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公开(公告)号：CN103864006A
公开(公告)日：2014-06-18
申请号：CN201310692997.7
申请日：2013-12-17
Applicant: 飞思卡尔半导体公司
IPC: B81C1/00
CPC classification number: B81B3/0005 , B81B2201/0221 , B81B2201/0235 , B81B2203/0181 , B81B2203/06 , B81C1/0038 , B81C1/00952 , B81C2201/0169 , B81C2201/112 , G01P15/0802 , G01P2015/0871 , G01P2015/0874
Abstract: 提供了一种用于通过减少源自基于TEOS的硅氧化膜的碳的数量来减小MEMS器件中的静摩擦的机制，其中所述膜在制作期间可以在多晶硅表面上累积。碳阻挡材料膜(510,520)可以在MEMS器件中的一个或多个多晶硅层(210,230)和基于TEOS的氧化硅层(220)之间沉积。所述阻挡材料防止碳扩散到所述多晶硅，从而减少在多晶硅表面上碳的累积。通过减少碳的累积，由于碳的存在造成的静摩擦机率同样被减小。
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公开(公告)号：CN101690871B
公开(公告)日：2013-10-23
申请号：CN200910132506.7
申请日：2009-03-31
Applicant: 索尼德国有限责任公司 , 牛津纳米孔技术有限公司
IPC: B01D69/00 , B01D67/00 , B01L3/00 , G01N33/543
CPC classification number: B01D69/10 , B01D69/105 , B01D69/144 , B81B2201/058 , B81B2203/0127 , B81C1/00087 , B81C2201/112 , Y10T428/24322 , Y10T428/24331 , Y10T428/24967 , Y10T428/24975 , Y10T428/249961
Abstract: 本发明提供了制造具有锥形孔的膜的方法，其能够在低孔直径时形成高纵横比。本发明还提供了薄而稳定的而且能够容易地以降低的破裂风险操作的膜。进而，本发明提供了与硅系膜相比更低廉的制造方法。
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公开(公告)号：CN101117207B
公开(公告)日：2012-02-22
申请号：CN200710138850.8
申请日：2007-06-28
Applicant: 视频有限公司
Inventor： 潘晓和
CPC classification number: G02B26/0841 , B81B3/0005 , B81C1/0096 , B81C2201/112
Abstract: 用于应用抗粘连材料到在基板上的微型装置的方法，包括在封装装置的表面或基板的表面引入抗粘连材料并且密封至少部分封装装置到基板的表面以形成用于封装微型装置和抗粘连材料的室。该微型装置包括第一元件和第二元件。该方法还包括汽化抗粘连材料以及汽化抗粘连材料后，在第一元件的表面或第二元件的表面沉积抗粘连材料以阻止第一元件和第二元件间的粘连。
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公开(公告)号：CN101221911B
公开(公告)日：2011-07-20
申请号：CN200710305763.7
申请日：2007-11-20
Applicant: 视频有限公司
CPC classification number: B81B3/0005 , B81C1/00992 , B81C2201/0181 , B81C2201/112
Abstract: 一种用施加防粘连材料到微器件的方法，包括：将微器件包封在腔室中；在容器中汽化防粘连材料以形成蒸汽化的防粘连材料；从该容器中传送蒸汽化的防粘连材料到该腔室中；以及在该微器件的表面上沉积蒸汽化的防粘连材料。
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公开(公告)号：CN1826285B
公开(公告)日：2010-10-20
申请号：CN200480020756.7
申请日：2004-07-15
Applicant: 原子能委员会
IPC: B81B3/00 , H01L21/20 , H01L21/762
CPC classification number: B81B3/001 , B81C2201/112 , H01L21/76251 , H01L21/76256
Abstract: 本发明涉及堆叠结构的制造方法。这种方法包括以下步骤：a)选择第一片材(1)(例如由硅制成)和第二片材(5)(例如同样由硅制成)，使得所述第一(1)和第二(5)片材中的至少一个片材至少部分具有对粘连到另一片材上来说不相容的表面(2；7)；b)在第一片材的表面(2)和/或第二片材(5)的表面(7)的至少一部分上产生牺牲层(3；8)(例如由氧化硅制成)，以及c)将两个片材(1；5)粘结在一起。所述粘连不相容性例如可由该表面的物理化学性质或者涂布到该表面的涂层产生，或者由大于预定阈值的粗糙度(r’2、r’7)产生。本发明还涉及通过本发明方法制造的堆叠结构。
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Patent Agency Ranking
公开(公告)号：CN101690871A
公开(公告)日：2010-04-07
申请号：CN200910132506.7
申请日：2009-03-31
Applicant: 索尼德国有限责任公司 , 牛津纳米孔技术有限公司
IPC: B01D69/00 , B01D67/00 , B01L3/00 , G01N33/543
CPC classification number: B01D69/10 , B01D69/105 , B01D69/144 , B81B2201/058 , B81B2203/0127 , B81C1/00087 , B81C2201/112 , Y10T428/24322 , Y10T428/24331 , Y10T428/24967 , Y10T428/24975 , Y10T428/249961
Abstract: 本发明提供了制造具有锥形孔的膜的方法，其能够在低孔直径时形成高纵横比。本发明还提供了薄而稳定的而且能够容易地以降低的破裂风险操作的膜。进而，本发明提供了与硅系膜相比更低廉的制造方法。
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公开(公告)号：EP2440684B1
公开(公告)日：2018-10-31
申请号：EP10724759.5
申请日：2010-06-03
Inventor： STEINMÜLLER, Detlef , STEINMÜLLER, Doris , DREXEL, Herwig , GHODBANE, Slimane , RICHARD, David , CUSIN, Pierre
CPC classification number: C23C16/277 , B81B3/0008 , B81B2201/035 , B81C2201/112 , C23C16/27 , C23C16/56 , G04D3/0074 , Y10T428/30
