Abstract:
PROBLEM TO BE SOLVED: To provide a plasma treatment device and a treatment method for preventing damages by plasma on conductive/semi-conductive treated surface or a conductive/semi-conductive treated thin film by efficiently applying a plasma treatment on the surface or the thin film in an atmospheric pressure. SOLUTION: The plasma formation device 2 is composed of a plasma generation part 4 with a gliding arc electrode pair 18 with a distance between the electrodes becoming larger toward a working gas moving direction and an emission port 20 emitting plasma to the plasma generation part 4, with a tip of the electrode pair 18 located inside the emission port 20. The working gas 14 above or near an atmospheric pressure is to be supplied between the electrodes by a working gas supply means and arc 4a generated between the electrodes at impression of voltage produces gliding arc moving toward a wider opening of the electrodes to form plasma. The plasma formation device 2 radiates this plasma from the emission port 20. COPYRIGHT: (C)2007,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To highly accurately control retightening in a squeezing process. SOLUTION: The squeeze type filter press comprises a tightening device provided with low pressure hydraulic units 12, 133 connected to a low pressure pump 14 for tightening filter plates in a frame closing process and filtration process, and high pressure hydraulic units 11, 123 connected to a high pressure pump 15 for tightening the filter plates in the filtration process and a squeezing process, a maximum hydraulic pressure set means 23 which sets the maximum hydraulic pressure of the tightening device in the filtration process and the squeezing process, a squeezing pressure detecting means 19 which detects a squeezing pressure in the squeezing process, and a control means which controls the maximum hydraulic pressure set in the squeezing process to a value higher than the maximum hydraulic pressure in the filtration process by computing the maximum hydraulic pressure based on the squeezing pressure detected by the squeezing pressure detecting means 19 by inputting it to the maximum hydraulic pressure set means 23. COPYRIGHT: (C)2005,JPO&NCIPI