公开(公告)号：US5579981A

公开(公告)日：1996-12-03

申请号：US371776

申请日：1995-01-12

Applicant: Nobuya Matsumura ,  Kazumi Ishimoto ,  Yoichi Nakamura ,  Kurayasu Hamasaki ,  Kimihito Kuwabara ,  Masahiro Taniguchi

Inventor： Nobuya Matsumura ,  Kazumi Ishimoto ,  Yoichi Nakamura ,  Kurayasu Hamasaki ,  Kimihito Kuwabara ,  Masahiro Taniguchi

IPC: H05K3/34 ,  B23K1/008 ,  B23K1/012

CPC classification number: B23K1/008 ,  B23K2201/42

Abstract: A reflow apparatus includes a reflow furnace. A transfer device holds and transfers printed circuit boards with to-be-reflowed electronic components thereon from an inlet to an outlet of the furnace within the furnace. A plurality of adjusting/circulating sections separate an ambient gas for heating the printed circuit boards into predetermined temperature regions in the furnace in which the ambient gas is circulated in a heated state. A feed port is formed in the furnace to feed the ambient gas into the furnace under pressure. Residence parts each provided between adjacent adjusting/circulating sections regulate the amount of the ambient gas when the ambient gas, after having been sent to and heated in the adjusting/circulating section adjacent to the feed port, is circulated and sequentially moved to the adjusting/circulating sections at the inlet or the outlet and finally flows out through the inlet or outlet into atmosphere. Suction ports are open to the furnace to suck the ambient gas from the inside of the furnace. A flux removing unit is separate from the furnace and removes components of a flux from the ambient gas sucked through the suction ports from the inside of the furnace.

Abstract translation: 回流装置包括回流炉。 转移装置在炉内从炉内的入口到出口保持并转移其上具有待回流电子部件的印刷电路板。 多个调节/循环部分将用于将印刷电路板加热的环境气体分离成炉中的环境气体在加热状态下循环的预定温度区域。 在炉中形成进料口，以在压力下将环境气体进料到炉中。 每个设置在相邻的调节/循环部分之间的居间部分调节环境气体的量，当环境气体在已经被送​​入并在与进料口邻近的调节/循环部分中被加热并循环并顺序地移动到调节/ 在入口或出口处循环切片，最后通过入口或出口流入大气。 吸入口向炉内开放以从炉内吸入环境气体。 助熔剂去除单元与炉分离，并从炉内部从吸入口吸入的环境气体中除去助熔剂的组分。

公开(公告)号：US5540376A

公开(公告)日：1996-07-30

申请号：US324087

申请日：1994-10-14

Applicant: Jess Asla ,  Roy Lange ,  Ron Despain

Inventor： Jess Asla ,  Roy Lange ,  Ron Despain

IPC: B23K3/06 ,  B23K3/08 ,  H05K3/34

CPC classification number: B23K3/08 ,  B23K3/0676 ,  H05K3/3468 ,  B23K2201/42 ,  H05K2201/09418

Abstract: A pallet for holding a printed circuit board comprises first and second parallel rails and third and fourth parallel rails. The third and fourth rails each have first and second ends and form an angle of between about 30.degree. and 60.degree. with the first and second rails. The first and second ends of the third and fourth rails are connected to one of the first and second rails. The pallet further comprises an attachment for securing the printed circuit board to the third and fourth rails. The angled pallet has advantages over conventional pallets as shorts and shadowing are reduced.

Abstract translation: 用于保持印刷电路板的托盘包括第一和第二平行导轨以及第三和第四平行导轨。 第三和第四导轨各自具有第一和第二端，并且与第一和第二导轨形成在约30度和60度之间的角度。 第三和第四导轨的第一和第二端连接到第一和第二导轨之一。 托盘还包括用于将印刷电路板固定到第三和第四轨道的附件。 倾斜的托盘具有优于传统托盘的优点，因为短裤和阴影减少。

公开(公告)号：US5533663A

公开(公告)日：1996-07-09

申请号：US342561

申请日：1994-11-21

Applicant: Anthony L. Massini, Jr. ,  Roy D. Shepard

Inventor： Anthony L. Massini, Jr. ,  Roy D. Shepard

IPC: B23K3/06 ,  H05K1/02 ,  H05K3/34

CPC classification number: H05K3/3468 ,  B23K3/0653 ,  B23K2201/42 ,  H05K1/0268 ,  H05K2203/163

