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    1.
    发明专利
    未知

    公开(公告)号：DE60115992T2

    公开(公告)日：2006-09-14

    申请号：DE60115992

    申请日：2001-06-28

    Applicant: UBE INDUSTRIES

    Inventor： YAMAGUCHI HIROAKI ,  YAMAMOTO SHIGERU

    IPC: C08J9/02 ,  C08J9/24 ,  C08G73/10

    Abstract: A flexible polyimide foam having an apparent density of 70 kg/m or less and a glass transition temperature of 300 DEG C or higher can be prepared by mixing an aromatic tetracarboxylic acid comprising 2,3,3',4'-biphenyltetracarboxylic dianhydride a portion of which is converted into its mono- or di-lower primary alcohol ester with an aromatic polyamine containing diaminodisiloxane in an amount of 0.1 to 10 mol.%, based on the amount of total amine compounds, to give a solid of polyimide precursor; and heating the solid of polyimide precursor to a temperature of 300 DEG C to 500 DEG C.

    2.
    发明专利
    未知

    公开(公告)号：DE60115992D1

    公开(公告)日：2006-01-26

    申请号：DE60115992

    申请日：2001-06-28

    Applicant: UBE INDUSTRIES

    Inventor： YAMAGUCHI HIROAKI ,  YAMAMOTO SHIGERU

    IPC: C08J9/02 ,  C08G73/10 ,  C08J9/24

    Abstract: A flexible polyimide foam having an apparent density of 70 kg/m or less and a glass transition temperature of 300 DEG C or higher can be prepared by mixing an aromatic tetracarboxylic acid comprising 2,3,3',4'-biphenyltetracarboxylic dianhydride a portion of which is converted into its mono- or di-lower primary alcohol ester with an aromatic polyamine containing diaminodisiloxane in an amount of 0.1 to 10 mol.%, based on the amount of total amine compounds, to give a solid of polyimide precursor; and heating the solid of polyimide precursor to a temperature of 300 DEG C to 500 DEG C.

    ESPUMA DE POLIIMIDA AROMATICA.
    3.
    发明专利
    ESPUMA DE POLIIMIDA AROMATICA. 未知

    公开(公告)号：ES2250265T3

    公开(公告)日：2006-04-16

    申请号：ES01114847

    申请日：2001-06-28

    Applicant: UBE INDUSTRIES

    Inventor： YAMAGUCHI HIROAKI ,  YAMAMOTO SHIGERU

    IPC: C08J9/02 ,  C08G73/10 ,  C08J9/24

    Abstract: ¿ Una espuma flexible de poliimida que comprende unidades de ácido 2, 3, 3'', 4''¿bifeniltetracarboxílico, unidades de diamina aromática, y unidades de diaminosiloxano, y que tiene una densidad aparente de 70 kg/m3 o menos y una temperatura de transición vítrea de 300ºC o más alta.

    PLASMA ETCHING RESIST AND ETCHING METHOD
    6.
    发明专利
    PLASMA ETCHING RESIST AND ETCHING METHOD 失效

    公开(公告)号：JP2001125273A

    公开(公告)日：2001-05-11

    申请号：JP30843499

    申请日：1999-10-29

    Applicant: UBE INDUSTRIES

    Inventor： ISHIKAWA SEIJI ,  NISHIO KAZUAKI ,  YAMAMOTO SHIGERU ,  TAGUCHI MITSUSHI

    IPC: G03F7/075 ,  C08G73/10 ,  G03F7/037 ,  G03F7/36

    Abstract: PROBLEM TO BE SOLVED: To provide an etching resist capable of plasma etching and to provide an etching method using the resist. SOLUTION: The plasma etching resist contains (1) an end-half-esterified siloxane oligomer, (2) a photosensitive monomer, (3) a photopolymerization initiator, (4) a fine inorganic filler and (5) a solvent. The proportions of the components 2-5 are 0.1-300 pts.wt., 0.01-30 pts.wt., 1-100 pts.wt. and 0-200 pts.wt., respectively, based on 100 pts.wt. of the component 1.

