Abstract:
PROBLEM TO BE SOLVED: To provide an asymmetric optical waveguide nitride laser diode structure which does not require a p-type waveguide layer nor tunnel barrier layer containing aluminum in a large amount. SOLUTION: An asymmetric optical waveguide nitride laser diode structure 400 has an active layer 120 having first and second surfaces, a transition layer 429 which is brought into contact with the first surface of the active layer 120, a p-type clad layer 130 adhered adjacently to the transition layer 429, and an n-type layer 116 which is brought into contact with the second surface of the active layer 120.
Abstract:
PROBLEM TO BE SOLVED: To provide a laser diode having a stronger mode stability and a low threshold current operation.SOLUTION: The index guide type buried heterostructure nitride laser diode structure 100 has a ridge structure 111 having first, second and third faces, clad structures 121, clad layers 125, and a multiple quantum well structure 145 interposed between the clad structures 121 and the clad layers 125, and a buried layer 155 existing on the first, second and third faces of the ridge structure 111 and having an opening for electrical contact to the third face of the ridge structure 111.
Abstract:
PROBLEM TO BE SOLVED: To provide a distributed Bragg reflector (DBR) on both sides of a nitride-based resonator semiconductor structure. SOLUTION: The nitride-based resonator semiconductor structure 140 with a first distributed Bragg reflector 122 is provided on a sapphire substrate. A second substrate 128 is bonded to the first distributed Bragg reflector 122. The sapphire substrate is removed by laser-assisted epitaxial lift-off. A second Bragg reflector 142 is provided on the semiconductor structure opposite the first distributed Bragg reflector 122 having a VCSEL structure. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide an inexpensive and easy microsystem manufacturing method wherein a micro fluidic channel aligned with another electronic or photoelectronic elements is integrated on one platform. SOLUTION: The present invention provides an integration method for microelectronic devices and the micro channel. The method is an inexpensive method for integrating a device group not adaptable each other in usual manufacture, the microchannel, microelectronic structure, for example, an electro-optic light source, and a detector or an MEMS device into one integrated structure. COPYRIGHT: (C)2004,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To manufacture a gallium nitride substrate used for a nitride-based semiconductor structure. SOLUTION: First, a gallium nitride layer is grown on a sapphire substrate. On the gallium nitride layer, a mask layer such as photoresist, a metal layer, or a dielectric layer is pattern-formed in a stripe. Then, the gallium nitride layer is etched up to the sapphire substrate for forming a trench, and the section region of gallium nitride is provided on the sapphire substrate. Alternatively, on the sapphire substrate, a selection region is grown again on the gallium nitride layer that is pattern-formed in advance, thus obtaining the trench. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a graded semiconductor layer for reducing the threshold voltage of a nitride-based laser diode structure. SOLUTION: The graded semiconductor layer between a GaN layer 120 and an AlGaN layer 118 of the nitride-based semiconductor laser structure 100 reduces the threshold voltage of the laser structure by reducing the electric potential barrier at an interface between the GaN layer 120 and the AlGaN layer 118. The graded semiconductor layer can be a plurality of AlGaN layers with increasing aluminum content to form step graded layers. A continuous graded semiconductor layer will linearly increase the aluminum content in a single layer. A digital graded semiconductor layer will have a super lattice of alternating GaN quantum wells and AlGaN barrier layers, with the GaN quantum wells decreasing in thickness as the AlGaN barriers increase in thickness. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a monolithic multiple laser structure which includes the capability of emitting a multiple wavelength laser beam, having a wide range of infrared to red and blue for wavelength spectrum and close intervals. SOLUTION: A red/infrared parallel type laser structure 100 is bonded to a blue laser structure 200 with solder bumps 402 and 404 by a flip-chip method, to form a red/blue/infrared integrated laser structure 400 integrated by a hybrid method. This method allows a laser array structure having laser elements of different wavelengths to be manufactured, even in semiconductor materials which are not compatible with a manufacturing method by etching and regrowth.