Abstract:
A system includes a vessel floating on a body of water. The system also includes at least one conduit extending from the vessel to below the body of water. The system also includes a scanning device disposed within the at least one conduit. The scanning device includes at least one two-dimensional (2D) line scanner and a rotary encoder coupled to the at least one 2D line scanner. The scanning device is configured to generate three-dimensional (3D) image data of a surface of the at least one conduit or at least one component disposed within the at least one conduit.
Abstract:
An object inspection apparatus includes a terahertz wave supplying unit for generating a terahertz wave and moving a path of the terahertz wave according to time so that the terahertz wave is supplied to an object to be inspected, a focusing lens located between the terahertz wave supplying unit and the object to be inspected to focus the terahertz wave supplied by the terahertz wave supplying unit, a rotating plate having a plate shape and including a plurality of the focusing lenses with different distances from the center thereof, the rotating plate rotating in the circumferential direction so that one of the focusing lenses is located at a path of the terahertz wave according to the path movement of the terahertz wave, and a terahertz wave detecting unit for collecting and detecting a terahertz wave incident to the object to be inspected.
Abstract:
A defect inspection method includes: illuminating an area on surface of a specimen as a test object under a specified illumination condition; scanning a specimen to translate and rotate the specimen; detecting scattering lights to separate each of scattering lights scattered in different directions from the illuminated area on the specimen into pixels to be detected according to a scan direction at the scanning a specimen and a direction approximately orthogonal to the scan direction; and processing to perform an addition process on each of scattering lights that are detected at the step and scatter approximately in the same direction from approximately the same area of the specimen, determine presence or absence of a defect based on scattering light treated by the addition process, and compute a size of the determined defect using at least one of the scattering lights corresponding to the determined defect.
Abstract:
A laser scattering defect inspection system includes: a stage unit that rotates a workpiece W and transports the workpiece W in one direction; a laser light source that emits a laser beam LB toward the workpiece W mounted on the stage unit; an optical deflector that scans the laser beam LB emitted from the laser light source on the workpiece W; an optical detector that detects the laser beam LB scattered from the surface of the workpiece W; a storage unit that stores defect inspection conditions for each inspection step of a manufacturing process of the workpiece W, where the conditions include the rotation speed and the moving speed of the workpiece W by the stage unit, the scan width on the workpiece W and the scan frequency by the optical deflector; and a control unit that reads the defect inspection conditions stored for each inspection step in the storage unit and controls the driving of the stage unit and the optical deflector under the conditions.
Abstract:
A cylindrical mirror or lens is used to focus an input collimated beam of light onto a line on the surface to be inspected, where the line is substantially in the plane of incidence of the focused beam. An image of the beam is projected onto an array of charge-coupled devices parallel to the line for detecting anomalies and/or features of the surface, where the array is outside the plane of incidence of the focused beam. For inspecting surface with a pattern thereon, the light from the surface is first passed through a spatial filter before it is imaged onto the charge-coupled devices. The spatial filter includes stripes of scattering regions that shift in synchronism with relative motion between the beam and the surface to block Fourier components from the pattern. The spatial filter may be replaced by reflective strips that selectively reflects scattered radiation to the detector, where the reflective strips also shifts in synchronism with the relative motion.
Abstract:
A simple yet versatile noncontact optical inspection instrument and method are described for the inspection of magnetic disk surfaces for surface defects. This instrument is capable of inspecting the disk surface at any point in the disk manufacturing process. Surface defects such as bumps, pits and scratches can be measured. Surface contaminants such as particles and stains can also be measured. The instrument is also capable of discriminating between surface defects and surface contaminants. The instrument is comprised of two identical optical sensors which are located on opposite sides of the disk. A carriage supports and translates these sensors along the disk radius while a spindle rotates the disk. Both surfaces of the disk are therefore simultaneously scanned in a spiral fashion. The sensor's illumination optics produce a monochromatic focused spot of light which is normally incident upon the disk surface. The sensor uses two collection optics channels which simultaneously detect both the specular reflected light and the diffuse scattered light produced by the disk surface. Both the angle and power of the specular reflected light are measured, while just the power of the diffuse scattered light is measured. The output signals from the sensors are processed to estimate the size of the defects and to determine the type of defect.
Abstract:
An apparatus for scanning a laser beam to examine the surface of a semiconductor wafer comprises a stage onto which a semiconductor wafer is mounted and a laser beam scanning unit for repeatedly rectilinearly scanning a laser beam in a predetermined direction on the semiconductor wafer. This scanning apparatus further has a drive unit for rotating the semiconductor wafer and for moving the semiconductor wafer by only a predetermined distance in the predetermined direction every rotation of the wafer. The laser beam scanning unit rectilinearly scans the laser beam at a swing width of a predetermined amount.
Abstract:
The holding mechanism holds an object under inspection in a manner that the substantially entire surface of the object may relatively be scanned by a laser beam. A spherical integrating light collector has an opening disposed close to the inspected surface of the object held by the holding mechanism. A laser beam illuminating mechanism is coupled with the other end of the spherical integrating light collector, and illuminates the inspected surface of the object with the laser beam through the opening. A photo-electric converter receives the scattered light as is reflected by the inspected surface and collected by the spherical integrating light collector, and converts the scattered light into an electrical signal representing an amount of light. An analog to digital converter converts the electrical signal derived from the photo-electric converter into a digital signal. A peak detector receives the digital signal derived from the analog to digital converter to detect peak values at predetermined periods. A mean value calculator calculates a mean value using a digital signal output from the analog to digital converter. A reference value storing memory stores a reference value to determine defects present on the inspected surface of the object. A threshold level calculator calculates the threshold level using the reference value and the mean value. A defect detector compares peak values derived from the peak detector with the threshold level, and detects the surface defects on the basis of the result of the comparison.
Abstract:
A system includes a vessel floating on a body of water. The system also includes at least one conduit extending from the vessel to below the body of water. The system also includes a scanning device disposed within the at least one conduit. The scanning device includes at least one two-dimensional (2D) line scanner and a rotary encoder coupled to the at least one 2D line scanner. The scanning device is configured to generate three-dimensional (3D) image data of a surface of the at least one conduit or at least one component disposed within the at least one conduit.
Abstract:
In an foreign body detection apparatus, an optical signal detection unit irradiates a light spot onto a surface of an object to be inspected while scanning the surface by employing the light spot in a predetermined direction, and receives a reflected beam from the surface of the inspected object to generate a photodetection signal corresponding to the light intensity of the reflected beam. A foreign body detection unit generates a foreign body detection signal appearing with respect to a leader and a trailer in the scanning direction of a foreign body adhering to the inspected object from the photodetection signal. The foreign body detection signal is obtained, for example, as a difference signal between the photodetection signal and a delayed photodetection signal with a predetermined delay time. A foreign body discrimination unit generates a foreign body discriminating signal indicating a region in which the foreign body is present from the foreign body detection signal.