公开(公告)号：EP3118894A1

公开(公告)日：2017-01-18

申请号：EP16188068.7

申请日：2013-05-16

Applicant: Apple Inc.

Inventor： GOLDA, Dariusz ,  BIBL, Andreas

IPC: H01L21/677 ,  B81C1/00 ,  B65G49/07

CPC classification number: B81C99/0025 ,  B81C2201/0194 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/7598

Abstract: A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure

Abstract translation: 描述了从SOI衬底形成微器件传输阵列的微器件转移头阵列和方法。 在一个实施例中，微器件传送头阵列包括基底衬底和在基底衬底上的图案化硅层。 图案化硅层可以包括硅互连和与硅互连电连接的硅电极阵列。 每个硅电极包括突出在硅互连上方的台面结构。 介电层覆盖每个台面结构的顶面

公开(公告)号：EP3118894B1

公开(公告)日：2018-01-31

申请号：EP16188068.7

申请日：2013-05-16

Applicant: Apple Inc.

Inventor： GOLDA, Dariusz ,  BIBL, Andreas

IPC: H01L21/677 ,  B81C1/00 ,  B65G49/07

CPC classification number: B81C99/0025 ,  B81C2201/0194 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/7598

Abstract: A micro device transfer head array and method of forming a micro device transfer array from an SOI substrate are described. In an embodiment, the micro device transfer head array includes a base substrate and a patterned silicon layer over the base substrate. The patterned silicon layer may include a silicon interconnect and an array of silicon electrodes electrically connected with the silicon interconnect. Each silicon electrode includes a mesa structure protruding above the silicon interconnect. A dielectric layer covers a top surface of each mesa structure

公开(公告)号：EP2834840B1

公开(公告)日：2016-12-28

申请号：EP13794179.5

申请日：2013-05-16

Applicant: Apple Inc.

Inventor： GOLDA, Dariusz ,  BIBL, Andreas

IPC: H01L21/677 ,  B81C1/00 ,  B65G49/07

CPC classification number: B81C99/0025 ,  B81C2201/0194 ,  H01L21/67144 ,  H01L24/75 ,  H01L2224/7598