Abstract: In a wave solder manufacturing process, a test device is used to measure the contact-area between a solder wave and a printed wiring board. In particular, the test device is a printed wiring board (PWB) that includes at least two arrays of electrical contacts, one array near each side of the PWB. As the PWB makes contact with a solder wave, the number of electrical contacts in each array that are grounded by the solder wave are counted and displayed on an alpha-numeric display mounted on top of the PWB. This "distance-based" measurement provides an accurate determination of the uniformity of the contact-area, and concomitantly the dwell-time of the soldering process.

Abstract translation: 在波峰焊制造工艺中，使用测试装置来测量焊波和印刷线路板之间的接触面积。 特别地，测试装置是印刷电路板（PWB），其包括至少两个电触头阵列，一个阵列靠近PWB的每一侧。 随着电路板与焊波的接触，每个阵列中通过焊波接地的电触点的数量被计数并显示在安装在PWB顶部的字母数字显示器上。 这种“基于距离”的测量提供了接触区域的均匀性的准确确定，并且伴随着焊接过程的停留时间。

公开(公告)号：US5526978A

公开(公告)日：1996-06-18

申请号：US223583

申请日：1994-04-06

Applicant: Toshiyuki Nagatsuka ,  Yumiko Iijima ,  Hiroyuki Ohira

Inventor： Toshiyuki Nagatsuka ,  Yumiko Iijima ,  Hiroyuki Ohira

IPC: B23K1/008 ,  B23K31/02

CPC classification number: B23K1/008 ,  B23K2201/42

Abstract: A method for soldering an electronic component capable of accomplishing satisfactory soldering of an electronic component using paste solder even in an oven constructed into a non-closed structure which causes flowing of an ambient atmosphere. Dehumidified air is introduced through a dehumidified air inlet section into the oven to keep a dehumidified atmosphere in the oven, to thereby prevented activity of flux contained in the paste flux from being deteriorated.

Abstract translation: 一种焊接电子部件的方法，即使在构成非闭合结构的烘箱中也能够使用糊料焊料实现令人满意的焊接，从而引起环境气氛的流动。 将除湿空气通过除湿空气入口部分引入烘箱中以在烘箱中保持除湿气氛，从而防止浆料焊剂中包含的焊剂的活性劣化。

公开(公告)号：US5524810A

公开(公告)日：1996-06-11

申请号：US227541

申请日：1994-04-14

Applicant: Kail S. Wathne

Inventor： Kail S. Wathne

IPC: B23K1/008 ,  B23K1/012

CPC classification number: B23K1/008 ,  B23K2201/42

Abstract: A tunnel-type processor for solder flow application of solder connections to circuit elements on a circuit board. The boards with deposited solder are passed through a heating zone and a cooling zone, on a platen. Heated or cooled gas is injected into the zones to maintain a suitable temperature along with the platen. A housing with an exhaust conduit encloses the platen and limits flow of gas from one zone into another. An optional top manifold can be provided to discharge gas into a respective zone.

Abstract translation: 一种隧道式处理器，用于焊接流动，将焊接连接应用于电路板上的电路元件。 具有沉积焊料的板在压板上通过加热区和冷却区。 将加热或冷却的气体注入到区域中以与压板一起保持适当的温度。 具有排气导管的壳体封闭压板并限制气体从一个区域到另一个区域的流动。 可以提供可选的顶部歧管以将气体排放到相应的区域中。

公开(公告)号：US5520967A

公开(公告)日：1996-05-28

申请号：US24991

申请日：1993-03-02

Applicant: Peter M. Banks ,  William M. Morgan

Inventor： Peter M. Banks ,  William M. Morgan

IPC: B23K1/06 ,  B23K1/08 ,  B23K3/06 ,  B23K101/42 ,  H05K1/00 ,  H05K3/28 ,  H05K3/34 ,  B06B1/20

CPC classification number: B23K3/0669 ,  B23K1/08 ,  H05K3/3468 ,  B23K2201/42 ,  H05K1/0393 ,  H05K2201/10689 ,  H05K2203/0285 ,  H05K2203/044 ,  H05K2203/0776 ,  H05K2203/1518 ,  H05K2203/1554 ,  H05K3/281 ,  H05K3/3494

Abstract: Solder is applied to a circuit board 7 by dipping the board into a bath 1 of molten solder 3, the molten solder having a layer of oil 5 on top. The board is dipped into the bath by rotating it along a path that is substantially coplanar with the circuit board. This is achieved by supporting the board on a carrier 9 which in turn is attached to a motor shaft 11.