Abstract: Method for coating micromechanical components of a micromechanical system, in particular a watch movement, comprising: providing a substrate component to be coated; providing said component with a diamond coating; wherein said diamond coating conductivity is increased in order to reduce dust attraction by the coated component when used in said micromechanical system. Corresponding micromechanical components and systems are also provided.
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公开(公告)号：EP2751301A1
公开(公告)日：2014-07-09
申请号：EP12770186.0
申请日：2012-08-31
Applicant: Memsstar Limited
Inventor： O'HARA, Anthony
IPC: C23C16/44
CPC classification number: B81C1/00952 , B81C1/0038 , B81C2201/112 , C23C16/44
Abstract: The present invention describes a deposition method suitable for depositing a coating on a device. The method is particularly suited for depositing a self assembled monolayer (SAM) coating on a micro electro-mechanical structures (MEMS). The method employs carrier gases in order to form a deposition vapour in a process chamber within which the device is located wherein the deposition vapour comprises controlled amounts of a vapour precursor material and a vapour reactant material. Employing the described technique avoids the problematic effects of particulate contamination of the device even when the volumetric ratio of the reactant material to the precursor material is significantly higher than those ratios previously employed in the art. The vapour precursor material can be of a type that provides the MEMS with an anti-stiction coating with the associated vapour reactant material comprising water.
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公开(公告)号：EP1781566B1
公开(公告)日：2012-03-14
申请号：EP05726508.4
申请日：2005-06-21
Applicant: ROBERT BOSCH GMBH
Inventor： LÄRMER, Franz , REICHENBACH, Ralf
CPC classification number: B81C1/0096 , B81B3/0005 , B81C2201/112 , B81C2201/117
Abstract: The invention relates to a method for depositing a nonstick coating onto the surface of micromechanical structures (5a; 7a) on a substrate (Sub), whereby the material or precursor material to be deposited is supplied to the structures (5a; 7a) in a solvent and transport medium. The solvent and transport medium used is a supercritical CO2 fluid. Deposition of the material or precursor material is brought about by a physical change of state of the CO2 fluid or by a surface reaction between the surface and the precursor material. The inventive method allows to coat the micromechanical structures (5a; 7a) in a cavern (14) or in a cavity after their encapsulation, whereby the material to be deposited is supplied via access channels (15) or perforation holes.
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公开(公告)号：EP1381523A1
公开(公告)日：2004-01-21
申请号：EP01975475.3
申请日：2001-09-25
Applicant: California Institute of Technology
Inventor： TAI, Yu Chong,California Institute of Technology , YAO, Tze-Jung,California Institute of Technology , YANG, Xing,California Institute of Technology
CPC classification number: B81B3/001 , B81C2201/112
Abstract: An anti stiction structure for cantilever formation technique. In one embodiment, the cantilever (130) includes downwardly extending plurality of legs (131 and 132) which preventing the substrate (100) from sticking to the cantilever. In another embodiment, the polymer cantilever (215) is prevented from sticking to the substrate (200) by at amortized stick layer (205) on the substrate and during the formation of the cantilever, the stick layer is removed later as a sacrificial layer.
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