公开(公告)号：WO2017014981A1

公开(公告)日：2017-01-26

申请号：PCT/US2016/041791

申请日：2016-07-11

Applicant: SANMINA CORPORATION

Inventor： NEWBERRY, Robert, Steven

IPC: A61B5/00 ,  A61B5/145 ,  A61B5/1455 ,  A61B5/1459 ,  A61B5/1464

CPC classification number: A61B5/14532 ,  A61B5/0022 ,  A61B5/1455 ,  A61B5/6817 ,  A61B5/6826 ,  A61B5/743 ,  A61B2560/0223 ,  G06F19/00 ,  G16H40/67

Abstract: A glucose biosensor includes a plurality of optical fibers configured for placement within the ear canal. A first optical fiber emits light into the ear canal. A plurality of other optical fibers capture and transmit the reflected light back to the glucose biosensor. A plurality of photodetectors are configured in the glucose biosensor to detect the reflected light from the plurality of optical fibers. The glucose biosensor processes the detected light from each photodetector to determine a glucose level measurement. In an embodiment, the glucose biosensor also includes a wireless interface to transmit the glucose level measurements to a glucose meter and/or a gateway.

Abstract translation: 葡萄糖生物传感器包括配置用于放置在耳道内的多个光纤。 第一根光纤将光线射入耳道。 多个其它光纤捕获并将反射光传输回葡萄糖生物传感器。 多个光电检测器配置在葡萄糖生物传感器中以检测来自多根光纤的反射光。 葡萄糖生物传感器处理来自每个光电检测器的检测光以确定葡萄糖水平测量。 在一个实施方案中，葡萄糖生物传感器还包括将葡萄糖水平测量值传输到葡萄糖计和/或网关的无线接口。

公开(公告)号：WO2016106428A1

公开(公告)日：2016-06-30

申请号：PCT/US2015/067736

申请日：2015-12-28

Applicant: SANMINA CORPORATION

Inventor： IKETANI, Shinichi ,  KERSTEN, Dale

IPC: H05K3/40 ,  H05K1/11

CPC classification number: H05K3/429 ,  H05K3/0035 ,  H05K3/0047 ,  H05K3/0094 ,  H05K3/421 ,  H05K2203/0207 ,  H05K2203/0713 ,  H05K2203/1476

Abstract: A method for forming a hole plug in a laminate structure is provided. A laminate structure, is formed, including at least a dielectric layer and a first conductive foil on a first side of the dielectric layer. An unpierced or blind hole is formed in the laminate structure extending toward the first conductive foil from a second side of the dielectric layer and at least partially through the dielectric layer, the hole having a hole depth to hole diameter aspect ratio of less than ten (10) to one (1). In yet another example, the hole aspect ratio may be less than one (1) to one (1). Via fill ink may then be deposited in the hole. The via fill ink is then dried and/or cured to form a hole plug.

Abstract translation: 提供了一种形成层压结构中的孔塞的方法。 形成层压体结构，在电介质层的第一侧上至少包括介电层和第一导电箔。 在层叠结构中形成未钝化或盲孔，从电介质层的第二侧朝向第一导电箔延伸，并且至少部分地穿过电介质层，孔的孔深孔直径纵横比小于10（ 10）到一（1）。 在另一个例子中，孔长宽比可以小于一（1）至1（1）。 然后，通过填充油墨可以沉积在孔中。 然后将通孔填充油墨干燥和/或固化以形成孔塞。

公开(公告)号：WO2015112758A1

公开(公告)日：2015-07-30

申请号：PCT/US2015/012523

申请日：2015-01-22

Applicant: SANMINA CORPORATION

Inventor： THOMAS, Douglas, Ward ,  IKETANI, Shinichi ,  KERSTEN, Dale

IPC: H05K3/40 ,  H05K3/42

CPC classification number: H05K3/429 ,  H05K1/0216 ,  H05K3/24 ,  H05K2201/09845 ,  H05K2203/0207 ,  H05K2203/0242 ,  H05K2203/072 ,  H05K2203/0723

Abstract: The present invention relates to printed circuit boards (PCBs), and more particularly, to methods of forming high aspect ratio through holes and high precision stub removal in a printed circuit board (PCB). The high precision stub removal processes may be utilized in removing long stubs and short stubs. In the methods, multiple holes of varying diameter and depth are drilled from an upper and/or lower surface of the printed circuit board utilizing drills of different diameters.

