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    CHIP MODULE, MODULE AND METHOD FOR PRODUCING A MODULE, CHIP CARD
    31.
    发明申请
    CHIP MODULE, MODULE AND METHOD FOR PRODUCING A MODULE, CHIP CARD 审中-公开
    用于制造模块和芯片卡的芯片模块，模块和方法

    公开(公告)号：WO99005643A2

    公开(公告)日：1999-02-04

    申请号：PCT/DE1998/002097

    申请日：1998-07-25

    IPC: B42D15/10 ,  G06K19/07 ,  G06K19/077 ,  H05K3/30 ,  G06K19/00

    CPC classification number: G06K19/07747 ,  G06K19/07749 ,  G06K19/0775 ,  H05K3/308 ,  H05K2201/1059 ,  H05K2201/10689 ,  H05K2201/1078 ,  H05K2203/1446

    Abstract: The invention concerns a module, in particular designed to be used in chip cards, consisting of a chip module including an integrated switching circuit and a transmission module comprising at least a transmitting element for data and/or energy transmission between the integrated switching circuit and an external appliance or vice-versa. The chip module and the transmission module each have contact elements used for their mutual electrical connection, the chip module (3) contact elements (11) and the transmission module (2) contact elements (7) being assembled by blocking the mutually corresponding contact elements (7, 11).

    Abstract translation: 本发明涉及一种模块，特别是用于在芯片卡中使用，包括：芯片模块与集成电路和用于所述集成电路和外部设备，或反之亦然，其中间的数据和/或能量转移的至少一个传输元件的传输模块 芯片模块和所述发射模块的每个接触元件用于彼此电连接，其中，所述芯片模块（3）的一方面，接触元件（11）与所述接触元件（7）的发射模块（2）在另一通过夹紧（7，11）彼此连接的相互对应的接触元件的 是。

    Electronic component on-substrate mounting structure
    32.
    发明公开
    Electronic component on-substrate mounting structure 审中-公开
    Str at at at at at at at at at at at at at at at at at at at at at

    公开(公告)号：EP2467002A2

    公开(公告)日：2012-06-20

    申请号：EP11194069.8

    申请日：2011-12-16

    Applicant: Panasonic Electric Works Co., Ltd.

    Inventor： Kinugasa, Noriaki ,  Konishi, Jun ,  Ogawa, Masanori

    IPC: H05K3/30

    CPC classification number: H05K3/308 ,  H05K3/3447 ,  H05K2201/10651 ,  H05K2201/10757 ,  H05K2201/1078

    Abstract: [Object] An electronic component on-substrate mounting structure capable of mounting an electronic component having a round external shape on a substrate in a predetermined attitude and keeping an allowance of a lead to a predetermined value is provided.
    [Means for Settlement] A lead 12 of an electronic component 11 is inserted into a lead hole 31 of a substrate 30, thereby mounting the electronic component 11 on the substrate 30. The lead 12 includes a base part 16 extending from an electronic component main body 13, a support part 17 bent from the base part 16, abutting an electronic-component mount surface 30A of the substrate 30 at a predetermined length, and supporting the electronic component main body 13, and an insertion part 18 bent from the support part 17 and inserted into a lead hole 31 of the substrate 30.

    Abstract translation: 提供一种能够以预定姿势将具有圆形外形的电子部件安装在基板上并将导线保持在规定值的电子元件基板内安装结构。 [沉降装置]电子部件11的引线12插入到基板30的引线孔31中，从而将电子部件11安装在基板30上。引线12包括从电子部件主体 主体13，从基部16弯曲的支撑部17，以预定长度抵接基板30的电子部件安装面30A，支撑电子部件主体13，以及从支撑部弯曲的插入部18 并插入到基板30的引线孔31中。

    Transmitter-receiver unit that ensures mounting of cover
    35.
    发明公开
    Transmitter-receiver unit that ensures mounting of cover 有权
    收发机单元，以确保盖的安装在金属框架上

    公开(公告)号：EP1121006A2

    公开(公告)日：2001-08-01

    申请号：EP00311220.8

    申请日：2000-12-15

    Applicant: ALPS ELECTRIC CO., LTD.

    Inventor： Watanabe, Yoshikiyo, Alps Electric Co., Ltd.

    IPC: H05K3/34 ,  H05K9/00

    CPC classification number: H05K9/0032 ,  H05K3/341 ,  H05K3/3426 ,  H05K9/0035 ,  H05K2201/10371 ,  H05K2201/1078 ,  H05K2201/10787 ,  H05K2201/2018 ,  Y02P70/613

    Abstract: A transmitter-receiver unit is disclosed wherein a frame is provided with solder-rise preventing means (H) between a circuit board (1) and retaining portions (4c), thereby preventing solder from rising up to the retaining portions. Thus, the engagement between engaging holes and the retaining portions is ensured in comparison with the prior art. The transmitter-receiver unit permits a cover to be mounted positively to the frame and is suitable for the reduction of size and weight.

    Abstract translation: 发射器 - 接收器单元是游离缺失盘worin框架上设置有电路板之间焊接材料向上防止装置（H）（1）和保持部（4c）中，由此从上升到保持部分防止焊料。 因此，接合孔和所述保持部分之间的接合与现有技术相比得到保证。 另外，发送接收单元允许能可靠地安装到所述框架的罩，适合于尺寸和重量的减小。

    배터리 팩
    36.
    发明授权
    배터리 팩 失效
    电池组

    公开(公告)号：KR100965683B1

    公开(公告)日：2010-06-24

    申请号：KR1020080030050

    申请日：2008-03-31

    Applicant: 삼성에스디아이 주식회사

    Inventor： 박준영

    IPC: H01M2/10

    CPC classification number: H01M4/02 ,  H01M2/0404 ,  H01M2/1055 ,  H01M2/30 ,  H01M10/425 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10037 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10818 ,  H05K2201/10871

    Abstract: 본 발명은 배터리 팩에 관한 것으로, 보다 상세하게는 전지와 보호회로 기판을 전기적으로 연결시키는 탭에 의해 솔더의 흘러내림이 방지되어 신뢰성과 안전성 및 생산성이 향상되는 배터리 팩에 관한 것이다.
    그에 따른 배터리 팩은 복수 개가 배터리가 전기적으로 연결되며 양극과 음극을 가지는 멀티 셀; 멀티 셀과 전기적으로 연결되며, 일 면에 형성된 보호회로 기판; 비아홀에 삽입되는 삽입부와, 삽입부와 이어지며 삽입부에서 절곡되어 형성되는 절곡부로 구비하는 도전 탭; 및, 삽입부와 절곡부의 적어도 일부에 형성되는 솔더부로 이루어진다.
    도전 탭, 솔더부, 절곡, 비아홀, 보호회로

    Abstract translation: 本发明涉及涉及一种电池组，更具体地，是由焊片的流动，以电连接所述电池和所述保护电路板提高了可靠性和安全性和生产率防止下拉的电池组。

    배터리 팩
    37.
    发明公开
    배터리 팩 失效
    电池组

    公开(公告)号：KR1020090104584A

    公开(公告)日：2009-10-06

    申请号：KR1020080030050

    申请日：2008-03-31

    Applicant: 삼성에스디아이 주식회사

    Inventor： 박준영

    IPC: H01M2/10

    CPC classification number: H01M4/02 ,  H01M2/0404 ,  H01M2/1055 ,  H01M2/30 ,  H01M10/425 ,  H05K3/308 ,  H05K3/3447 ,  H05K2201/09854 ,  H05K2201/10037 ,  H05K2201/10757 ,  H05K2201/1078 ,  H05K2201/10818 ,  H05K2201/10871

    Abstract: PURPOSE: A battery pack is provided to shorten time required for producing a battery pack by preventing the warping of a tab when a tab electrically connected with a battery is soldered. CONSTITUTION: A battery pack includes a multi cell, a protection circuit board, a conductive tab, and a solder(400). The multi cell electrically connects plural batteries and has an anode and cathode. The protection circuit board is electrically connected to the multi cell. A via hole is formed on the protection circuit board. The conductive tab includes an insertion portion(311) and a bent portion(312). The insertion portion is inserted in the via hole. The bent portion connected to the insertion part and is bent from the insertion part. The solder is formed in at least part of the insertion portion and bent portion.

    Abstract translation: 目的：提供电池组，以便在与电池电连接的接头焊接时，通过防止突片翘曲来缩短生产电池组所需的时间。 构成：电池组包括多电池，保护电路板，导电片和焊料（400）。 多电池电连接多个电池并具有阳极和阴极。 保护电路板与多电池电连接。 在保护电路板上形成通孔。 导电片包括插入部分（311）和弯曲部分（312）。 插入部分插入通孔中。 弯曲部分连接到插入部分并且从插入部分弯曲。 焊料形成在插入部分和弯曲部分的至少一部分中。

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