Abstract translation: 通过将板浸入熔融焊料3的槽1中将焊料施加到电路板7，熔融焊料在顶部具有一层油5。 通过沿着与电路板基本上共面的路径旋转，将板浸入浴中。 这通过将板支撑在载体9上而实现，该载体9又附接到电动机轴11。

公开(公告)号：US5506385A

公开(公告)日：1996-04-09

申请号：US314372

申请日：1994-09-28

Applicant: Hajime Murakami ,  Takashi Fukuda

Inventor： Hajime Murakami ,  Takashi Fukuda

IPC: H05K3/34 ,  B23K1/005 ,  B23K26/00 ,  B23K3/06 ,  B23K35/14

CPC classification number: B23K1/0056 ,  B23K2201/42 ,  H05K3/3478 ,  H05K3/3494

Abstract: A solder-film forming apparatus for automatically forming a solder-film on a conductive pad of a printed-wiring board. The solder-film forming apparatus includes a mechanism for receiving a solder ball, a suction head provided on a distal end thereof with a holding surface for holding the solder ball and a suction port opening to the holding surface, a suction mechanism for generating a negative pressure in the suction port of the suction head, and a mechanism for moving the suction head. The solder-film forming apparatus further includes a controller having printed-wiring board information in which data including a positional information of the pad on the printed-wiring board is preset and controlling a movement of the suction head by the head moving mechanism and an operation of the suction mechanism in accordance with the printed-wiring board information. A laser beam is irradiated from a laser unit to the solder ball placed on the conductive pad of the printed-wiring board and as a result, the solder ball is fused to form a solder-film. The positional relation between the laser unit and the pad is detected by a camera and corrected.

Abstract translation: 一种用于在印刷电路板的导电焊盘上自动形成焊锡膜的焊锡膜形成装置。 焊锡膜形成装置包括用于接收焊球的机构，其前端设置有用于保持焊球的保持面和向保持面开口的吸入口的吸引头，用于产生负极的吸引机构 吸头的吸入口的压力，以及用于使吸头移动的机构。 焊锡膜形成装置还包括控制器，其具有印刷布线板信息，其中包括印刷布线板上的焊盘的位置信息的数据被预设并且通过头部移动机构控制吸头的运动和操作 根据印刷电路板信息的吸引机构。 从激光单元将激光束照射到放置在印刷电路板的导电焊盘上的焊料球，结果焊料熔合而形成焊料膜。 通过照相机检测激光单元与衬垫之间的位置关系并进行校正。

公开(公告)号：US5425859A

公开(公告)日：1995-06-20

申请号：US60328

申请日：1993-05-11

Applicant: D. Morgan Tench ,  Dennis P. Anderson

Inventor： D. Morgan Tench ,  Dennis P. Anderson

IPC: B23K1/20 ,  G01N27/416 ,  G01N27/42 ,  G01N27/48 ,  H05K3/07 ,  H05K3/22 ,  H05K3/34 ,  G01N27/26

CPC classification number: B23K1/206 ,  B23K1/20 ,  G01N27/4161 ,  G01N27/42 ,  H05K3/22 ,  B23K2201/40 ,  B23K2201/42 ,  H05K2203/0315 ,  H05K2203/1157 ,  H05K3/07 ,  H05K3/3489

Abstract: A sequential electrochemical reduction method and apparatus are provided for assessing and restoring solderability of electronic component leads. The method detects and quantifies the presence of metallic oxides that are detrimental to solderability by sequential electrochemical reduction in contact with an electrolyte in an inert atmosphere. A cathode having a high hydrogen overvoltage is placed in contact with the electrolyte. A solderable portion of the component to be tested is placed in contact with the cathode and the electrolyte. An inert counter electrode and a reference electrode are also placed in contact with the electrolyte. A current is passed between the cathode and inert electrode, and the voltage and current are measured as a function of time during reduction of metallic oxides on the solderable portions of the component. The measurements of voltage, current, time, and charge density may be compared with baseline data from specimens having known oxide compositions that correlate with degradation of solderability.

