Abstract:
A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure
Abstract:
The invention relates to an electromechanical device characterised in that it comprises a stack made up of an insulating layer (31) inserted between two solid layers (10, 30), and a micromechanical structure (60, 61) with predetermined thickness suspended above a recess (4) with predetermined depth, the recess (4) and the micromechanical structure (60, 61) making up one of the two solid layers (10, 30) of the stack, and the insulating layer (31) making up the bottom of said recess (4).
Abstract:
A transfer method, manufacturing method, device and electronic apparatus of MEMS. The method for MEMS transfer, comprising: depositing a laser-absorbing layer on a first surface of a laser-transparent carrier; forming a MEMS structure on the laser-absorbing layer; attaching the MEMS structure to a receiver; and performing a laser lift-off from the side of the carrier, to remove the carrier. A transfer of high-quality MEMS structure can be achieved in a simple, low cost manner.
Abstract:
PROBLEM TO BE SOLVED: To quickly remove a handling member from a substrate to be processed by reducing probability that a membrane is damaged when handling or machining the substrate to be processed. SOLUTION: In the handling member, a groove, which composes one portion of a channel communicating with the outside while an element is being fixed, is formed on a surface fixed to the element. The handling member is fixed so that a cleavage direction of a vibrating membrane crosses the edge direction of the groove of the handling member. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
The disclosed technology relates generally to methods and systems for controlling the release of micro devices. Prior to transferring micro devices to a destination substrate, a native substrate is formed with micro devices thereon. The micro devices can be distributed over the native substrate and spatially separated from each other by an anchor structure. The anchors are physically connected/secured to the native substrate. Tethers physically secure each micro device to one or more anchors, thereby suspending the micro device above the native substrate. In certain embodiments, single tether designs are used to control the relaxation of built-in stress in releasable structures on a substrate, such as Si (1 0 0). Single tether designs offer, among other things, the added benefit of easier break upon retrieval from native substrate in micro assembly processes. In certain embodiments, narrow tether designs are used to avoid pinning of the undercut etch front.
Abstract:
A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure