公开(公告)号：US06846184B2

公开(公告)日：2005-01-25

申请号：US10350600

申请日：2003-01-24

Applicant: Zhineng Fan ,  Che-Yu Li

Inventor： Zhineng Fan ,  Che-Yu Li

IPC: H01R13/24 ,  H01R13/621 ,  H01R12/00

CPC classification number: H01R13/2421 ,  H01R13/621 ,  H01R2201/20

Abstract: An electrical contact having transmission-coil sections with at least two tightly wound turns. Active-coil sections are integral with, and positioned between the transmission-coil sections so as to provide electrical signal communication between the two transmission-coil sections, and spring characteristics. The transmission-coil sections are over coated with a conductive noble metal so as to fuse each of the tightly wound turns together to thereby provide for a shortened electrical transmission pathway through the electrical contact. An LGA interposer for providing data communication between a first and a second array of contact pads is also provided having a dielectric housing with an array of cavities; and a plurality of electrical contacts positioned within the cavities.

Abstract translation: 具有传输线圈部分的电接触件具有至少两个紧密缠绕的匝。 有源线圈部分与传输线圈部分成一体并位于传输线圈部分之间，以便提供两个传输线圈部分之间的电信号通信以及弹簧特性。 传输线圈部分涂覆有导电贵金属，以便将每个紧密缠绕的匝熔合在一起，从而提供通过电接触的缩短的电传输路径。 还提供了一种用于在第一和第二接触焊盘阵列之间提供数据通信的LGA插入器，其具有具有空腔阵列的绝缘壳体; 以及定位在空腔内的多个电触点。

公开(公告)号：US06723927B1

公开(公告)日：2004-04-20

申请号：US09866434

申请日：2001-05-29

Applicant: Zhineng Fan ,  Ai D. Le ,  Che-Yu Li

Inventor： Zhineng Fan ,  Ai D. Le ,  Che-Yu Li

IPC: H01R1204

CPC classification number: H01L23/49827 ,  H01L2924/0002 ,  H01R12/7082 ,  H05K1/112 ,  H05K3/325 ,  H05K3/3436 ,  H05K7/1061 ,  H05K2201/0314 ,  H05K2201/0394 ,  H05K2201/09845 ,  H05K2201/10378 ,  H01L2924/00

Abstract: An interposer provides a high reliability interface between an LGA connector and a motherboard. The interposer includes a stepped spacer for each solder interconnection which prevents the relaxation of mechanical contact force while ensuring the integrity of each solder interconnection. The interposer provides noble metal plated contact pads on a first surface to receive the contact members of an LGA connector, and contact pads for BGA solder connections for attachment to a motherboard. A description of the processes to manufacture the interposer is also disclosed.

Abstract translation: 插入器提供了LGA连接器和主板之间的高可靠性接口。 插入器包括用于每个焊料互连的阶梯式间隔物，其防止机械接触力的松弛，同时确保每个焊料互连的完整性。 插入器在第一表面上提供贵金属电镀的接触焊盘，以接收LGA连接器的接触构件，以及用于连接到母板的用于BGA焊接连接的接触焊盘。 还公开了制造插入件的过程的描述。

公开(公告)号：US06712620B1

公开(公告)日：2004-03-30

申请号：US10241945

申请日：2002-09-12

Applicant: Che-Yu Li ,  Zhineng Fan ,  Dirk D. Brown

Inventor： Che-Yu Li ,  Zhineng Fan ,  Dirk D. Brown

IPC: H01R1200

CPC classification number: H01R12/714 ,  H01R13/22 ,  H01R13/2414 ,  H01R24/562 ,  H01R2107/00 ,  Y10T29/49194 ,  Y10T29/49222 ,  Y10T29/49798

Abstract: A board-to-board connector system is provided that may be used with a flex circuit, interposer, or polymer housing that includes a plurality of contacts that are arranged in an array. Each of the plurality of contacts includes a resilient body. A first conductor is provided that includes at least one wire formed in a spiral extending continuously through the resilient body, and having electrically accessible first and second ends. The first conductor is electrically connected to at least one of a plurality of signal conductor traces on a printed wiring board or the like. A second conductor is provided that includes at least one wire formed in a spiral extending continuously through the resilient body, and having electrically accessible first and second ends. The first conductor and the second conductor are in spaced apart relation to one another, and the second conductor is electrically connected to at least one of the plurality of ground path conductors arranged on the printed wiring board.

Abstract translation: 提供了一种板对板连接器系统，其可以与包括布置在阵列中的多个触点的柔性电路，插入件或聚合物壳体一起使用。 多个触点中的每一个包括弹性体。 提供第一导体，其包括形成为螺旋的至少一个线，所述螺纹连续延伸穿过弹性体，并且具有可电接触的第一和第二端。 第一导体电连接到印刷线路板等上的多个信号导体迹线中的至少一个。 提供第二导体，其包括形成为螺旋的至少一个线，所述螺纹连续延伸穿过弹性体，并且具有可电接触的第一和第二端。 第一导体和第二导体彼此间隔开，并且第二导体电连接到布置在印刷线路板上的多个接地路径导体中的至少一个。

公开(公告)号：US06663399B2

公开(公告)日：2003-12-16

申请号：US10060749

申请日：2002-01-29

Applicant: Hassan O. Ali ,  Che-Yu Li ,  Zhineng Fan ,  Ai D. Le

Inventor： Hassan O. Ali ,  Che-Yu Li ,  Zhineng Fan ,  Ai D. Le

IPC: H01R1200

CPC classification number: H05K7/1061 ,  H01R12/52 ,  H05K3/321 ,  H05K3/3436 ,  H05K2201/10378 ,  H05K2201/10992 ,  H05K2203/041 ,  Y02P70/613

Abstract: The present invention is a cost effective, reworkable, LGA-based interconnection for use between two circuit members such as a ceramic module and an FR4-based system board. The resilient contact members allow the reliable interconnection of two circuit members, even though the circuit members may have significantly different CTEs and have interconnections where the distance from neutral point is great enough to crack BGA or CGA solder connections. For factory reworkable applications, the ends of the contact members are semi-permanently attached to both the module and the system board. For certain field separable applications, semi-permanently attaching only one of the ends of an LGA to either the module or the system board provides increased reliability.

Abstract translation: 本发明是一种成本有效的，可再加工的基于LGA的互连，用于两个电路部件之间，例如陶瓷模块和基于FR4的系统板。 弹性接触构件允许两个电路构件的可靠互连，即使电路构件可能具有显着不同的CTE，并且具有互连，其中与中性点的距离足够大以破坏BGA或CGA焊料连接。 对于工厂可重复使用的应用，接触件的端部半永久性地连接在模块和系统板上。 对于某些现场可分离应用，半永久性将LGA的一端仅连接到模块或系统板，可提供更高的可靠性。

公开(公告)号：US06480014B1

公开(公告)日：2002-11-12

申请号：US09781089

申请日：2001-01-12

Applicant: Che-yu Li ,  Thomas L. Sly ,  Weimin Shi

Inventor： Che-yu Li ,  Thomas L. Sly ,  Weimin Shi

IPC: G01R3102

CPC classification number: G11C5/143 ,  G11C5/00 ,  H05K1/0203 ,  H05K1/141 ,  H05K3/3447 ,  H05K3/366 ,  H05K2201/045 ,  H05K2201/066 ,  H05K2201/09709 ,  Y10T29/49004

Abstract: The present invention features an ultra high density, three-dimensional electronic circuit package suitable for constructing high capacity, high speed computer memory cards and the like. A demountable contact system allows easy test and/or burn-in. A memory card has a number of electrical receptacles adapted to receive a daughter card. The daughter card has memory devices attached to it and a corresponding number of electrical connectors placed along at least one edge, adapted to detachably mate with the electrical receptacles of the memory card. The demountable connectors allow easy rework of the module before optional, permanent solder attach. Bare dies or thin packages are mounted onto daughter cards, which in turn are mounted onto either a motherboard or memory card using pin/hole technology.

Abstract translation: 本发明具有适用于构造高容量，高速计算机存储卡等的超高密度三维电子电路封装。 可拆卸的触点系统允许轻松测试和/或老化。 存储卡具有适于接收子卡的许多电插座。 子卡具有连接到其上的存储器件和沿着至少一个边缘放置的相应数量的电连接器，其适于可拆卸地与存储卡的电插座配合。 可拆卸的连接器允许在可选的永久焊接附着之前轻松地返修模块。 子卡上安装裸芯片或薄封装，子卡再次使用针/孔技术安装在主板或存储卡上。

公开(公告)号：US06312266B1

公开(公告)日：2001-11-06

申请号：US09645860

申请日：2000-08-24

Applicant: Zhineng Fan ,  Ai D. Le ,  Che-Yu Li

Inventor： Zhineng Fan ,  Ai D. Le ,  Che-Yu Li

IPC: H01R458

CPC classification number: H01R12/7005 ,  H01R13/2414 ,  Y10T29/4921

Abstract: The present invention provides a carrier that provides improved retention to the individual contact elements resulting in LGA interposer connectors with improved manufacturability, reliability and more uniform mechanical and electrical performance. In one embodiment, the carrier, which includes upper and lower sections of dielectric material with an adhesive layer in between, includes a plurality of openings, each of which may contain an individual contact element. During assembly of the connector, once the contact elements are inserted, the adhesive layer is reflowed, thereby allowing the carrier to capture the location of the contact elements both with respect to each other as well as to the carrier. Alternately, the carrier may be implemented in a fashion that, while not including an adhesive layer to be reflowed, still provides improved retention of the individual contact elements. These embodiments may by easier to assemble, and less expensive to manufacture, especially in high volumes. Description of the processes to assemble the carrier and overall connector are also disclosed.