Abstract translation: 提供了用于评估和恢复电子元件引线的可焊性的顺序电化学还原方法和装置。 该方法通过在惰性气氛中与电解质接触的顺序电化学还原来检测和量化对可焊性不利的金属氧化物的存在。 具有高氢过电压的阴极与电解质接触。 要测试的组件的可焊接部分与阴极和电解质接触。 惰性对电极和参比电极也与电解质接触。 在阴极和惰性电极之间通过电流，并且在部件的可焊接部分上的金属氧化物还原期间，测量电压和电流作为时间的函数。 可以将电压，电流，时间和电荷密度的测量值与具有与可焊性劣化相关的已知氧化物组成的样品的基线数据进行比较。

公开(公告)号：US5358167A

公开(公告)日：1994-10-25

申请号：US158884

申请日：1993-11-29

Applicant: Yoshiaki Tachibana ,  Kimihiko Nakamura ,  Masahito Nozue ,  Toshikazu Yasuoka ,  Masaru Kanazawa

Inventor： Yoshiaki Tachibana ,  Kimihiko Nakamura ,  Masahito Nozue ,  Toshikazu Yasuoka ,  Masaru Kanazawa

IPC: B23K1/008 ,  B23K1/00

CPC classification number: B23K1/008 ,  B23K2201/42

Abstract: A soldering apparatus is disclosed which includes a longitudinally extending, air-tight housing having four contiguous, first through fourth zones and and inlet and outlet openings at both longitudinal ends thereof, a conveyer for conveying an article to be soldered along a predetermined path extending through the inlet opening, the first to fourth zones and the outlet opening, a soldering device provided in the second zone for applying a molten solder to the article traveling through the second zone, a plurality of upper and lower partition plates disposed in each of the first, third and fourth zones to partition each zone into a plurality of open ended chambers, an inert gas diffuser provided within at least one of the chambers of the third zone, and an air diffuser provided within at least one of the chambers of the fourth zone, so that the diffusion of air from the fourth zone to the third zone is substantially prevented while the diffusion of the inert gas from the third zone to the outlet opening through the fourth zone is reduced.

Abstract translation: 公开了一种焊接装置，其包括纵向延伸的气密壳体，其具有四个相邻的第一至第四区域，以及在其两个纵向端部处的入口和出口开口，用于沿着预定路径输送待焊接的物品的输送机， 入口开口，第一至第四区域和出口开口，设置在第二区域中的用于将熔融焊料施加到穿过第二区域的制品的焊接装置，设置在第一区域中的每一个中的多个上隔板和下隔板 ，第三和第四区域，以将每个区域分隔成多个开放式腔室，设置在第三区域的至少一个腔室内的惰性气体扩散器，以及设置在第四区域的至少一个腔室内的空气扩散器 从而基本上防止了空气从第四区到第三区的扩散，同时将惰性气体从第三区扩散到t 他通过第四区的出口减少了。

公开(公告)号：US5318212A

公开(公告)日：1994-06-07

申请号：US42947

申请日：1993-04-05

Applicant: Darryl J. Becker ,  Brian B. Hanson ,  Donald E. Hora ,  James L. Peacock

Inventor： Darryl J. Becker ,  Brian B. Hanson ,  Donald E. Hora ,  James L. Peacock

IPC: B23K3/08 ,  H01R43/02 ,  B23K37/04

CPC classification number: H01R43/0256 ,  B23K3/087 ,  B23K2201/42 ,  H01R12/7005 ,  Y10T29/49124 ,  Y10T29/49128

Abstract: Assembling a circuit card to a straddle mount connector with improved alignment. A holder using a parallel linkage holds the card parallel to the connector despite thickness variations, during solder bonding.

Abstract translation: 将电路卡组装到具有改进对准的跨骑式安装连接器。 在焊接期间，使用平行连杆的支架将卡平行于连接器固定，尽管厚度变化。