Abstract:
The present invention provides a micromechanical or microoptomechanical structure. The structure is produced by a process comprising defining a structure on a single crystal silicon layer separated by an insulator layer from a substrate layer; depositing and etching a polysilicon layer on the single crystal silicon layer, with remaining polysilcon forming mechanical or optical elements of the structure; exposing a selected area of the single crystal silicon layer; and releasing the formed structure.
Abstract:
The present application discloses a micro-opto-electromechanical apparatus comprising a silicon wafer comprising a plurality of layers, a reflector formed in one of the plurality of layers, and a pattern on the reflector to focus or collimate an incident beam of radiation into a reflected beam.