Abstract translation: 印刷电路板（PCB）技术领域本发明涉及印刷电路板（PCB），更具体地涉及在印刷电路板（PCB）中形成高纵横比通孔和高精度短截线的方法。 高精度残留物去除过程可用于去除长桩和短桩。 在该方法中，使用不同直径的钻头从印刷电路板的上表面和/或下表面钻出不同直径和深度的多个孔。

公开(公告)号：WO2015095401A1

公开(公告)日：2015-06-25

申请号：PCT/US2014/070966

申请日：2014-12-17

Applicant: SANMINA CORPORATION

Inventor： IKETANI, Shinichi ,  KERSTEN, Dale

IPC: H05K3/46

CPC classification number: H05K3/429 ,  H05K2201/09645 ,  H05K2203/0713 ,  Y10T29/49165

Abstract: Novel methods for forming a printed circuit board (PCB) having one or more segmented vias are provided, including improved methods of removing the catalyst after the plating process when forming a segmented via in the PCB. After the electroless plating, excess catalyst on the surface of the plating resist is removed using a catalyst remover, such as an acidic solution that includes at least nitrite or nitrite ion and halogen ion, or the catalyst remover may be an etchant for plating resist, such as alkaline permanganate compound solution or plasma gas comprising at least one of oxygen, nitrogen, argon and tetrafluoromethane, or a mixture of at least two of these gasses. After removal of the excess catalyst, electrolytic plating is then applied to the through holes and the outer layer circuit or signal traces are formed. That is, the etching of paths on the conductive foils/layers of the core structure.

Abstract translation: 提供了一种用于形成具有一个或多个分段通孔的印刷电路板（PCB）的新方法，包括在电镀工艺之后形成分段通孔在PCB中去除催化剂的改进方法。 在化学镀后，使用催化剂去除剂，例如至少包括亚硝酸根或亚硝酸根离子和卤素离子的酸性溶液除去电镀抗蚀剂表面上的过量催化剂，或者催化剂去除剂可以是电镀抗蚀剂的蚀刻剂， 例如包括氧，氮，氩和四氟甲烷中的至少一种的碱金属高锰酸盐化合物溶液或等离子体气体，或这些气体中的至少两种的混合物。 除去过量的催化剂后，对通孔施加电解电镀，形成外层电路或信号迹线。 也就是说，蚀刻在芯结构的导电箔/层上的路径。

公开(公告)号：WO2014137359A1

公开(公告)日：2014-09-12

申请号：PCT/US2013/030336

申请日：2013-03-12

Applicant: SANMINA CORPORATION

Inventor： DENSBERGER, Shaun ,  MAY, Darren ,  GOMMELS, Glen ,  PRYOR, Eric

IPC: A47B96/04 ,  A47B96/14

CPC classification number: F16B12/50 ,  F16B12/46

Abstract: A structural bracket, for use with flat pack frames, formed from a single flat sheet of metal that is constructed without the use of welding points so as to simplify the manufacturing process is provided. The flat sheet of metal may have a generally triangular configuration that includes notches at strategic locations in the sheet of metal to create flaps that may be folded over to form the sidewalls of the brackets. The sidewalls of the brackets may be used to secure vertical and/or horizontal rails together when assembling a flat pack equipment rack. Additionally, a pair of structural brackets may be secured together by fasteners forming a single bisected structural bracket. The utilization two separate brackets to form a single bisected structural bracket provides for a flat pack solution for equipment racks while being as structurally strong as a traditional, fully welded frame.

Abstract translation: 提供了一种用于扁平包装框架的结构支架，其由不使用焊接点构造的单个平板金属板形成，以简化制造过程。 平板金属可以具有大致三角形的构造，其包括在金属板中的战略位置处的凹口，以产生可以折叠以形成托架的侧壁的折板。 当组装平板包装设备架时，支架的侧壁可用于将垂直和/或水平导轨固定在一起。 此外，一对结构支架可以通过形成单个二等分结构支架的紧固件固定在一起。 利用两个单独的支架形成一个双等分结构支架，为设备支架提供平板包装解决方案，同时结构坚固，像传统的完全焊接的框架。

公开(公告)号：US11765827B2

公开(公告)日：2023-09-19

申请号：US16883671

申请日：2020-05-26

Applicant: Sanmina Corporation

Inventor： Shinichi Iketani ,  Dale Kersten ,  George Dudnikov, Jr.