Abstract translation: 本发明提供一种载体，其提供改进的保持性，从而导致具有改进的可制造性，可靠性和更均匀的机械和电气性能的LGA插入器连接器。 在一个实施例中，包括介电材料的上部和下部在其间具有粘合剂层的载体包括多个开口，每个开口可以包含单独的接触元件。 在连接器的组装期间，一旦接触元件被插入，粘合剂层被回流，从而允许载体相对于彼此以及对载体捕获接触元件的位置。 或者，载体可以以不包括要回流的粘合剂层的方式实现，仍然提供改进的各个接触元件的保持性。 这些实施例可以更容易组装，并且制造成本更低，特别是在大体积中。 还公开了组装载体和整体连接器的过程的描述。

公开(公告)号：US5563470A

公开(公告)日：1996-10-08

申请号：US297958

申请日：1994-08-31

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: G09F9/33 ,  H01J9/18 ,  H01J29/02 ,  H01J29/92 ,  H01J31/12 ,  H01L27/32 ,  H01J1/62

CPC classification number: H01J9/185 ,  G09F9/33 ,  H01J29/028 ,  H01J29/92 ,  H01J31/125 ,  H01J2201/304 ,  H01J2329/863 ,  H01L27/3293 ,  Y10T156/1092 ,  Y10T29/49002

Abstract: A panel display includes a common substrate on which a plurality of small display tiles are mounted in an array and electrically interconnected to replicate a large area panel. Each tile includes a plurality of contact pads which are aligned with corresponding contact pads on the substrate. Solder joints between corresponding contact pads mechanically align and secure the tiles on the substrate, and provide electrical connections therebetween. Selected substrate contact pads are electrically interconnected to provide electrical connections between adjacent tiles.

Abstract translation: 面板显示器包括公共基板，多个小显示瓦片安装在阵列上并电互连以复制大面板。 每个瓦片包括与衬底上的相应接触焊盘对准的多个接触焊盘。 相应接触垫之间的焊接接头将衬垫上的瓷砖机械地对准和固定，并在其间提供电连接。 所选择的衬底接触垫电互连以提供相邻瓷砖之间的电连接。

公开(公告)号：US08093970B2

公开(公告)日：2012-01-10

申请号：US12249535

申请日：2008-10-10

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01H51/22

CPC classification number: H01H50/005 ,  H01H1/5822 ,  H01H2001/0042 ,  H01H2050/007

Abstract: A relay including a coil or solenoid, at least one fixed substrate and a moving substrate, a plurality of braided electrical contact element contacts making contact with pads on the fixed and moving substrates, returning springs mounted on alignment pins, and an optional cover for hermetical sealing. A further embodiment presents a horizontally-moving armature actuated by one or more solenoids.

Abstract translation: 包括线圈或螺线管的继电器，至少一个固定基板和移动基板，多个编织的电接触元件触头，与固定和移动的基板上的焊盘接触，安装在对准引脚上的复位弹簧和用于密封的可选盖 密封。 另一实施例呈现由一个或多个螺线管致动的水平移动的衔铁。

公开(公告)号：US20090096560A1

公开(公告)日：2009-04-16

申请号：US12249535

申请日：2008-10-10

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01H3/00

CPC classification number: H01H50/005 ,  H01H1/5822 ,  H01H2001/0042 ,  H01H2050/007

Abstract: A relay including a coil or solenoid, at least one fixed substrate and a moving substrate, a plurality of braided electrical contact element contacts making contact with pads on the fixed and moving substrates, returning springs mounted on alignment pins, and an optional cover for hermetical sealing. A further embodiment presents a horizontally-moving armature actuated by one or more solenoids.

Abstract translation: 包括线圈或螺线管的继电器，至少一个固定基板和移动基板，多个编织的电接触元件触头，与固定和移动的基板上的焊盘接触，安装在对准引脚上的复位弹簧和用于密封的可选盖 密封。 另一实施例呈现由一个或多个螺线管致动的水平移动的衔铁。

公开(公告)号：US07293995B2

公开(公告)日：2007-11-13

申请号：US11334993

申请日：2006-01-18

Applicant: Che-Yu Li

Inventor： Che-Yu Li

IPC: H01R12/00

CPC classification number: H01R13/2435 ,  H01R13/03

Abstract: An electrical contact formed from a compliant folded sheet that includes a top surface, a bottom surface, a first contact edge and a second contact edge. A plurality of corrugations are formed in the top surface and the bottom surface that terminate at the first contact edge and the second contact edge. A connector system having a housing that has a plurality of through openings. A plurality of electrical contacts, each being formed from a compliant folded sheet that includes a top surface, a bottom surface, a first contact edge and a second contact edge. A plurality of corrugations are formed in the top surface and the bottom surface that terminate at the first contact edge and the second contact edge. Each of the electrical contacts is arranged within a corresponding one of the plurality of through openings such that the first contact edge is positioned outside of the through-opening in which electrical contact is positioned, and the second contact edge is positioned outside of the through-opening in which electrical contact is positioned, but spaced from the first contact edge.