-300 pts.wt. coloring pigment, and soluble org. solvent. The polyimide siloxane is prepared by polymerizing and imidizing an aromatic tetracarboxylic acid component essentially comprising 2,3,3',4'-biphenyl tetracarboxylate and a diamine component comprising 45-80mol% diaminopolysiloxane expressed by formula, 0.5-40mol% diamino benzoate and the balance aromatic diamine having two or more benzene rings. In formula, R1 is a bivalent hydrocarbon group, R2 is independently C1-C3 alkyl group or phenyl group, and n is an integer 3 to 30. Thereby, a color filter comprising a flat film can be formed.

公开(公告)号：JPH08120200A

公开(公告)日：1996-05-14

申请号：JP25703594

申请日：1994-10-21

Applicant: UBE INDUSTRIES

Inventor： ISHIKAWA SEIJI ,  YASUNO HIROSHI

IPC: C09D5/24 ,  C09D163/00 ,  H01B1/22 ,  H05K1/09 ,  H05K3/32

Abstract: PURPOSE: To obtain the subject composition, comprising a specific polyimidosiloxane, an epoxy resin, a metallic powder and an organic solvent without causing the thermal decomposition in packaging and requiring high- temperature treatments, excellent in flexibility, adhesion and heat resistance and suitable for producing electrically conductive wiring boards or packaging parts. CONSTITUTION: This composition is obtained by uniformly kneading (A) 100 pts.wt. soluble polyimidosiloxane prepared by polymerizing and imidating an aromatic tetracarboxylic acid component consisting essentially of 2,3,3',4'- biphenyltetracarboxylic acids and a diamine component comprising 45-80mol% compound of the formula [R1 is a bivalent hydrocarbon group; R2 is a 1-3C alkyl or phenyl; (n) is 3-30], 0.5-40mol% diaminobenzoic acid and the balance of an aromatic diamine having >=2 benzene rings with (B) 1-50 pts. wt. epoxy resin, (C) a metallic powder such as silver or copper powder and (D) a soluble organic solvent such as methyltriglyme. The content of the component (C) is 50-90wt.% in the total solid content of the component.

公开(公告)号：JPH07126387A

公开(公告)日：1995-05-16

申请号：JP27209493

申请日：1993-10-29

Applicant: UBE INDUSTRIES

Inventor： ISHIKAWA SEIJI ,  NAKATANI MASAYUKI ,  YAMAMOTO SHIGERU ,  KITAMURA KUNIAKI

IPC: C08G75/23 ,  C08G75/00

Abstract: PURPOSE:To obtain a polyether sulfone having good heat stability. CONSTITUTION:This process for producing a polyether sulfone by polycondensing a dihalogenodiphenyl sulfone with a dihydric phenol compound in the presence of an alkali metal compound in an N,N-dimethylacetamide solvent, comprises using the N,N-dimethylacetamide as that recovered after the production of a polyether sulfone and purified to a tetramethylammonium chloride concentration of 50ppm or below.

公开(公告)号：JPH0578472A

公开(公告)日：1993-03-30

申请号：JP31125291

申请日：1991-09-18

Applicant: UBE INDUSTRIES

Inventor： ISHIKAWA SEIJI ,  NAKATANI MASAYUKI ,  JIBIKI HIROSHI ,  KIMURA OSAMU

IPC: C08G65/46

Abstract: PURPOSE:To continuously recover polyaryl ether from a polymerization reaction solution in high efficiency by mixing an organic solvent solution of a polyaryl ether with a poor solvent using a specific double-pipe continuous stirring tank. CONSTITUTION:The double-pipe continuous stirring tank to be used in the subject process is provided with a stirrer near the delivery port of the inner pipe. An organic solvent solution of a polyaryl ether is continuously supplied to one of the double pipes and the other pipe is continuously supplied with a poor solvent. The solution is mixed with the solvent and the precipitated polyaryl ether is crushed by the stirrer. The crushed polymer is separated by filtration or centrifugal separation and dried after or without washing with water to achieve the recovery of the polyaryl ether having excellent heat- resistance and mechanical strength in high efficiency.

公开(公告)号：JPH04202432A

公开(公告)日：1992-07-23

申请号：JP33009690

申请日：1990-11-30

Applicant: UBE INDUSTRIES

Inventor： ISHIKAWA SEIJI ,  NAKATANI MASAYUKI ,  JIBIKI HIROSHI ,  KADOMA KIMITOSHI

IPC: C08G65/40 ,  C08G75/00 ,  C08G75/23

Abstract: PURPOSE:To obtain a high-molecular-weight polyallyl ether having a low inorganic content and excellent heat, oxidation and chemical resistances by heating under agitation a plurality of specified starting compounds in the presence of various kinds of specified inorganic compound particles in an organic polar solvent. CONSTITUTION:A dihalogenodiphenyl compound (e.g. 4,4'-dichlorodiphenyl sulfone) and a diphenol (e.g. hydroquinone and 4,4'-dihydroxybiphenyl) are heated under agitation in the presence of particles of an alkali metal compound (e.g. K2CO3) and particles of an alkali metal halide (e.g. KCl) in an organic polar solvent (e.g. N-methyl-2-pyrrolidone).