IPC: H05K1/11 ,  H05K1/03 ,  H05K3/42

CPC classification number: H05K1/115 ,  H05K1/036 ,  H05K3/42 ,  H05K1/11 ,  H05K3/429 ,  H05K2201/0187 ,  H05K2201/096 ,  H05K2201/09645 ,  H05K2203/0713 ,  H05K2203/0723

Abstract: A multilayer printed circuit board is provided having a first dielectric layer and a first plating resist selectively positioned in the first dielectric layer. A second plating resist may be selectively positioned in the first dielectric layer or a second dielectric layer, the second plating resist separate from the first plating resist. A through hole extends through the first dielectric layer, the first plating resist, and the second plating resist. An interior surface of the through hole is plated with a conductive material except along a length between the first plating resist and the second plating resist. This forms a partitioned plated through hole having a first via segment electrically isolated from a second via segment.

公开(公告)号：US20230234702A1

公开(公告)日：2023-07-27

申请号：US17581565

申请日：2022-01-21

Applicant: Sanmina Corporation

Inventor： Gene Lee Watterson, III

IPC: B64C27/48 ,  B64F5/10

CPC classification number: B64C27/48 ,  B64F5/10 ,  B64C27/50

Abstract: Aircraft and propeller assemblies may include a propeller adapter with a plurality of propeller blades coupled to the propeller adapter in a common plane. At least one propeller blade of the plurality of propeller blades may be pivotably coupled to the propeller adapter to pivot within the common plane. A spring may be coupled between a portion of the propeller adapter and a portion of the at least one propeller blade pivotably coupled to the propeller adapter. Other aspects, embodiments, and features are also included.

公开(公告)号：US11546992B2

公开(公告)日：2023-01-03

申请号：US16057580

申请日：2018-08-07

Applicant: Sanmina Corporation

Inventor： Charles C. Hill ,  Franz Michael Schuette

IPC: H05K1/18 ,  H05K3/36 ,  H05K1/14 ,  H05K3/30 ,  G06F13/40

Abstract: One feature pertains to a modular design of a motherboard for a computer system. The mother board is disaggregated into a CPU board and an IO board. The CPU board contains at least one CPU, the associated memory subsystem and the voltage regulator module. The integrated IO ports escape to a high speed connector mating with its counterpart on an IO board which contains all peripheral devices including system logic not part of the CPU. In a multi-socket configuration the CPUs are on the CPU board and the processor interconnects are routed directly in a point to point manner.

公开(公告)号：US20210347475A1

公开(公告)日：2021-11-11

申请号：US17182111

申请日：2021-02-22

Applicant: Sanmina Corporation

Inventor： Max Edward Klein

IPC: B64C39/02 ,  F41B11/80 ,  F41H11/02 ,  F41H13/00 ,  G05D1/00 ,  F41H11/04 ,  G05D1/12 ,  B64D1/02

Abstract: Unmanned aerial vehicle (UAV) capture devices and methods of operation are disclosed. A UAV capture device may include a netting system including a net launch device and a net, a propulsion system including a plurality of propellers coupled to one or more motors, a positioning system, a camera system, and a processing system coupled to the netting system, the propulsion system, the positioning system, and the camera system. The processing system may include logic to operate the propulsion system to autonomously navigate to a general location of a target UAV, to operate the propulsion system to pursue the target UAV, to deploy the netting system to propel the net at the target UAV, and to confirm if the target UAV is captured in the net. Other aspects, embodiments, and features are also included.

公开(公告)号：US20210177359A1

公开(公告)日：2021-06-17

申请号：US17190238

申请日：2021-03-02

Applicant: SANMINA CORPORATION

Inventor： Robert Steven Newberry

IPC: A61B5/00 ,  A61B5/024 ,  A61B5/1455 ,  A61B5/145

Abstract: A biosensor obtains at least a first photoplethysmography (PPG) signal at a first wavelength from a user and a second PPG signal obtained at a second wavelength from the user. The biosensor determines a first R value of the user using the first PPG signal and the second PPG signal and compares the first R value of the user to a normal range of R values for a blood type of the user. The biosensor determines a color of blood of the user using the first, second or another PPG signal and determines an abnormal condition that affects red blood cells of the user in response to the color of the blood and/or in response to the comparison or the first R value of the user to a normal range of R values for a blood type of the user.