    PRODUCTION OF POLYARYL ETHER
    8.
    发明专利
    PRODUCTION OF POLYARYL ETHER 失效

    公开(公告)号：JPH06100689A

    公开(公告)日：1994-04-12

    申请号：JP25296292

    申请日：1992-09-22

    Applicant: UBE INDUSTRIES

    Inventor： ISHIKAWA SEIJI ,  NAKATANI MASAYUKI ,  JIBIKI HIROSHI ,  YAMAMOTO SHIGERU

    IPC: C08G65/40

    Abstract: PURPOSE:To obtain a polyaryl ether excellent in heat resistance and mechanical strengths and low in coloration. CONSTITUTION:A dispersion of an alkali metal compd. in an org. solvent is mixed with an org. polar solvent in the process for producing a polyaryl ether wherein a soln. of a dihalogenodiphenyl compd. and a dihydric phenol compd. in the polar solvent is thermamlly stirred in the presence of the alkali metal compd.

    METHOD FOR SEPARATING AND RECOVERING POLYARYL ETHER
    9.
    发明专利
    METHOD FOR SEPARATING AND RECOVERING POLYARYL ETHER 失效

    公开(公告)号：JPH0593060A

    公开(公告)日：1993-04-16

    申请号：JP32084391

    申请日：1991-10-01

    Applicant: UBE INDUSTRIES

    Inventor： ISHIKAWA SEIJI ,  NAKATANI MASAYUKI ,  YAMAMOTO SHIGERU ,  FUKUDA HIROYUKI

    IPC: C08G65/46

    Abstract: PURPOSE:To obtain a polyaryl ether, improved in coloring degree and excellent in heat resistance, etc., by adding a phosphorus compound to a polymerizing reactional solution containing a specific polyaryl ether, then mixing the resultant solution with a poor solvent for the polyaryl ether and stirring the mixture solution. CONSTITUTION:A phosphorus compound such as triphenyl phosphate is added to a polymerizing reactional solution, prepared by polycondensing a dihalogenodiphenyl compound such as 4,4'-dichlorodiphenyl sulfone with a dihydric phenolic compound such as hydroquinone in the presence of an alkali metallic compound in an organic polar solvent such as dimethyl sulfoxide and containing a polyaryl ether and a poor solvent such as methanol or acetonitrile for the polyaryl ether is then mixed with the resultant solution. The obtained mixture solution is subsequently stirred to recover the polyaryl ether excellent in mechanical strength from the polymerizing reactional solution.

    PRESSURE-SENSITIVE ADHESIVE TAPE
    10.
    发明专利
    PRESSURE-SENSITIVE ADHESIVE TAPE 失效

    公开(公告)号：JP2002294185A

    公开(公告)日：2002-10-09

    申请号：JP2001096252

    申请日：2001-03-29

    Applicant: UBE INDUSTRIES

    Inventor： TAKAHASHI TAKUJI ,  YAMAMOTO SHIGERU

    IPC: C08J5/18 ,  C09J7/02 ,  C09J183/04

    Abstract: PROBLEM TO BE SOLVED: To prepare a thin pressure-sensitive adhesive tape which has a good workability, is easily separable from a release film, and is excellent in tackiness and initial tackiness to various substrates (e.g. a ceramic substrate), to a conductive metal, and to the back side of a heat-resistant substrate film of the adhesive tape itself. SOLUTION: This pressure-sensitive adhesive tape is prepared by forming a pressure-sensitive adhesive silicone layer having a dynamic viscoelasticity E' (at 200 deg.C) of 1×10 -1×10 dyn/cm and a dynamic hardness (at normal temperature) of 2 or lower on one side of a polyimide film having a tensile modulus of 500 Kg/mm or higher, a thickness accuracy within ±1 μm, and a thickness of 7.5-20 μm. The adhesive tape has a volume resistance of 1×10 Ω.cm or higher and a surface resistance of 1×10 Ω or higher.

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